JPS5819385B2 - ロウヅケホウホウ - Google Patents

ロウヅケホウホウ

Info

Publication number
JPS5819385B2
JPS5819385B2 JP49100939A JP10093974A JPS5819385B2 JP S5819385 B2 JPS5819385 B2 JP S5819385B2 JP 49100939 A JP49100939 A JP 49100939A JP 10093974 A JP10093974 A JP 10093974A JP S5819385 B2 JPS5819385 B2 JP S5819385B2
Authority
JP
Japan
Prior art keywords
brazing
lead terminal
brazing material
external lead
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP49100939A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5128555A (en, 2012
Inventor
穴沢信造
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP49100939A priority Critical patent/JPS5819385B2/ja
Publication of JPS5128555A publication Critical patent/JPS5128555A/ja
Publication of JPS5819385B2 publication Critical patent/JPS5819385B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49109—Connecting at different heights outside the semiconductor or solid-state body

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP49100939A 1974-09-04 1974-09-04 ロウヅケホウホウ Expired JPS5819385B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP49100939A JPS5819385B2 (ja) 1974-09-04 1974-09-04 ロウヅケホウホウ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP49100939A JPS5819385B2 (ja) 1974-09-04 1974-09-04 ロウヅケホウホウ

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP7694282A Division JPS5890749A (ja) 1982-05-07 1982-05-07 半導体装置
JP7694182A Division JPS5890748A (ja) 1982-05-07 1982-05-07 半導体装置

Publications (2)

Publication Number Publication Date
JPS5128555A JPS5128555A (en, 2012) 1976-03-10
JPS5819385B2 true JPS5819385B2 (ja) 1983-04-18

Family

ID=14287309

Family Applications (1)

Application Number Title Priority Date Filing Date
JP49100939A Expired JPS5819385B2 (ja) 1974-09-04 1974-09-04 ロウヅケホウホウ

Country Status (1)

Country Link
JP (1) JPS5819385B2 (en, 2012)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54154970A (en) * 1978-05-26 1979-12-06 Kyushu Nippon Electric Semiconductor device
JPS5890748A (ja) * 1982-05-07 1983-05-30 Nec Corp 半導体装置
JPS5890749A (ja) * 1982-05-07 1983-05-30 Nec Corp 半導体装置
JPS6010762A (ja) * 1983-06-30 1985-01-19 Sumitomo Special Metals Co Ltd 複合ピン
JPH044534Y2 (en, 2012) * 1985-07-09 1992-02-10
JPH02224264A (ja) * 1990-01-20 1990-09-06 Sumitomo Electric Ind Ltd 半導体素子搭載用基板の製造方法
KR20240006626A (ko) * 2021-05-07 2024-01-15 마테리온 코포레이션 마이크로일렉트로닉스 패키지 어셈블리 및 제조 공정
JP2023045408A (ja) * 2021-09-22 2023-04-03 本田技研工業株式会社 ろう付け方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5128705Y2 (en, 2012) * 1972-01-24 1976-07-20
JPS49674A (en, 2012) * 1972-04-19 1974-01-07

Also Published As

Publication number Publication date
JPS5128555A (en, 2012) 1976-03-10

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