JPS58191458A - 半導体装置 - Google Patents
半導体装置Info
- Publication number
- JPS58191458A JPS58191458A JP7489782A JP7489782A JPS58191458A JP S58191458 A JPS58191458 A JP S58191458A JP 7489782 A JP7489782 A JP 7489782A JP 7489782 A JP7489782 A JP 7489782A JP S58191458 A JPS58191458 A JP S58191458A
- Authority
- JP
- Japan
- Prior art keywords
- slit
- exposed
- chip
- impact
- outside
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 14
- 230000017525 heat dissipation Effects 0.000 claims description 4
- 239000011347 resin Substances 0.000 abstract description 19
- 229920005989 resin Polymers 0.000 abstract description 19
- 238000000034 method Methods 0.000 abstract description 2
- 238000009434 installation Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 3
- 238000005336 cracking Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 238000012790 confirmation Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 210000004013 groin Anatomy 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 231100000989 no adverse effect Toxicity 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
- H01L23/4334—Auxiliary members in encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7489782A JPS58191458A (ja) | 1982-05-04 | 1982-05-04 | 半導体装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7489782A JPS58191458A (ja) | 1982-05-04 | 1982-05-04 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS58191458A true JPS58191458A (ja) | 1983-11-08 |
JPH048946B2 JPH048946B2 (enrdf_load_stackoverflow) | 1992-02-18 |
Family
ID=13560636
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7489782A Granted JPS58191458A (ja) | 1982-05-04 | 1982-05-04 | 半導体装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58191458A (enrdf_load_stackoverflow) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4969262A (en) * | 1988-03-17 | 1990-11-13 | Nippon Piston Ring Co., Ltd. | Method of making camshaft |
-
1982
- 1982-05-04 JP JP7489782A patent/JPS58191458A/ja active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4969262A (en) * | 1988-03-17 | 1990-11-13 | Nippon Piston Ring Co., Ltd. | Method of making camshaft |
Also Published As
Publication number | Publication date |
---|---|
JPH048946B2 (enrdf_load_stackoverflow) | 1992-02-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPH06209054A (ja) | 半導体装置 | |
US6101092A (en) | Heat-dissipating structure of an electronic part | |
JP3094768B2 (ja) | 半導体装置 | |
US5818103A (en) | Semiconductor device mounted on a grooved head frame | |
JPS58191458A (ja) | 半導体装置 | |
JPS60137041A (ja) | 樹脂封止形半導体装置 | |
JPH0563113A (ja) | 樹脂封止型半導体装置 | |
KR200325122Y1 (ko) | 반도체패키지의히트싱크 | |
JP2748778B2 (ja) | 混成集積回路装置 | |
KR20000011229A (ko) | 반도체장치 | |
JPS61194754A (ja) | 半導体装置 | |
JP2963016B2 (ja) | 半導体装置 | |
JPH0451549A (ja) | 高放熱型半導体装置 | |
JP2882101B2 (ja) | 半導体装置 | |
JPS60127747A (ja) | 樹脂封止型半導体装置 | |
JPS62224049A (ja) | 電子装置 | |
JP2005150693A (ja) | チップパッケージ構造 | |
JPH04291749A (ja) | 放熱部材を備えた電子部品搭載用基板 | |
JPS62117354A (ja) | リ−ドフレ−ム | |
KR830000684Y1 (ko) | 반도체 장치 | |
JPS59224147A (ja) | 半導体装置 | |
JP2906635B2 (ja) | 混成集積回路装置 | |
KR970006162Y1 (ko) | 반도체패키지의 외부돌출형 히트싱크 | |
JPH05226528A (ja) | 樹脂封止半導体装置およびその製造方法 | |
JPH0395959A (ja) | リードフレーム |