JPS58162463A - 金属細線自動送り装置 - Google Patents

金属細線自動送り装置

Info

Publication number
JPS58162463A
JPS58162463A JP57045021A JP4502182A JPS58162463A JP S58162463 A JPS58162463 A JP S58162463A JP 57045021 A JP57045021 A JP 57045021A JP 4502182 A JP4502182 A JP 4502182A JP S58162463 A JPS58162463 A JP S58162463A
Authority
JP
Japan
Prior art keywords
wire
metal wire
thin metal
spool
main roller
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57045021A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0462988B2 (enrdf_load_stackoverflow
Inventor
Hiroshi Hiroya
広谷　浩
Toshiji Tanabe
田辺　利治
Yukio Yamaguchi
幸雄 山口
Zenichiro Tabuchi
田「淵」　善一郎
Shingo Okazaki
岡崎　進吾
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electronics Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electronics Corp, Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electronics Corp
Priority to JP57045021A priority Critical patent/JPS58162463A/ja
Publication of JPS58162463A publication Critical patent/JPS58162463A/ja
Publication of JPH0462988B2 publication Critical patent/JPH0462988B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H59/00—Adjusting or controlling tension in filamentary material, e.g. for preventing snarling; Applications of tension indicators
    • B65H59/38—Adjusting or controlling tension in filamentary material, e.g. for preventing snarling; Applications of tension indicators by regulating speed of driving mechanism of unwinding, paying-out, forwarding, winding, or depositing devices, e.g. automatically in response to variations in tension
    • B65H59/384—Adjusting or controlling tension in filamentary material, e.g. for preventing snarling; Applications of tension indicators by regulating speed of driving mechanism of unwinding, paying-out, forwarding, winding, or depositing devices, e.g. automatically in response to variations in tension using electronic means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H49/00—Unwinding or paying-out filamentary material; Supporting, storing or transporting packages from which filamentary material is to be withdrawn or paid-out
    • B65H49/18—Methods or apparatus in which packages rotate
    • B65H49/34—Arrangements for effecting positive rotation of packages
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2701/00—Handled material; Storage means
    • B65H2701/30—Handled filamentary material
    • B65H2701/36—Wires
    • B65H2701/361—Semiconductor bonding wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Wire Bonding (AREA)
  • Tension Adjustment In Filamentary Materials (AREA)
JP57045021A 1982-03-19 1982-03-19 金属細線自動送り装置 Granted JPS58162463A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57045021A JPS58162463A (ja) 1982-03-19 1982-03-19 金属細線自動送り装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57045021A JPS58162463A (ja) 1982-03-19 1982-03-19 金属細線自動送り装置

Publications (2)

Publication Number Publication Date
JPS58162463A true JPS58162463A (ja) 1983-09-27
JPH0462988B2 JPH0462988B2 (enrdf_load_stackoverflow) 1992-10-08

Family

ID=12707680

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57045021A Granted JPS58162463A (ja) 1982-03-19 1982-03-19 金属細線自動送り装置

Country Status (1)

Country Link
JP (1) JPS58162463A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61263572A (ja) * 1985-03-29 1986-11-21 ジエラ−ド・パトリツク・マ−ナン リ−ル巻きワイヤ貯蔵および分与装置
KR100510175B1 (ko) * 2001-11-26 2005-08-30 주식회사 포스코 릴 케이블 자동 감지장치

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5132475U (enrdf_load_stackoverflow) * 1974-08-31 1976-03-10

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5132475U (enrdf_load_stackoverflow) * 1974-08-31 1976-03-10

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61263572A (ja) * 1985-03-29 1986-11-21 ジエラ−ド・パトリツク・マ−ナン リ−ル巻きワイヤ貯蔵および分与装置
KR100510175B1 (ko) * 2001-11-26 2005-08-30 주식회사 포스코 릴 케이블 자동 감지장치

Also Published As

Publication number Publication date
JPH0462988B2 (enrdf_load_stackoverflow) 1992-10-08

Similar Documents

Publication Publication Date Title
US2981491A (en) Wire dispensing apparatus
JPS6052893B2 (ja) ワイヤカツト放電加工機
JPS58162463A (ja) 金属細線自動送り装置
US2360741A (en) Wire distributor for wire-drawing machines
US7360675B2 (en) Wire bonder for ball bonding insulated wire and method of using same
JPH0320900B2 (enrdf_load_stackoverflow)
JPH0148656B2 (enrdf_load_stackoverflow)
JP6270920B2 (ja) ワイヤボンディング装置におけるワイヤ繰り出し機構
JPS60259329A (ja) ワイヤ放電加工機におけるワイヤ断線検出装置
JPH01318242A (ja) 断線検出機構およびそれを備えたワイヤボンディング装置
JP2511599B2 (ja) 極細線切断装置
JPS63219132A (ja) 金属細線自動送り装置
SU977531A1 (ru) Система нитеподачи круглов зальной машины
JPS60234734A (ja) 索状体の供給装置
JPH0276629A (ja) ワイヤ放電加工装置
JPS6348125Y2 (enrdf_load_stackoverflow)
JPS6081835A (ja) 自動ボンデイングワイヤ−通し機構
JPH05311520A (ja) 二重撚糸機
JPS6311692Y2 (enrdf_load_stackoverflow)
JPS62247537A (ja) ワイヤボンデイング装置
JPH1161U (ja) 二重撚糸機
JP2670526B2 (ja) ワイヤボンディング装置のカセット式ワイヤ供給装置
JPH06218628A (ja) ワイヤ放電加工装置
JP3337333B2 (ja) ワイヤ供給装置
JPS59150435A (ja) ワイヤボンデイング方法