JPS58162463A - Automatic feeder for metallic fine-wire - Google Patents
Automatic feeder for metallic fine-wireInfo
- Publication number
- JPS58162463A JPS58162463A JP57045021A JP4502182A JPS58162463A JP S58162463 A JPS58162463 A JP S58162463A JP 57045021 A JP57045021 A JP 57045021A JP 4502182 A JP4502182 A JP 4502182A JP S58162463 A JPS58162463 A JP S58162463A
- Authority
- JP
- Japan
- Prior art keywords
- wire
- metal wire
- thin metal
- spool
- main roller
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H59/00—Adjusting or controlling tension in filamentary material, e.g. for preventing snarling; Applications of tension indicators
- B65H59/38—Adjusting or controlling tension in filamentary material, e.g. for preventing snarling; Applications of tension indicators by regulating speed of driving mechanism of unwinding, paying-out, forwarding, winding, or depositing devices, e.g. automatically in response to variations in tension
- B65H59/384—Adjusting or controlling tension in filamentary material, e.g. for preventing snarling; Applications of tension indicators by regulating speed of driving mechanism of unwinding, paying-out, forwarding, winding, or depositing devices, e.g. automatically in response to variations in tension using electronic means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H49/00—Unwinding or paying-out filamentary material; Supporting, storing or transporting packages from which filamentary material is to be withdrawn or paid-out
- B65H49/18—Methods or apparatus in which packages rotate
- B65H49/34—Arrangements for effecting positive rotation of packages
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2701/00—Handled material; Storage means
- B65H2701/30—Handled filamentary material
- B65H2701/36—Wires
- B65H2701/361—Semiconductor bonding wires
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Tension Adjustment In Filamentary Materials (AREA)
- Wire Bonding (AREA)
Abstract
Description
【発明の詳細な説明】
本発明は、主として、半導体装置の組立て工程で用いら
れる金属細線の供給を円滑にする金属細線自動送シ装置
に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention primarily relates to an automatic thin metal wire feeding device that facilitates the supply of thin metal wires used in the assembly process of semiconductor devices.
半導体装置、たとえば、トランジスタの組立て工程では
、同トランジスタのべ〜ス、エミッタの各電極部を外部
電極リードに接続するのに、金細線カ用イラれ、この細
線接続にワイヤボンダと称する組立て機が使用される。In the assembly process of semiconductor devices, such as transistors, thin gold wires are used to connect the base and emitter electrodes of the transistor to external electrode leads, and an assembly machine called a wire bonder is used to connect these thin wires. used.
ところで、この種のワイヤボンダで取り扱かわれる金属
細線は直径が２０μｍ程度の極〈細いものであるため、
同ワイヤポンダの稼働中にも、しばしば、断線を起し、
これがその組立て作業の円滑性を妨げる要因になつてい
る。By the way, the thin metal wire handled by this type of wire bonder is extremely thin, with a diameter of about 20 μm.
While the wireponder is in operation, wire breaks often occur.
This is a factor that hinders the smoothness of the assembly work.
従来のワイヤ宗ンダの例では一金属細線、たとえば、上
述のような金細線（金ワイヤ）を暫定のスプールに巻き
付けておき、同スプールをワイヤハウスと呼ばれる位置
に滑車的に取シ付け、そのワイヤをキャピラリーと称す
るワイヤ先端保持具の上下運動によって送り出しながら
、そのワイヤの接続作業が行なわれる。このような従来
装置においては、キャピラリによってワイヤを引き出す
ので、その引張り応力により、しばしば、そのワイヤの
切断が起こり、同ワイヤの通し直し作業を要する。また
、キャピラリーによって引き出す際のワイヤ引張り応力
を軽減しなければならないため、スプールへのワイヤの
巻付けを多重巻きにできないという難点があり、再再、
そのスプールを取シ替える作業も加わって、そのワイヤ
通しの作業が工程の能率向上の妨げになっていた。In conventional wire warping, a thin metal wire, such as the gold wire described above, is wound around a temporary spool, and the spool is attached like a pulley to a position called a wire house. The wire is connected while the wire is fed out by vertical movement of a wire tip holder called a capillary. In such conventional devices, since the wire is pulled out using a capillary, the tensile stress often causes the wire to break, and the wire must be rethreaded. In addition, since the tensile stress of the wire must be reduced when it is pulled out using a capillary, there is a problem in that the wire cannot be wound around the spool multiple times.
