JPS58178533A - ウエ−ハ押上げ装置 - Google Patents

ウエ−ハ押上げ装置

Info

Publication number
JPS58178533A
JPS58178533A JP57061062A JP6106282A JPS58178533A JP S58178533 A JPS58178533 A JP S58178533A JP 57061062 A JP57061062 A JP 57061062A JP 6106282 A JP6106282 A JP 6106282A JP S58178533 A JPS58178533 A JP S58178533A
Authority
JP
Japan
Prior art keywords
wafer
guide
bracket
axle
air cylinder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57061062A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6238854B2 (enExample
Inventor
Katsuyoshi Kudo
勝義 工藤
Fumio Shibata
柴田　史雄
Norio Kanai
金井　謙雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP57061062A priority Critical patent/JPS58178533A/ja
Publication of JPS58178533A publication Critical patent/JPS58178533A/ja
Publication of JPS6238854B2 publication Critical patent/JPS6238854B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10P72/7626—

Landscapes

  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Jigs For Machine Tools (AREA)
JP57061062A 1982-04-14 1982-04-14 ウエ−ハ押上げ装置 Granted JPS58178533A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57061062A JPS58178533A (ja) 1982-04-14 1982-04-14 ウエ−ハ押上げ装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57061062A JPS58178533A (ja) 1982-04-14 1982-04-14 ウエ−ハ押上げ装置

Publications (2)

Publication Number Publication Date
JPS58178533A true JPS58178533A (ja) 1983-10-19
JPS6238854B2 JPS6238854B2 (enExample) 1987-08-20

Family

ID=13160299

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57061062A Granted JPS58178533A (ja) 1982-04-14 1982-04-14 ウエ−ハ押上げ装置

Country Status (1)

Country Link
JP (1) JPS58178533A (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6197841U (enExample) * 1984-12-04 1986-06-23
JPS63308337A (ja) * 1987-06-10 1988-12-15 Teru Kyushu Kk スピンナ−
JP2010280031A (ja) * 2009-06-04 2010-12-16 Ebara Corp ドレッシング装置およびドレッシング方法
CN110246783A (zh) * 2019-06-10 2019-09-17 宁波润华全芯微电子设备有限公司 一种去胶机夹持主轴

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6197841U (enExample) * 1984-12-04 1986-06-23
JPS63308337A (ja) * 1987-06-10 1988-12-15 Teru Kyushu Kk スピンナ−
JP2010280031A (ja) * 2009-06-04 2010-12-16 Ebara Corp ドレッシング装置およびドレッシング方法
US8517796B2 (en) 2009-06-04 2013-08-27 Ebara Corporation Dressing apparatus, dressing method, and polishing apparatus
CN110246783A (zh) * 2019-06-10 2019-09-17 宁波润华全芯微电子设备有限公司 一种去胶机夹持主轴
CN110246783B (zh) * 2019-06-10 2021-06-15 宁波润华全芯微电子设备有限公司 一种去胶机夹持主轴

Also Published As

Publication number Publication date
JPS6238854B2 (enExample) 1987-08-20

Similar Documents

Publication Publication Date Title
JPS58178533A (ja) ウエ−ハ押上げ装置
JP3120714B2 (ja) 導電性ボールの搭載装置
KR100222098B1 (ko) 도전성 볼의 탑재방법 및 이의 장치
JPH11207537A (ja) 止め輪装着装置
JPH098101A (ja) ダイエジェクタ装置
JPS63169242A (ja) 基板矯正保持方法及びその装置
JPH0666031U (ja) ウエハ押上げ装置
JP3149796B2 (ja) 電子部品実装装置
JPH0997807A (ja) チップのピックアップ方法
JPH04310331A (ja) ナットリフトアップ装置
JPH05154597A (ja) チャック装置
JPS6347390Y2 (enExample)
JPH05138461A (ja) ナツトスクリユへのボール供給方法
CN114378787B (zh) 一种机械手臂装置及其使用方法、基片处理系统
KR920008217Y1 (ko) 편향요크 조립용 파레트 리프터
JP2001291951A (ja) 導電性ボールの移載装置および移載方法
JPH11224882A (ja) チップの突き上げ装置および突き上げ方法
KR920008710Y1 (ko) 웨이퍼 홀딩장치
JPH01169822A (ja) がいし組立装置
JP3018820B2 (ja) スナップリング組付装置
JPH09155469A (ja) プレス型の穴抜装置
JPS6121130Y2 (enExample)
JPS5933975B2 (ja) 半導体搭載装置
CN118073268A (zh) 一种晶圆举升装置和晶圆举升方法
JPH0482684A (ja) 部品の実装方法及びその装置