JPS58207656A - 樹脂封止型半導体装置およびその製造方法 - Google Patents
樹脂封止型半導体装置およびその製造方法Info
- Publication number
- JPS58207656A JPS58207656A JP57090683A JP9068382A JPS58207656A JP S58207656 A JPS58207656 A JP S58207656A JP 57090683 A JP57090683 A JP 57090683A JP 9068382 A JP9068382 A JP 9068382A JP S58207656 A JPS58207656 A JP S58207656A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- chip
- mold
- phototransmitting
- rom
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10W74/00—
-
- H10W72/884—
-
- H10W90/756—
Landscapes
- Non-Volatile Memory (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Read Only Memory (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57090683A JPS58207656A (ja) | 1982-05-28 | 1982-05-28 | 樹脂封止型半導体装置およびその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57090683A JPS58207656A (ja) | 1982-05-28 | 1982-05-28 | 樹脂封止型半導体装置およびその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58207656A true JPS58207656A (ja) | 1983-12-03 |
| JPH0312467B2 JPH0312467B2 (cg-RX-API-DMAC10.html) | 1991-02-20 |
Family
ID=14005325
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57090683A Granted JPS58207656A (ja) | 1982-05-28 | 1982-05-28 | 樹脂封止型半導体装置およびその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58207656A (cg-RX-API-DMAC10.html) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4723156A (en) * | 1984-08-20 | 1988-02-02 | Oki Electric Industry Co., Ltd. | EPROM device and a manufacturing method thereof |
| US4766480A (en) * | 1985-05-16 | 1988-08-23 | Mips Co., Ltd. | Integrated circuit card having memory errasable with ultraviolet ray |
| US4794243A (en) * | 1985-03-16 | 1988-12-27 | Mips Co., Ltd. | Integrated circuit card with increased number of connecting terminals |
| US4801998A (en) * | 1984-08-20 | 1989-01-31 | Oki Electric Industry Co., Ltd. | EPROM device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5541748A (en) * | 1978-09-18 | 1980-03-24 | Mitsubishi Electric Corp | Semiconductor memory device |
| JPS5742152A (en) * | 1980-08-27 | 1982-03-09 | Nec Corp | Resin sealed type semiconductor and manufacture thereof |
-
1982
- 1982-05-28 JP JP57090683A patent/JPS58207656A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5541748A (en) * | 1978-09-18 | 1980-03-24 | Mitsubishi Electric Corp | Semiconductor memory device |
| JPS5742152A (en) * | 1980-08-27 | 1982-03-09 | Nec Corp | Resin sealed type semiconductor and manufacture thereof |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4723156A (en) * | 1984-08-20 | 1988-02-02 | Oki Electric Industry Co., Ltd. | EPROM device and a manufacturing method thereof |
| US4801998A (en) * | 1984-08-20 | 1989-01-31 | Oki Electric Industry Co., Ltd. | EPROM device |
| US4794243A (en) * | 1985-03-16 | 1988-12-27 | Mips Co., Ltd. | Integrated circuit card with increased number of connecting terminals |
| US4766480A (en) * | 1985-05-16 | 1988-08-23 | Mips Co., Ltd. | Integrated circuit card having memory errasable with ultraviolet ray |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0312467B2 (cg-RX-API-DMAC10.html) | 1991-02-20 |
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