JPS58206192A - プリント回路板の製造方法及び装置 - Google Patents
プリント回路板の製造方法及び装置Info
- Publication number
- JPS58206192A JPS58206192A JP58083445A JP8344583A JPS58206192A JP S58206192 A JPS58206192 A JP S58206192A JP 58083445 A JP58083445 A JP 58083445A JP 8344583 A JP8344583 A JP 8344583A JP S58206192 A JPS58206192 A JP S58206192A
- Authority
- JP
- Japan
- Prior art keywords
- foil
- screen
- holes
- substrate
- ink composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims description 31
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 35
- 239000000758 substrate Substances 0.000 claims description 30
- 229910052802 copper Inorganic materials 0.000 claims description 28
- 239000010949 copper Substances 0.000 claims description 28
- 239000011888 foil Substances 0.000 claims description 25
- 229910052751 metal Inorganic materials 0.000 claims description 21
- 239000002184 metal Substances 0.000 claims description 21
- 238000007650 screen-printing Methods 0.000 claims description 21
- 238000005260 corrosion Methods 0.000 claims description 18
- 230000007797 corrosion Effects 0.000 claims description 18
- 239000011148 porous material Substances 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 12
- 239000000203 mixture Substances 0.000 claims description 11
- 238000004519 manufacturing process Methods 0.000 claims description 10
- 239000011347 resin Substances 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 7
- 238000005530 etching Methods 0.000 claims description 6
- 239000000853 adhesive Substances 0.000 claims description 5
- 230000001070 adhesive effect Effects 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 238000000151 deposition Methods 0.000 claims description 3
- 238000010586 diagram Methods 0.000 claims description 3
- 239000004033 plastic Substances 0.000 claims description 3
- 239000002904 solvent Substances 0.000 claims description 2
- 238000009835 boiling Methods 0.000 claims 1
- 238000005429 filling process Methods 0.000 claims 1
- 230000000873 masking effect Effects 0.000 claims 1
- 239000010410 layer Substances 0.000 description 16
- 239000004020 conductor Substances 0.000 description 7
- 239000010408 film Substances 0.000 description 6
- 239000011889 copper foil Substances 0.000 description 5
- 238000007747 plating Methods 0.000 description 5
- 238000009713 electroplating Methods 0.000 description 4
- 239000000945 filler Substances 0.000 description 4
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- ROOXNKNUYICQNP-UHFFFAOYSA-N ammonium persulfate Chemical compound [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical group ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000007605 air drying Methods 0.000 description 1
- 229910001870 ammonium persulfate Inorganic materials 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- QRJOYPHTNNOAOJ-UHFFFAOYSA-N copper gold Chemical compound [Cu].[Au] QRJOYPHTNNOAOJ-UHFFFAOYSA-N 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000012041 precatalyst Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000003678 scratch resistant effect Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 229910000597 tin-copper alloy Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
- H05K2203/0769—Dissolving insulating materials, e.g. coatings, not used for developing resist after exposure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Printing Plates And Materials Therefor (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE32179839 | 1982-05-13 | ||
| DE3217983A DE3217983C2 (de) | 1982-05-13 | 1982-05-13 | Verfahren zum Herstellen einer Abdeckmaske |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58206192A true JPS58206192A (ja) | 1983-12-01 |
Family
ID=6163461
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58083445A Pending JPS58206192A (ja) | 1982-05-13 | 1983-05-10 | プリント回路板の製造方法及び装置 |
Country Status (9)
| Country | Link |
|---|---|
| JP (1) | JPS58206192A (fr) |
| CA (1) | CA1196731A (fr) |
| CH (1) | CH659753A5 (fr) |
| DE (1) | DE3217983C2 (fr) |
| DK (1) | DK210983A (fr) |
| GB (1) | GB2120017B (fr) |
