JPS58192346A - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法

Info

Publication number
JPS58192346A
JPS58192346A JP57075831A JP7583182A JPS58192346A JP S58192346 A JPS58192346 A JP S58192346A JP 57075831 A JP57075831 A JP 57075831A JP 7583182 A JP7583182 A JP 7583182A JP S58192346 A JPS58192346 A JP S58192346A
Authority
JP
Japan
Prior art keywords
recess
semiconductor
film
semiconductor layer
oxide film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57075831A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0348656B2 (forum.php
Inventor
Makoto Dan
檀　良
Tetsunori Wada
哲典 和田
Masamizu Konaka
小中　雅水
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP57075831A priority Critical patent/JPS58192346A/ja
Publication of JPS58192346A publication Critical patent/JPS58192346A/ja
Publication of JPH0348656B2 publication Critical patent/JPH0348656B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/76294—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using selective deposition of single crystal silicon, i.e. SEG techniques

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Element Separation (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
JP57075831A 1982-05-06 1982-05-06 半導体装置の製造方法 Granted JPS58192346A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57075831A JPS58192346A (ja) 1982-05-06 1982-05-06 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57075831A JPS58192346A (ja) 1982-05-06 1982-05-06 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS58192346A true JPS58192346A (ja) 1983-11-09
JPH0348656B2 JPH0348656B2 (forum.php) 1991-07-25

Family

ID=13587521

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57075831A Granted JPS58192346A (ja) 1982-05-06 1982-05-06 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS58192346A (forum.php)

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60107844A (ja) * 1983-11-16 1985-06-13 Nippon Precision Saakitsutsu Kk 半導体装置の製造方法
US4526631A (en) * 1984-06-25 1985-07-02 International Business Machines Corporation Method for forming a void free isolation pattern utilizing etch and refill techniques
US4528047A (en) * 1984-06-25 1985-07-09 International Business Machines Corporation Method for forming a void free isolation structure utilizing etch and refill techniques
JPS60198841A (ja) * 1984-03-23 1985-10-08 Nec Corp 半導体装置の素子分離方法
JPS6122645A (ja) * 1984-06-26 1986-01-31 Nec Corp 半導体デバイス用基板およびその製造方法
JPS61128555A (ja) * 1984-11-27 1986-06-16 Mitsubishi Electric Corp 半導体装置
JPS61177770A (ja) * 1985-01-28 1986-08-09 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション 相補領域を有する半導体装置の製造方法
JPS6288359A (ja) * 1985-10-15 1987-04-22 Nec Corp 相補型半導体装置の製造方法
US4679309A (en) * 1983-06-21 1987-07-14 Societe Pour L'etude Et La Fabrication De Circuits Integres Speciaux E.F.C.I.S. Process for manufacturing isolated semi conductor components in a semi conductor wafer
JPS63140562A (ja) * 1986-10-06 1988-06-13 フェアチャイルド　セミコンダクタ　コーポレーション 選択的エピタキシイＢｉＣＭＯＳプロセス
JPH0282551A (ja) * 1988-09-19 1990-03-23 Sanyo Electric Co Ltd 半導体装置の製造方法
US4929570A (en) * 1986-10-06 1990-05-29 National Semiconductor Corporation Selective epitaxy BiCMOS process
US4970175A (en) * 1988-08-09 1990-11-13 U.S. Philips Corporation Method of manufacturing a semiconductor device using SEG and a transitory substrate
US5250461A (en) * 1991-05-17 1993-10-05 Delco Electronics Corporation Method for dielectrically isolating integrated circuits using doped oxide sidewalls
KR100485170B1 (ko) * 2002-12-05 2005-04-22 동부아남반도체 주식회사 반도체 소자 및 이의 제조 방법

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4679309A (en) * 1983-06-21 1987-07-14 Societe Pour L'etude Et La Fabrication De Circuits Integres Speciaux E.F.C.I.S. Process for manufacturing isolated semi conductor components in a semi conductor wafer
JPS60107844A (ja) * 1983-11-16 1985-06-13 Nippon Precision Saakitsutsu Kk 半導体装置の製造方法
JPS60198841A (ja) * 1984-03-23 1985-10-08 Nec Corp 半導体装置の素子分離方法
US4526631A (en) * 1984-06-25 1985-07-02 International Business Machines Corporation Method for forming a void free isolation pattern utilizing etch and refill techniques
US4528047A (en) * 1984-06-25 1985-07-09 International Business Machines Corporation Method for forming a void free isolation structure utilizing etch and refill techniques
JPS6122645A (ja) * 1984-06-26 1986-01-31 Nec Corp 半導体デバイス用基板およびその製造方法
JPS61128555A (ja) * 1984-11-27 1986-06-16 Mitsubishi Electric Corp 半導体装置
JPS61177770A (ja) * 1985-01-28 1986-08-09 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション 相補領域を有する半導体装置の製造方法
JPS6288359A (ja) * 1985-10-15 1987-04-22 Nec Corp 相補型半導体装置の製造方法
JPS63140562A (ja) * 1986-10-06 1988-06-13 フェアチャイルド　セミコンダクタ　コーポレーション 選択的エピタキシイＢｉＣＭＯＳプロセス
US4929570A (en) * 1986-10-06 1990-05-29 National Semiconductor Corporation Selective epitaxy BiCMOS process
US4970175A (en) * 1988-08-09 1990-11-13 U.S. Philips Corporation Method of manufacturing a semiconductor device using SEG and a transitory substrate
JPH0282551A (ja) * 1988-09-19 1990-03-23 Sanyo Electric Co Ltd 半導体装置の製造方法
US5250461A (en) * 1991-05-17 1993-10-05 Delco Electronics Corporation Method for dielectrically isolating integrated circuits using doped oxide sidewalls
KR100485170B1 (ko) * 2002-12-05 2005-04-22 동부아남반도체 주식회사 반도체 소자 및 이의 제조 방법

Also Published As

Publication number Publication date
JPH0348656B2 (forum.php) 1991-07-25

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