JPS58186996A - 多層回路基板の製造方法 - Google Patents
多層回路基板の製造方法Info
- Publication number
- JPS58186996A JPS58186996A JP7086182A JP7086182A JPS58186996A JP S58186996 A JPS58186996 A JP S58186996A JP 7086182 A JP7086182 A JP 7086182A JP 7086182 A JP7086182 A JP 7086182A JP S58186996 A JPS58186996 A JP S58186996A
- Authority
- JP
- Japan
- Prior art keywords
- insulating layer
- melting point
- insulating
- forming
- paste
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Laminated Bodies (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7086182A JPS58186996A (ja) | 1982-04-27 | 1982-04-27 | 多層回路基板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7086182A JPS58186996A (ja) | 1982-04-27 | 1982-04-27 | 多層回路基板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58186996A true JPS58186996A (ja) | 1983-11-01 |
| JPH0380358B2 JPH0380358B2 (forum.php) | 1991-12-24 |
Family
ID=13443760
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7086182A Granted JPS58186996A (ja) | 1982-04-27 | 1982-04-27 | 多層回路基板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58186996A (forum.php) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5141372A (en) * | 1989-07-04 | 1992-08-25 | Conver-Osr Ozean-Service-Reparatur-Ingenieurtechnik Gmbh | Coupling piece for releasably connecting containers |
| DE4042710C2 (de) * | 1990-09-25 | 2002-11-28 | Macgregor Conver Gmbh | Kuppelstück zum Verbinden von Containern |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5486765A (en) * | 1977-12-23 | 1979-07-10 | Tokyo Shibaura Electric Co | Multiilayer thick film circuit base board |
-
1982
- 1982-04-27 JP JP7086182A patent/JPS58186996A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5486765A (en) * | 1977-12-23 | 1979-07-10 | Tokyo Shibaura Electric Co | Multiilayer thick film circuit base board |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5141372A (en) * | 1989-07-04 | 1992-08-25 | Conver-Osr Ozean-Service-Reparatur-Ingenieurtechnik Gmbh | Coupling piece for releasably connecting containers |
| DE4042710C2 (de) * | 1990-09-25 | 2002-11-28 | Macgregor Conver Gmbh | Kuppelstück zum Verbinden von Containern |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0380358B2 (forum.php) | 1991-12-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS5852900A (ja) | セラミツク多層配線板の製造方法 | |
| JPS58186996A (ja) | 多層回路基板の製造方法 | |
| JP2839262B2 (ja) | チップ抵抗器とその製造方法 | |
| JPS60117796A (ja) | 多層配線基板及びその製造方法 | |
| JPH1098244A (ja) | 厚膜回路基板及びその製造方法 | |
| JPS62242325A (ja) | チツプコンデンサ−の製造方法 | |
| JP2001326301A (ja) | セラミック電子部品および電子装置 | |
| JP2569716B2 (ja) | 多層厚膜ic基板の製造法 | |
| JP2537893B2 (ja) | 電子回路基板の製造方法 | |
| JPS5810886A (ja) | 絶縁基板に導体回路を作成する方法 | |
| JP2551064B2 (ja) | セラミック多層基板の製造方法 | |
| JPS62193102A (ja) | セラミツク配線基板の製法 | |
| JP2710430B2 (ja) | パターン形成方法 | |
| JPS6088498A (ja) | セラミツクス多層配線基板の製造方法 | |
| JPH04293298A (ja) | 厚膜多層回路基板 | |
| JPS60167495A (ja) | 多層配線基板の製造方法 | |
| JPS61147597A (ja) | セラミック回路基板の製造方法 | |
| JPH0544200B2 (forum.php) | ||
| JPS6340396A (ja) | 厚膜集積回路の製造方法 | |
| JPS60154595A (ja) | 多層回路基板の製造方法 | |
| JPS5999787A (ja) | 厚膜配線基板 | |
| JPS60171793A (ja) | 多層配線基板の製造方法 | |
| JPS62119951A (ja) | 多層配線基板 | |
| JPH06260761A (ja) | 厚膜多層印刷基板の製造方法 | |
| JPS6194394A (ja) | 厚膜回路基板の製造方法 |