JPS58165365A - 厚膜ハイブリツド形式の電子回路製造方法、該方法を実施するための材料、および該方法により製造された回路 - Google Patents

厚膜ハイブリツド形式の電子回路製造方法、該方法を実施するための材料、および該方法により製造された回路

Info

Publication number
JPS58165365A
JPS58165365A JP57200501A JP20050182A JPS58165365A JP S58165365 A JPS58165365 A JP S58165365A JP 57200501 A JP57200501 A JP 57200501A JP 20050182 A JP20050182 A JP 20050182A JP S58165365 A JPS58165365 A JP S58165365A
Authority
JP
Japan
Prior art keywords
ink
conductive
manufacturing
layer
deposits
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57200501A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6361798B2 (enExample
Inventor
ロベ−ル・カサ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rhone Poulenc Specialites Chimiques
Original Assignee
Rhone Poulenc Specialites Chimiques
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rhone Poulenc Specialites Chimiques filed Critical Rhone Poulenc Specialites Chimiques
Publication of JPS58165365A publication Critical patent/JPS58165365A/ja
Publication of JPS6361798B2 publication Critical patent/JPS6361798B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/14—Conductive material dispersed in non-conductive inorganic material
    • H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/702—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof
    • H01L21/705—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof of thick-film circuits or parts thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1157—Using means for chemical reduction
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/125—Inorganic compounds, e.g. silver salt

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Dispersion Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Nanotechnology (AREA)
  • Inorganic Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
JP57200501A 1981-11-17 1982-11-17 厚膜ハイブリツド形式の電子回路製造方法、該方法を実施するための材料、および該方法により製造された回路 Granted JPS58165365A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR8121642A FR2516739A1 (fr) 1981-11-17 1981-11-17 Procede de fabrication de circuits electroniques de type hybride a couches epaisses, des moyens destines a la mise en oeuvre de ce procede et les circuits obtenus selon ce procede
FR81/21642 1981-11-17

Publications (2)

Publication Number Publication Date
JPS58165365A true JPS58165365A (ja) 1983-09-30
JPS6361798B2 JPS6361798B2 (enExample) 1988-11-30

Family

ID=9264146

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57200501A Granted JPS58165365A (ja) 1981-11-17 1982-11-17 厚膜ハイブリツド形式の電子回路製造方法、該方法を実施するための材料、および該方法により製造された回路

Country Status (6)

Country Link
US (2) US4517227A (enExample)
EP (1) EP0079845B1 (enExample)
JP (1) JPS58165365A (enExample)
DE (1) DE3270016D1 (enExample)
FR (1) FR2516739A1 (enExample)
IE (1) IE54007B1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59135796A (ja) * 1983-01-24 1984-08-04 日本電気株式会社 高密度多層配線基板
JPH01501432A (ja) * 1986-11-10 1989-05-18 マクダーミッド，インコーポレーテッド 多層プリント回路基板の製造方法

