JPS58215060A - Substrate of thick film integrated circuit - Google Patents

Abstract

PURPOSE:To contrive to shorten the working time by a method wherein a mark is given at the position corresponding to a lead unnecessary for connection to the substrate of a thick film IC circuit and thus unnecessary soldering repairing working is removed. CONSTITUTION:The marking of a window blank part 10a is provided at the position uncovered with a clip system lead 6b in the neighborhood of the lead terminal electrode elimination part 4 of the substrate of the thick film IC circuit which is printed and calcined as conventional, and then the substrate is manufactured by the printing and calcination of the soldering resist 5a by chromatic glas or resin. Next, leads 6a and 6b in an integral body with a frame 7 are inserted and soldered, the lead terminal electrode 2a and the lead 6a are connected each other, parts X-X' are cut off, and then the unnecessary lead 6b in the neighborhood of the mark 10a is removed. This constitution facilitates the discrimination of the lead unnecessary for solder connection and enables to prevent performing the unnecessary soldering repairing working to the unnecessary lead, and therefore the cost is reduced.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a thick film integrated circuit board in which marking is applied to indicate that an IJ-de terminal electrode has been removed.

FIG. 1 shows a plan view of a case where a thick film integrated circuit is formed on one side of an insulating substrate using a conventional technique.

When manufacturing such a thick film integrated circuit board, first, a resistor (not shown) and a solder resist 5α are sequentially printed on one side of the insulating substrate 10 to form a lead terminal electrode 2α integrated with the wiring conductor 5α. , after forming the frame by firing, the frame part 7
Insert the clip-type leads 6α, 6b, which are integrated into the board, into the board end 8 of the board, and connect the lead terminal electrodes 2α by soldering.
and connect lead 6α.

Clip-type lead 6α is used for connection here.

6h generally has an integral structure with the frame part 7, and the lead pitch is continuous at a constant interval, and the lead terminal electrodes 21Z of the thick film integrated circuit board are arranged in accordance with the lead pitch. Normal.

However, in the prior art described above (-1, lead terminal electrode 2a
However, if it is unnecessary for the electric circuit, that is, if the resistor, wiring conductor 5α, etc. are not connected (/c is the lead terminal electrode deletion part 4/'), leave a blank space and insert the lead terminal After connecting 2α and lead 6α by soldering, connect VC
, XX' portion is cut. Further, the unnecessary leads 66 inserted into the lead terminal removal portions 4 are removed to form a thick film integrated circuit board.

Next, FIG. 2 (7tJ) shows a plan view of the surface of a thick film integrated circuit board formed on both the front and back sides of a conventional insulating substrate 10.
A plan view of the back side is shown in FIG. 2(B), which is a symmetrical view with the frame portion 7 as the base point.

FIG. 3 is a sectional view of the main part thereof.

In the figure, the same symbols as in Figure 1 represent the same parts, 2h is the lead terminal electrode on the 7th side, 2C front is the lead terminal Kt on the back side, 5A is the wiring conductor on the front side, 5C is the wiring conductor on the back side, 5h♂ Solder resist on the front side, 5C is the solder resist on the back side, 6C, 6t are the front side of the lead, 6d
, 6f is the back side of the lead, and 9 is solder.

As can be easily inferred from FIGS. 2(A), (B), and FIG. 4, in this case, 1 front and back solder resists (5b) and 5C (back solder resists) were printed and fired in order. Later, clip-on leads 6v, 6tL, 6g
, 6f into the board end 8, and solder 9 to the lead surface 6 together with the front surface lead terminal electrode 2b and the back surface lead terminal electrode 2.
ξ, connect the back side of the lead 6f.

Subsequently, the frame portion 7 is formed by cutting off from the X-x' portion.

Here, the single-sided formation shown in FIG. 1 described above, and FIG.
CB) and the double-sided type shown in FIG. 3, after soldering is completed, the incomplete soldering is usually repaired using a soldering iron or the like. At that time, solder the glue 6h in the case of single-sided formation, the lead surface 6e in the case of double-sided formation, and the lead back side 6d inserted in the lead terminal electrode deletion s4 to the lead that does not require repair. It has the disadvantage that it is easy to perform unnecessary work such as supplementary e. This is because the solder 9 is silver-colored, the leads are also silver-colored due to Sn plating, etc., and the lead terminal electrodes are also made of p(
This is due to the silver color of the t-AV, making it difficult to determine whether soldering is necessary for repair or not.

The purpose of the present invention is to eliminate the disadvantages of the conventional temporary surgery mentioned above, and to remove the clips from the parts where the solder is insufficient and to remove the clips from the parts where the lead terminal electrodes are removed. To provide a thick film integrated circuit board capable of reducing the manufacturing time by eliminating unnecessary soldering and repair work caused by misidentification of lead-1.

