JPS5128555A - - Google Patents
Info
- Publication number
- JPS5128555A JPS5128555A JP49100939A JP10093974A JPS5128555A JP S5128555 A JPS5128555 A JP S5128555A JP 49100939 A JP49100939 A JP 49100939A JP 10093974 A JP10093974 A JP 10093974A JP S5128555 A JPS5128555 A JP S5128555A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/49105—Connecting at different heights
- H01L2224/49109—Connecting at different heights outside the semiconductor or solid-state body
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP49100939A JPS5819385B2 (ja) | 1974-09-04 | 1974-09-04 | ロウヅケホウホウ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP49100939A JPS5819385B2 (ja) | 1974-09-04 | 1974-09-04 | ロウヅケホウホウ |
Related Child Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7694282A Division JPS5890749A (ja) | 1982-05-07 | 1982-05-07 | 半導体装置 |
| JP7694182A Division JPS5890748A (ja) | 1982-05-07 | 1982-05-07 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5128555A true JPS5128555A (en, 2012) | 1976-03-10 |
| JPS5819385B2 JPS5819385B2 (ja) | 1983-04-18 |
Family
ID=14287309
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP49100939A Expired JPS5819385B2 (ja) | 1974-09-04 | 1974-09-04 | ロウヅケホウホウ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5819385B2 (en, 2012) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54154970A (en) * | 1978-05-26 | 1979-12-06 | Kyushu Nippon Electric | Semiconductor device |
| JPS5890749A (ja) * | 1982-05-07 | 1983-05-30 | Nec Corp | 半導体装置 |
| JPS5890748A (ja) * | 1982-05-07 | 1983-05-30 | Nec Corp | 半導体装置 |
| JPS6010762A (ja) * | 1983-06-30 | 1985-01-19 | Sumitomo Special Metals Co Ltd | 複合ピン |
| JPS6213168U (en, 2012) * | 1985-07-09 | 1987-01-27 | ||
| JPH02224264A (ja) * | 1990-01-20 | 1990-09-06 | Sumitomo Electric Ind Ltd | 半導体素子搭載用基板の製造方法 |
| JP2023045408A (ja) * | 2021-09-22 | 2023-04-03 | 本田技研工業株式会社 | ろう付け方法 |
| JP2024516742A (ja) * | 2021-05-07 | 2024-04-16 | マテリオン コーポレイション | マイクロエレクトロニクスパッケージアセンブリおよび作製方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4887662U (en, 2012) * | 1972-01-24 | 1973-10-23 | ||
| JPS49674A (en, 2012) * | 1972-04-19 | 1974-01-07 |
-
1974
- 1974-09-04 JP JP49100939A patent/JPS5819385B2/ja not_active Expired
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4887662U (en, 2012) * | 1972-01-24 | 1973-10-23 | ||
| JPS49674A (en, 2012) * | 1972-04-19 | 1974-01-07 |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54154970A (en) * | 1978-05-26 | 1979-12-06 | Kyushu Nippon Electric | Semiconductor device |
| JPS5890749A (ja) * | 1982-05-07 | 1983-05-30 | Nec Corp | 半導体装置 |
| JPS5890748A (ja) * | 1982-05-07 | 1983-05-30 | Nec Corp | 半導体装置 |
| JPS6010762A (ja) * | 1983-06-30 | 1985-01-19 | Sumitomo Special Metals Co Ltd | 複合ピン |
| JPS6213168U (en, 2012) * | 1985-07-09 | 1987-01-27 | ||
| JPH02224264A (ja) * | 1990-01-20 | 1990-09-06 | Sumitomo Electric Ind Ltd | 半導体素子搭載用基板の製造方法 |
| JP2024516742A (ja) * | 2021-05-07 | 2024-04-16 | マテリオン コーポレイション | マイクロエレクトロニクスパッケージアセンブリおよび作製方法 |
| JP2023045408A (ja) * | 2021-09-22 | 2023-04-03 | 本田技研工業株式会社 | ろう付け方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5819385B2 (ja) | 1983-04-18 |