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2566611A1 (fr) * 1984-06-25 1985-12-27 Rhone Poulenc Rech Nouveaux circuits imprimes injectes et procede d'obtention
JPS63160352A (ja) * 1986-12-24 1988-07-04 Semiconductor Energy Lab Co Ltd 半導体装置の実装方法
JP2553872B2 (ja) * 1987-07-21 1996-11-13 東京応化工業株式会社 ホトレジスト用剥離液
KR890015299A (ko) * 1988-03-14 1989-10-28 다이요 유덴 가부시까가이샤 산화 금속 피막 저항기
US5853622A (en) * 1990-02-09 1998-12-29 Ormet Corporation Transient liquid phase sintering conductive adhesives
US5376403A (en) * 1990-02-09 1994-12-27 Capote; Miguel A. Electrically conductive compositions and methods for the preparation and use thereof
US5055164A (en) * 1990-03-26 1991-10-08 Shipley Company Inc. Electrodepositable photoresists for manufacture of hybrid circuit boards
DE59107712D1 (de) * 1990-09-13 1996-05-30 Ocg Microelectronic Materials Säurelabile Lösungsinhibitoren und darauf basierende positiv und negativ arbeitende strahlungsempfindliche Zusammensetzung
US5161541A (en) * 1991-03-05 1992-11-10 Edentec Flow sensor system
KR100223504B1 (ko) * 1992-08-28 1999-10-15 다카노 야스아키 혼성 집적 회로 장치
US5607503A (en) * 1993-09-03 1997-03-04 Refract-A-Gard Pty Limited Silica-based binder
US5573004A (en) * 1994-10-06 1996-11-12 Edentec Corporation Electrically stable electrode and sensor apparatus
GB2318532B (en) * 1996-10-22 2000-11-15 Strix Ltd Electric heaters
MXPA01001907A (es) * 1998-08-21 2003-05-15 Stanford Res Inst Int Impresion de circuitos y componentes electronicos.
US6605413B1 (en) 2001-03-29 2003-08-12 Advanced Micro Devices, Inc. Chemical treatment to strengthen photoresists to prevent pattern collapse
US6635409B1 (en) 2001-07-12 2003-10-21 Advanced Micro Devices, Inc. Method of strengthening photoresist to prevent pattern collapse
GB0117431D0 (en) * 2001-07-17 2001-09-12 Univ Brunel Method for printing conducting layer onto substrate
GB2380068B (en) * 2001-09-15 2005-08-03 Jaybee Graphics Low Conductive Ink Composition
US20060001726A1 (en) * 2001-10-05 2006-01-05 Cabot Corporation Printable conductive features and processes for making same
US6981318B2 (en) 2002-10-22 2006-01-03 Jetta Company Limited Printed circuit board manufacturing method
US7037447B1 (en) * 2003-07-23 2006-05-02 Henkel Corporation Conductive ink compositions
GB2411437B (en) 2004-02-28 2007-10-24 Rolls Royce Plc Aircraft gas turbine engines
WO2008118365A1 (en) 2007-03-22 2008-10-02 General Lasertronics Corporation Methods for stripping and modifying surfaces with laser-induced ablation
DE102007027473A1 (de) 2007-06-14 2008-12-18 Manroland Ag Drucktechnisch hergestellte funktionale Komponenten
US10112257B1 (en) 2010-07-09 2018-10-30 General Lasertronics Corporation Coating ablating apparatus with coating removal detection
US9431474B2 (en) * 2011-12-20 2016-08-30 Imec Metal-insulator-metal stack and method for manufacturing the same
US9895771B2 (en) 2012-02-28 2018-02-20 General Lasertronics Corporation Laser ablation for the environmentally beneficial removal of surface coatings
US10086597B2 (en) 2014-01-21 2018-10-02 General Lasertronics Corporation Laser film debonding method

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2993815A (en) * 1959-05-25 1961-07-25 Bell Telephone Labor Inc Metallizing refractory substrates
US3226256A (en) * 1963-01-02 1965-12-28 Jr Frederick W Schneble Method of making printed circuits
US3451813A (en) * 1967-10-03 1969-06-24 Monsanto Co Method of making printed circuits
GB1356577A (en) * 1970-08-27 1974-06-12 Atomic Energy Authority Uk Metalizing pastes
GB1374763A (en) * 1971-12-21 1974-11-20 Atomic Energy Authority Uk Metalising pastes
FR2184391A1 (en) * 1972-05-15 1973-12-28 Era Patents Ltd Glass enamel resists - from instituting reduced metal oxide in alumino borate glass
FR2435883A1 (fr) * 1978-06-29 1980-04-04 Materiel Telephonique Circuit integre hybride et son procede de fabrication
US4322316A (en) * 1980-08-22 1982-03-30 Ferro Corporation Thick film conductor employing copper oxide

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59135796A (ja) * 1983-01-24 1984-08-04 日本電気株式会社 高密度多層配線基板
JPH01501432A (ja) * 1986-11-10 1989-05-18 マクダーミッド，インコーポレーテッド 多層プリント回路基板の製造方法

Also Published As

Publication number Publication date
DE3270016D1 (en) 1986-04-24
FR2516739A1 (fr) 1983-05-20
IE54007B1 (en) 1989-05-10
EP0079845A1 (fr) 1983-05-25
US4756756A (en) 1988-07-12
EP0079845B1 (fr) 1986-03-19
IE822731L (en) 1983-05-17
JPS6361798B2 (enExample) 1988-11-30
US4517227A (en) 1985-05-14
FR2516739B1 (enExample) 1984-06-15

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