JPS6045094A - Method of mounting flat package type ic - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a mounting method for mounting a flat package mold 0 on a printed wiring board.

[Technical background of the invention]

Conventionally, as shown in the top and side views of FIGS. 1(a) and 1(b), a flat package type zo2 is mounted on a printed wiring board 1 at a predetermined position.
1 flat package mold O [
Hereinafter, the lead wire 4 extending from the insulating case 3 of 5) is formed on the printed wiring board l at a position corresponding to the lead wire 4 using a positioning device (not shown). It is positioned on the land 5 and the solder paste 6 printed on this land 5, and then the soldering process is performed afterward.
The lead wire 4 and the land 5 were connected to each other, and I○2 was mounted on the printed wiring board 1.

In addition, when soldering is performed manually without using a dedicated positioning device, carefully align the position of this step 2 using a magnifying glass such as a loupe, and then perform the soldering work accordingly. The circuit C2 was mounted on the printed wiring board 1.

[Problems with background technology]

By the way, according to the mounting method of work C2 mentioned above, work C2
When performing the mounting work, the pitch between the lead wire 4 and the land 5 is narrow (for example, 0.5 inch pitch), so in order to accurately align the lead wire 4 and the land 5, conventionally expensive dedicated The disadvantage is that a positioning device must be used. In addition, if you do it manually without using a dedicated positioning device, connect the lead wire 4 of work C2 to the land 5.
It is difficult to accurately align the solder paste 6, and if the lead wire 4 is displaced during positioning, the solder paste 6 may collapse. Furthermore, the solder paste 6 becomes fluidized by heating during soldering, and the lead wires 4 may be displaced from the lands 5. Therefore, the lands 5 may be located between the lead wires 4, or the leads may be If the wire 4 is located between the lands 5 or between the leads fs4, there may be a magnetic connection and seal, or there may be a poor connection, which will significantly reduce the yield of the product. Ta. Furthermore, in order to eliminate this factor, not only must positioning work be done carefully (but also the workpiece 0 must be fixed during soldering, which poses the problem of requiring a significant amount of work time). Ta.

[Purpose of the invention]

The present invention has been made in view of the above-mentioned problems.
An object of the present invention is to provide a mounting method for a flat package type IC that allows easy and reliable positioning when manually mounting a flat package IC at a predetermined position on a printed wiring board.

[Summary of the invention]

In order to achieve this object, the present invention forms insulating protrusions made of insulating paste at predetermined positions on a printed wiring board by thick film printing, and uses which insulating protrusions to position each part of the flat package mold C. It is.

do.

FIG. 3 is a top view of a printed wiring board l showing a method of mounting a flat package IC according to the present invention, and FIG.
The same parts as in the figure are indicated by the same reference numerals.

On the upper surface of this printed wiring board l, linear insulating projections 10 made of insulating paste are formed at a predetermined pitch between lands 50 formed on the upper surface of the printed wiring board l. The insulating protrusions 10 are printed on a paster printed wiring board 11C using a metal mask and then solidified. Further, between each pair of adjacent insulating protrusions 100, seven solder pastes 11 are pasted and pasted by printing.

Further, among the solder pastes 11, the adjacent solder pastes 11 are arranged in a staggered manner between each pair of insulating protrusions with appropriate intervals so as not to contact each other. Figures 4(a) and (b) are the third
FIG. 2 is an enlarged view of the main part of the figure and a side view thereof.

As shown in the detailed view of the main part in Fig. 5, the lead wires 4 of 1 piece C2 can be inserted into the four parts 10 formed between each pair of corresponding insulating protrusions 0. When the lead wires 4 of the wire C2 are inserted into the corresponding recesses IO in this way, the IO2 can be accurately and easily positioned at a predetermined position on the printed wiring board l. Therefore, from this state, when the printed wiring board 1 is heated in a coating flow furnace (not shown), the lead wires 4 of the wire C2 can be soldered to the corresponding lands 5 formed on the printed wiring board 1 without causing positional deviation. In the above embodiment, when positioning the flat package mold C, the lead wire 4 of xa2 is connected to the insulating protrusion 10.
However, the present invention is of course not limited to the above-mentioned embodiment, and FIG. 6(a), in which the same parts as in FIG. As shown in (b), a linear insulating protrusion 12 is formed on the printed wiring board l which is a half of the surrounding area of the insulating case 3 of K and G02, and the insulating case 3 of G02 is inserted therein for positioning. It's okay.

In order to position the further pressure, IO'l, on the printed wiring board 1 in the above embodiment, the insulating protrusion 10.12 is formed in a linear shape, but of course the shape of this protrusion is limited to the linear shape. Depending on the shape of the object to be positioned, it may be U-shaped or circular.The key is to use this protrusion,
Any shape may be used as long as it positions xc2.

Other equipment such as a printing press may also be used. Further, the protrusion is formed into a desired shape by appropriately selecting the viscosity, type, etc. of the insulating paste.

〔Effect of the invention〕

In the present invention, as described above, insulating protrusions are formed on the printed wiring board, and each part of the flat package type IO is positioned within the recess formed by the protrusions.
Soldering work can be easily and accurately positioned even with handmade tools. Further, even in an automatic soldering process using a reflow method or the like, it is possible to prevent Xa from shifting in position during transportation, and to ensure soldering at a predetermined position.

[Brief explanation of the drawing]

Figure 1 (a) (b) is a top view and side view of a printed wiring board showing the mounting method of the conventional flat package mold 0, and Figures 2 (a) and (b) are the same as those shown in Figure 1. An enlarged sectional view of the main part and a side view thereof, FIG. 3 is a top view of a printed wiring board showing the mounting method of the flat package type l○ according to the present invention, and FIGS.
An enlarged top view of the main part of the figure and its side view, Figure 5 is the 4th
Enlarged cross-sectional view of main parts in Figure (b), Figures 6 (a) and (b)
FIG. 2 is a top view and a side view of a printed wiring board showing another embodiment of the present invention. DESCRIPTION OF SYMBOLS 1...Printed wiring board, 2...Flat package mold C13...Insulation case, 4...Lead wire, 5...
Land, 10.12... Insulating protrusion, 10'... Recess Fig. 1 Fig. 2 (a) (a) Fig. 3 Fig. 4

Claims (3)

[Claims] (1) Form insulating protrusions made of insulating paste at predetermined positions on the printed wiring board by thick film printing, insert and position the flat package mold a into the recesses formed by the protrusions, and form the printed wiring board. A method for mounting a flat package type IC, characterized in that soldering is performed between the soldered land and the lead wire of the flat package type Xa. (2) The insulating protrusions are formed linearly at a predetermined pitch between lands formed on the printed wiring board, and the lead wires of the flat package type IO are inserted and positioned between the protrusions. Scope No. 1 (a method for mounting a flat package IC according to item 11). (3) The seven-rat package according to claim (1), wherein the insulating protrusion is formed on the printed wiring board around the position where the insulating case of the flat package type Xa is arranged in order to hold the insulating case of the flat package type Xa. How to implement mold work 0.