JPS58215060A - 厚膜集積回路基板 - Google Patents

厚膜集積回路基板

Info

Publication number
JPS58215060A
JPS58215060A JP57097633A JP9763382A JPS58215060A JP S58215060 A JPS58215060 A JP S58215060A JP 57097633 A JP57097633 A JP 57097633A JP 9763382 A JP9763382 A JP 9763382A JP S58215060 A JPS58215060 A JP S58215060A
Authority
JP
Japan
Prior art keywords
lead
thick film
integrated circuit
film integrated
unnecessary
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57097633A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6244858B2 (enrdf_load_stackoverflow
Inventor
Kazuo Yoshikawa
和男 吉川
Hiromi Isomae
磯前　博巳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP57097633A priority Critical patent/JPS58215060A/ja
Publication of JPS58215060A publication Critical patent/JPS58215060A/ja
Publication of JPS6244858B2 publication Critical patent/JPS6244858B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3405—Edge mounted components, e.g. terminals

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP57097633A 1982-06-09 1982-06-09 厚膜集積回路基板 Granted JPS58215060A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57097633A JPS58215060A (ja) 1982-06-09 1982-06-09 厚膜集積回路基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57097633A JPS58215060A (ja) 1982-06-09 1982-06-09 厚膜集積回路基板

Publications (2)

Publication Number Publication Date
JPS58215060A true JPS58215060A (ja) 1983-12-14
JPS6244858B2 JPS6244858B2 (enrdf_load_stackoverflow) 1987-09-22

Family

ID=14197554

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57097633A Granted JPS58215060A (ja) 1982-06-09 1982-06-09 厚膜集積回路基板

Country Status (1)

Country Link
JP (1) JPS58215060A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6247155A (ja) * 1985-08-26 1987-02-28 Rohm Co Ltd 基板へのリ−ド取り付け方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6247155A (ja) * 1985-08-26 1987-02-28 Rohm Co Ltd 基板へのリ−ド取り付け方法

Also Published As

Publication number Publication date
JPS6244858B2 (enrdf_load_stackoverflow) 1987-09-22

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