| IT (1) | IT1197651B (fr) |
| NL (1) | NL8301586A (fr) |
| SE (1) | SE8302619L (fr) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3514093A1 (de) * | 1985-04-16 | 1986-10-23 | Kaspar 5241 Gebhardshain Eidenberg | Verfahren zum verschliessen von in einer leiterplatte vorgesehenen bohrungen |
| US4884337A (en) * | 1986-11-26 | 1989-12-05 | Epicor Technology, Inc. | Method for temporarily sealing holes in printed circuit boards utilizing a thermodeformable material |
| US4748742A (en) * | 1986-11-26 | 1988-06-07 | Multitek Corporation | Method for temporarily sealing holes in printed circuit boards |
| US6276055B1 (en) | 1998-09-02 | 2001-08-21 | Hadco Santa Clara, Inc. | Method and apparatus for forming plugs in vias of a circuit board layer |
| WO2001093647A2 (fr) | 2000-05-31 | 2001-12-06 | Honeywell International Inc. | Procede de remplissage |
| US6454154B1 (en) | 2000-05-31 | 2002-09-24 | Honeywell Advanced Circuits, Inc. | Filling device |
| AU2001264968A1 (en) | 2000-05-31 | 2001-12-11 | Honeywell International, Inc. | Filling device |
| US6800232B2 (en) | 2000-05-31 | 2004-10-05 | Ttm Advanced Circuits, Inc. | PCB support plate method for PCB via fill |
| US6506332B2 (en) | 2000-05-31 | 2003-01-14 | Honeywell International Inc. | Filling method |
| US6855385B2 (en) | 2000-05-31 | 2005-02-15 | Ttm Advanced Circuits, Inc. | PCB support plate for PCB via fill |
| CN110557889A (zh) * | 2018-05-30 | 2019-12-10 | 胜宏科技（惠州）股份有限公司 | 一种铝片网版塞孔的制作方法 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52118261A (en) * | 1976-03-30 | 1977-10-04 | Matsushita Electric Ind Co Ltd | Method of producing through hole printed circuit board |
| JPS5658797A (en) * | 1979-10-18 | 1981-05-21 | Yashima Denki Kk | Ac power control circuit in induction motor |
| JPS5667985A (en) * | 1979-11-08 | 1981-06-08 | Matsushita Electric Ind Co Ltd | Method of printing ink using metal mask |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1249966B (de) * | 1967-09-14 | Ruwel-Werke, Spezialfabrik für Hochfrequenzbauteile, Inh. Ing. Fritz Stahl, Geldern (RhId.) | Verfahren zum Herstellen von metallisierten Wandungen von Bohrungen in gedruckten Leiterplatten | |
| GB1042234A (en) * | 1965-03-05 | 1966-09-14 | Mullard Ltd | Multilayer printed circuits |
| GB1194853A (en) * | 1967-02-16 | 1970-06-17 | Btr Industries Ltd | A Method of Forming Printed Circuits |
-
1982
- 1982-05-13 DE DE3217983A patent/DE3217983C2/de not_active Expired
-
1983
- 1983-05-03 GB GB08312009A patent/GB2120017B/en not_active Expired
- 1983-05-04 NL NL8301586A patent/NL8301586A/nl not_active Application Discontinuation
- 1983-05-06 SE SE8302619A patent/SE8302619L/xx not_active Application Discontinuation
- 1983-05-10 CH CH2557/83A patent/CH659753A5/de not_active IP Right Cessation
- 1983-05-10 JP JP58083445A patent/JPS58206192A/ja active Pending
- 1983-05-11 DK DK210983A patent/DK210983A/da not_active Application Discontinuation
- 1983-05-13 IT IT48288/83A patent/IT1197651B/it active
- 1983-05-13 CA CA000428115A patent/CA1196731A/fr not_active Expired
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52118261A (en) * | 1976-03-30 | 1977-10-04 | Matsushita Electric Ind Co Ltd | Method of producing through hole printed circuit board |
| JPS5658797A (en) * | 1979-10-18 | 1981-05-21 | Yashima Denki Kk | Ac power control circuit in induction motor |
| JPS5667985A (en) * | 1979-11-08 | 1981-06-08 | Matsushita Electric Ind Co Ltd | Method of printing ink using metal mask |
Also Published As
| Publication number | Publication date |
|---|---|
| GB8312009D0 (en) | 1983-06-08 |
| DK210983A (da) | 1983-11-14 |
| IT1197651B (it) | 1988-12-06 |
| SE8302619D0 (sv) | 1983-05-06 |
| NL8301586A (nl) | 1983-12-01 |
| CA1196731A (fr) | 1985-11-12 |
| DE3217983C2 (de) | 1984-03-29 |
| DE3217983A1 (de) | 1983-11-17 |
| DK210983D0 (da) | 1983-05-11 |
| GB2120017B (en) | 1986-02-19 |
| GB2120017A (en) | 1983-11-23 |
| IT8348288A0 (it) | 1983-05-13 |
| CH659753A5 (de) | 1987-02-13 |
| SE8302619L (sv) | 1983-11-14 |
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