JPH04121779U - TOT connection land - Google Patents

Abstract

(57) [Abstract] [Purpose] When mounting a thin film substrate on a thick film substrate in a TOT hybrid IC, the thin film substrate placed in accordance with the pattern of the thick film substrate shifts and becomes stuck due to solder melting. The purpose is to prevent [Structure] Connection land 6 formed on thin film substrate 2
The protruding piece 4 of the convex connecting land 3 is formed outwardly on the thick film substrate 1 so as to correspond to the above, and the shoulder portion 5 of the convex connecting land 3 is aligned with the outer edge of the thin film substrate 2. The structure is such that the projecting piece 4 serves as a mark on the thin film substrate 2.

Description

[Detailed explanation of the idea]

0001

[Industrial application field]

In TOT hybrid ICs, thick film substrates are used when mounting thin film substrates on thick film substrates. This relates to the pattern shape formed on the board.

0002

[Conventional technology]

Conventionally, Thin On Thick film (hereinafter referred to as TOT) In a hybrid IC, a thin film board mounted on a thick film board has a resistor on one side. circuit patterns formed from conductors and terminal lands connecting them to the thick film board. It is placed on its outer edge. Therefore, when mounting a thin film board on a thick film board, the pattern of the thin film board The ground surface faces downward to facilitate alignment with the connection land of the thick film board. As shown in Figure 3, make the connection land of the thick film board larger so that it comes out outside of the thin film board. was forming.

0003

[Problem that the idea aims to solve]

As mentioned above, in TOT hybrid IC, mounting a thin film substrate on a thick film substrate When installing, use a large rectangular connection land for the thick film board to facilitate alignment. Therefore, the solder paste is applied to the entire surface of the large connecting land. Therefore, when melting the solder, the land is large, so the thin film substrate may have irregularities compared to the area where it is placed. There was a problem in that it was pulled in a certain direction, causing positional deviation.

0004

[Means to solve the problem]

In order to solve the above issues, a printed circuit is formed on a thick film substrate with circuit components mounted on it. In a hybrid IC equipped with a thin film substrate, the thin film base formed on the thick film substrate The connecting land with the plate is made into a convex shape, and the shoulder of the convex part is placed with the projecting piece of the convex part outside. We provide a TOT mounting land that is characterized by being formed along the outer edge of a thin film board. do.

[0005]

[Effect]

As mentioned above, the protruding piece of the convex part of the convex connection land formed on the thick film board is turned outward. By forming the shoulder to match the outer edge of the thin film substrate, the protruding piece of the convex part can be positioned easily. Assuming that solder paste is applied to the entire surface of the convex shaped connection land as well as a mark for alignment. Since the area where the solder melts is approximately the same area as the thin film substrate on which it is placed, the area where the solder melts is It will not be misplaced.

[0006]

【Example】

Hereinafter, embodiments of this invention will be described in detail with reference to the drawings. Figure 1 shows the present invention FIG. 2 is a plan view of an embodiment of a connection land of a thick film substrate according to FIG. 2 is a plan view of one embodiment of the invention.

[0007] In the figure, 1 is an alumina thick film substrate that serves as a base, and a thin film substrate to be placed on it. Shape the protrusion 4 of the convex connecting land 3 to the outside edge of the plate 2 so that the shoulder 5 coincides with the outer edge of the plate 2. It has been completed. 2 is an alumina thin film substrate, with only one side not shown in the figure. A circuit is formed with a resistor and a conductor printed by the insulator, and their connection lands 6 are connected to the board. provided at the end.

[0008] Apply solder paste to the convex connection lands 3 of the thick film substrate 1 configured as described above. Place the thin film substrate 2 so that the connection land 6 is in contact with the convex connection land 3. , abbreviated as a thin film substrate on which the place where the solder melts is placed even if the solder is melted in a reflow oven. Since the area is the same, the thin film substrate will not be pulled and shifted.

[0009]

[Effect of the idea]

As mentioned above, the protruding piece of the convex part of the convex connection land formed on the thick film board is turned outward. By forming the shoulder to match the outer edge of the thin film substrate, the protruding piece of the convex part can be positioned easily. Assuming that solder paste is applied to the entire surface of the convex shaped connection land as well as a mark for alignment. Since the area where the solder melts is approximately the same area as the thin film substrate on which it is placed, the area where the solder melts is Connections can be made without misalignment, preventing short circuits or open circuits. Eliminating defective products improves yield and contributes to cost reduction. Remarkable.

[Brief explanation of drawings]

FIG. 1 is a plan view of an embodiment of a connection land of a thick film substrate according to the present invention;

FIG. 2 is a plan view of an embodiment of a connection land of a thin film substrate according to the present invention;

FIG. 3 is a plan view of an embodiment of a connection land of a conventional thick film substrate.

[Explanation of symbols]

1 Thick film substrate 2 Thin film substrate 3 Convex connecting land 4 Projection part 5 Shoulder 6 Thin film board connection land 7 Connecting land

Claims (1)

[Scope of utility model registration request] 1. A hybrid IC comprising a thin film substrate on which a printed circuit is formed on a thick film substrate on which circuit components are mounted, wherein a connection land formed on the thick film substrate and connected to the thin film substrate is formed in a convex shape, and the convex A TOT mounting land characterized in that the shoulder of the convex part is formed along the outer edge of a thin film substrate on which the shoulder of the convex part is placed, with the protruding piece of the part facing outward.