The disadvantage of the present invention is that it is urgently necessary to repair the soldering of the leads on the thick film integrated circuit board where the two poles of the lead terminals, which are unreasonable in terms of the electrical circuit, are removed. In recent years, there has been a recent lawsuit regarding the removal of lead wire electrodes, and the use of colored solder resist, resistor, etc. markings in the positions covered by the leads to allow fj to be distinguished.

Among the embodiments of the present invention, a plan view of a thick film integrated circuit board formed on one side of an insulating substrate is shown in FIG.

In the figure, the same reference numerals as in FIG. 1 represent the same parts, and 10α is a window-like blank part of the solder resist) 54I.

When manufacturing the thick film integrated circuit board shown in FIG. 4, the parts up to the resistor (not shown) are sequentially printed and fired in the same way as in the prior art shown in FIG. A marking is provided by a window-like blank portion 10α at a position that is large and not shaded by the clip-type lead 6h, and is formed by printing and baking a solder resist 5α made of chromatic glass or resin. Next, the lead 6 which is integrated with the frame part 7
Insert α, 6h and solder to lead terminal type @2.
α and lead 6α% 421. After that, the frame portion 7 is removed by cutting the section xx', and the unnecessary lead 6b is removed from the electrical circuit in the vicinity of the window-like blank portion 10α marked.

Next, FIG. 5(A) shows a plan view of the front surface of a thick film integrated circuit board formed on both surfaces of an insulating substrate according to the present invention, and FIG. 5(B) shows a plan view of the back surface. It is assumed to be a symmetrical diagram with 7 as the base point. FIG. 6 is a sectional view of the main part thereof.

In the figure, the same symbols as in Figures 2 (m, CB) and 3 represent the same parts, and iDA is the surface solder resin r.
5b is a window-like blank part of the +Oc backside solder resist.

Figure 5 (6), (phrase) When manufacturing the thick film integrated circuit board shown in Figure 6, up to the resistor (not shown),
After sequentially printing and baking in the same manner as in the prior art shown in FIG. 5, a window-like blank area is provided at the same position as in FIG. 4. A surface solder resist 5 made of colored glass or resin is prepared.
h, At solder resist 5C is printed and baked to form a format.

Next'(, leads 6C, 6d integrally constructed with frame part 7,
66.6f into the board end 8 and connect the solder 9, the front lead terminal electrode 2b, the back lead terminal electrode 2c, and the lead surface 6C1+) - back side 6f.
Cut off the ¥, X-X' part to form it.

Next, an applied embodiment of the present invention is shown in the plan view of FIG. In the figure, 10d is a land pattern formed in an island shape using chromatic raw liver resist or black resistor.
This corresponds to the window-like blank parts 10α10b, 101- in the figure.

According to the present invention described above, the lead and solder from which the window-like blank part of the chromatic solder resist, the land pattern, or the land pattern of the black resistor should be removed are shaded by the lead in the vicinity of the lead that does not require connection. By providing the marking in a position that is not covered, it becomes easy to identify the lead that should be removed or the lead that does not need to be connected by soldering.

Therefore, according to the present invention, soldering is performed during repair.

Soldering can prevent unnecessary work such as repairing unnecessary leads.

The work time required to manufacture thick film integrated circuit boards is shortened and manufacturing costs are reduced.

[Brief explanation of drawings]

FIG. 1 is a plan view of a single-sided thick film integrated circuit board according to the prior art, and FIGS. 4 is a plan view of a single-sided thick film integrated circuit board according to the present invention, FIGS. 5 and 6 are a plan view and a cross-sectional view of essential parts of a double-sided thick film integrated circuit board according to the present invention, The figure is a plan view of another embodiment according to the invention. 4...Lead terminal electrode removed part, 5α, 5A, 5C...Solder resist, 10α,
+Oh, 10C...window-like blank area. +od...land pattern. Representative Patent Attorney Susuki 1) Tori, Yuki, 1 O) Prisoner O 2 Figure 3Q

Claims (1)

[Claims] 1. In a thick film integrated circuit board in which a clip-type lead is inserted into the end of the board and leads necessary for the electrical circuit are connected to form a thick film integrated circuit device, the electrical circuit of the board is A thick film integrated circuit board characterized in that markings are applied to positions corresponding to unnecessary leads for upper connection. 2. A thick film integrated circuit board in which electrodes and resistors are printed on one or both sides of an insulating substrate, and then a colored glass or resin solder resist is printed, and leads are formed on the periphery of the board. In a thick film integrated circuit board that has a plurality of terminal electrode patterns for connection, remove the terminal electrode at a position corresponding to a lead that does not need to be connected in the electrical circuit, and remove the terminal electrode at a position near that position that is not shaded by the lead. ,
A thick film integrated circuit board characterized in that the solder resist is provided with a window blank area and marked. 6. The thick film integrated circuit board according to claim 1, wherein the marking as described in claim 2 is formed in an (island-like) land pattern using a solder resist or a resistor.