JPS5816546A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS5816546A
JPS5816546A JP56114666A JP11466681A JPS5816546A JP S5816546 A JPS5816546 A JP S5816546A JP 56114666 A JP56114666 A JP 56114666A JP 11466681 A JP11466681 A JP 11466681A JP S5816546 A JPS5816546 A JP S5816546A
Authority
JP
Japan
Prior art keywords
semiconductor substrate
insulating film
conductive
conductive film
thickness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56114666A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6244813B2 (enrdf_load_stackoverflow
Inventor
Takehiko Kubota
久保田　武彦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP56114666A priority Critical patent/JPS5816546A/ja
Publication of JPS5816546A publication Critical patent/JPS5816546A/ja
Publication of JPS6244813B2 publication Critical patent/JPS6244813B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP56114666A 1981-07-22 1981-07-22 半導体装置 Granted JPS5816546A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56114666A JPS5816546A (ja) 1981-07-22 1981-07-22 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56114666A JPS5816546A (ja) 1981-07-22 1981-07-22 半導体装置

Publications (2)

Publication Number Publication Date
JPS5816546A true JPS5816546A (ja) 1983-01-31
JPS6244813B2 JPS6244813B2 (enrdf_load_stackoverflow) 1987-09-22

Family

ID=14643541

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56114666A Granted JPS5816546A (ja) 1981-07-22 1981-07-22 半導体装置

Country Status (1)

Country Link
JP (1) JPS5816546A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63152147A (ja) * 1986-12-17 1988-06-24 Nippon Denso Co Ltd アルミニウム合金配線装置およびその製造方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6417052U (enrdf_load_stackoverflow) * 1987-07-21 1989-01-27
JPS6436740U (enrdf_load_stackoverflow) * 1987-08-29 1989-03-06

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63152147A (ja) * 1986-12-17 1988-06-24 Nippon Denso Co Ltd アルミニウム合金配線装置およびその製造方法

Also Published As

Publication number Publication date
JPS6244813B2 (enrdf_load_stackoverflow) 1987-09-22

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