CA1258138A - Methode de fabrication de cartes de circuits imprimes masquees - Google Patents

Methode de fabrication de cartes de circuits imprimes masquees

Info

Publication number
CA1258138A
CA1258138A CA000515260A CA515260A CA1258138A CA 1258138 A CA1258138 A CA 1258138A CA 000515260 A CA000515260 A CA 000515260A CA 515260 A CA515260 A CA 515260A CA 1258138 A CA1258138 A CA 1258138A
Authority
CA
Canada
Prior art keywords
copper
traces
areas
holes
tin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA000515260A
Other languages
English (en)
Inventor
Stanley J. Ruszczyk
Steven A. Castaldi
Gary B. Larson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MacDermid Inc
Original Assignee
MacDermid Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by MacDermid Inc filed Critical MacDermid Inc
Application granted granted Critical
Publication of CA1258138A publication Critical patent/CA1258138A/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/243—Reinforcing the conductive pattern characterised by selective plating, e.g. for finish plating of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3473—Plating of solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09736—Varying thickness of a single conductor; Conductors in the same plane having different thicknesses
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/043—Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
CA000515260A 1985-08-08 1986-08-01 Methode de fabrication de cartes de circuits imprimes masquees Expired CA1258138A (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US76381285A 1985-08-08 1985-08-08
US763,812 1985-08-08

Publications (1)

Publication Number Publication Date
CA1258138A true CA1258138A (fr) 1989-08-01

Family

ID=25068881

Family Applications (1)

Application Number Title Priority Date Filing Date
CA000515260A Expired CA1258138A (fr) 1985-08-08 1986-08-01 Methode de fabrication de cartes de circuits imprimes masquees

Country Status (5)

Country Link
EP (1) EP0233201A4 (fr)
JP (1) JPS63500837A (fr)
AU (1) AU5956286A (fr)
CA (1) CA1258138A (fr)
WO (1) WO1987000938A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01293694A (ja) * 1988-05-23 1989-11-27 Mitsubishi Electric Corp プリント配線基板の製造方法
JPH0423485A (ja) * 1990-05-18 1992-01-27 Cmk Corp プリント配線板とその製造法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1410780A (en) * 1972-09-29 1975-10-22 Exacta Circuits Ltd Through-hole plated printed circuits
JPS49103167A (fr) * 1973-02-08 1974-09-30
JPS50127176A (fr) * 1974-01-25 1975-10-06
JPS5141869A (ja) * 1974-10-04 1976-04-08 Hitachi Ltd Komitsudopataantasoinsatsukairoban no seizohoho
CA1054259A (fr) * 1977-10-14 1979-05-08 John A. Galko Plaquette de circuits imprimes avec masque de protection a adherence amelioree
US4291118A (en) * 1979-12-26 1981-09-22 W. R. Grace & Co. Relief imaging liquids
US4325780A (en) * 1980-09-16 1982-04-20 Schulz Sr Robert M Method of making a printed circuit board
JPS5771159A (en) * 1980-10-21 1982-05-01 Citizen Watch Co Ltd Heterogeneous electroplating method for circuit substrate
US4436806A (en) * 1981-01-16 1984-03-13 W. R. Grace & Co. Method and apparatus for making printed circuit boards
JPS57145353A (en) * 1981-03-03 1982-09-08 Sharp Corp Preparation of tape carrier type substrate
JPS5816594A (ja) * 1981-07-22 1983-01-31 共立工業株式会社 プリント配線板の製造法
JPS5830196A (ja) * 1981-08-17 1983-02-22 共立工業株式会社 プリント配線板の製造法
JPS58130595A (ja) * 1982-01-28 1983-08-04 日立化成工業株式会社 印刷配線板の製造方法
DE3320183A1 (de) * 1983-06-03 1984-12-06 ANT Nachrichtentechnik GmbH, 7150 Backnang Verfahren zum herstellen gedruckter schaltungen
US4582778A (en) * 1983-10-25 1986-04-15 Sullivan Donald F Multi-function photopolymer for efficiently producing high resolution images on printed wiring boards, and the like
US4487654A (en) * 1983-10-27 1984-12-11 Ael Microtel Limited Method of manufacturing printed wiring boards

Also Published As

Publication number Publication date
AU5956286A (en) 1987-03-05
EP0233201A4 (fr) 1987-11-30
JPS63500837A (ja) 1988-03-24
WO1987000938A1 (fr) 1987-02-12
EP0233201A1 (fr) 1987-08-26

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