JPS5818940A - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法

Info

Publication number
JPS5818940A
JPS5818940A JP56117080A JP11708081A JPS5818940A JP S5818940 A JPS5818940 A JP S5818940A JP 56117080 A JP56117080 A JP 56117080A JP 11708081 A JP11708081 A JP 11708081A JP S5818940 A JPS5818940 A JP S5818940A
Authority
JP
Japan
Prior art keywords
resin
etching
film
metal film
electrode wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56117080A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6256663B2 (enrdf_load_stackoverflow
Inventor
Hiroshi Kuroda
黒田　啓
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP56117080A priority Critical patent/JPS5818940A/ja
Publication of JPS5818940A publication Critical patent/JPS5818940A/ja
Publication of JPS6256663B2 publication Critical patent/JPS6256663B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76897—Formation of self-aligned vias or contact plugs, i.e. involving a lithographically uncritical step

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Drying Of Semiconductors (AREA)
JP56117080A 1981-07-28 1981-07-28 半導体装置の製造方法 Granted JPS5818940A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56117080A JPS5818940A (ja) 1981-07-28 1981-07-28 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56117080A JPS5818940A (ja) 1981-07-28 1981-07-28 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS5818940A true JPS5818940A (ja) 1983-02-03
JPS6256663B2 JPS6256663B2 (enrdf_load_stackoverflow) 1987-11-26

Family

ID=14702892

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56117080A Granted JPS5818940A (ja) 1981-07-28 1981-07-28 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS5818940A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61124154A (ja) * 1984-11-20 1986-06-11 Nec Corp 半導体装置の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61124154A (ja) * 1984-11-20 1986-06-11 Nec Corp 半導体装置の製造方法

Also Published As

Publication number Publication date
JPS6256663B2 (enrdf_load_stackoverflow) 1987-11-26

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