JPS58183251A - 銅張り積層板および積層板の製造法 - Google Patents

銅張り積層板および積層板の製造法

Info

Publication number
JPS58183251A
JPS58183251A JP6777482A JP6777482A JPS58183251A JP S58183251 A JPS58183251 A JP S58183251A JP 6777482 A JP6777482 A JP 6777482A JP 6777482 A JP6777482 A JP 6777482A JP S58183251 A JPS58183251 A JP S58183251A
Authority
JP
Japan
Prior art keywords
copper
resin
phenolic resin
laminate
manufacturing methods
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6777482A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0145415B2 (enrdf_load_stackoverflow
Inventor
中村　俊麿
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Shin Kobe Electric Machinery Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Kobe Electric Machinery Co Ltd filed Critical Shin Kobe Electric Machinery Co Ltd
Priority to JP6777482A priority Critical patent/JPS58183251A/ja
Publication of JPS58183251A publication Critical patent/JPS58183251A/ja
Publication of JPH0145415B2 publication Critical patent/JPH0145415B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O

Landscapes

  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
JP6777482A 1982-04-22 1982-04-22 銅張り積層板および積層板の製造法 Granted JPS58183251A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6777482A JPS58183251A (ja) 1982-04-22 1982-04-22 銅張り積層板および積層板の製造法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6777482A JPS58183251A (ja) 1982-04-22 1982-04-22 銅張り積層板および積層板の製造法

Publications (2)

Publication Number Publication Date
JPS58183251A true JPS58183251A (ja) 1983-10-26
JPH0145415B2 JPH0145415B2 (enrdf_load_stackoverflow) 1989-10-03

Family

ID=13354623

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6777482A Granted JPS58183251A (ja) 1982-04-22 1982-04-22 銅張り積層板および積層板の製造法

Country Status (1)

Country Link
JP (1) JPS58183251A (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPH0145415B2 (enrdf_load_stackoverflow) 1989-10-03

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