In addition to the work of replacing the spool, the work of threading the wire was an impediment to improving the efficiency of the process.
本発明は、上述の従来装置８にみられた問題点を解消し
て、効率のよいワイヤボンダの実現に寄与するものであ
る。以下、実施例により、不発明の装置を詳しくのべる
。The present invention solves the problems seen in the conventional device 8 described above and contributes to realizing an efficient wire bonder. Hereinafter, the inventive device will be described in detail by way of examples.
第１図は、本発明の実施例装置の主要部を展開して示し
たもので、枠体１に固定して取り付けられた主ロー２２
と、これにベルト３で連結された送り出しロー−）４と
をそなえ、また、ワイヤ５の径路の内側上方と外側下方
とに接触子６．７を配設している。ワイヤ６はスプール
８に巻き付けられたものを用い、同スプール８をスプー
ルホルダ９に装着して、同スプールホルダ９をその内側
面に設けられた磁石片１ｏによって主ロニラ３に取り付
けて、所定の径路に張り渡し、その先端をキャピラリ１
１に通して保持される。そして、ワイヤ６は主ロール２
を、送り出しロール４と連動させて、たとえば、電動機
等の回動手段（不図示）で回しながら順次送り出される
。このとき、ワイヤの送り量が増えると、第２図で実線
的に示したように、ワイヤ６が弛んで、その自重によっ
て垂れ下がり、同ワイヤ径路の外側下方に設けられた接
触子７と接触する。そこで、ワイヤ６が接触子７に接触
したとき、主ロール２卦よび送シ出しロール４の回動を
停止させる。また、キャピラリー１１の駆使によって、
半導体チップ上の所定電極部と外部電極リードとのワイ
ヤボンディングを行ない、そのワイヤが消費されると、
第２図で点線的に示したように、同ワイヤ６は引張られ
て持ち上がり、同ワイヤ径路の内側上方に設けられたも
う１つの接触子６と接触する。ワイヤ５が接触子６と接
触した時点で、再び、主ロール２および送シ出しロール
を回動させる。かくして、ワイヤ６が両方の接触子６，
７に接触した時点で、主ロール２および送り出しロール
４が始動あるいは停止の動作をなすようにしておけば、
ワイヤの送り出し量が過大になることもなく、また、そ
の量が不足して、ワイヤに大きな張力が加わって切断さ
れることもなくなる。とくに、第２図に示したように、
ワイヤ５が上方の接触子６に接触した状態でも余裕をも
って垂れ下がるように設定し、また、下方の接触子７の
位置を調枯して設定しておけば、同ワイヤに加わる張力
がほぼ一定になるように制御でき、これによって、ワイ
ヤボンディングの工程におけるワイヤの張力に基因した
切断の故障を絶無になし、得る。FIG. 1 is an exploded view of the main parts of an apparatus according to an embodiment of the present invention, in which a main row 22 fixedly attached to a frame 1
and a feed-out row (4) connected thereto by a belt 3, and contacts 6.7 are provided above and below the path of the wire 5 on the inside and outside. The wire 6 is wound around a spool 8, the spool 8 is attached to a spool holder 9, the spool holder 9 is attached to the main lonilla 3 by a magnet piece 1o provided on its inner surface, and a predetermined position is set. Stretch it across the path and connect the tip with capillary 1.
1 and is held throughout. The wire 6 is connected to the main roll 2
are successively fed out while being rotated by a rotating means (not shown) such as an electric motor in conjunction with the feeding roll 4. At this time, as the wire feed rate increases, the wire 6 becomes slack and hangs down due to its own weight, as shown by the solid line in FIG. . Therefore, when the wire 6 comes into contact with the contactor 7, the rotation of the main roll 2 and the feed roll 4 is stopped. In addition, by making full use of capillary 11,
When wire bonding is performed between a predetermined electrode part on a semiconductor chip and an external electrode lead, and the wire is consumed,
As shown in dotted lines in FIG. 2, the wire 6 is pulled up and comes into contact with another contact 6 located above and inside the wire path. When the wire 5 comes into contact with the contactor 6, the main roll 2 and the feed roll are rotated again. Thus, the wire 6 connects both contacts 6,
If the main roll 2 and the delivery roll 4 are made to start or stop at the time of contact with the roll 7,
The amount of wire fed out will not become excessive, and the wire will not be cut due to a large tension being applied to the wire due to an insufficient amount. In particular, as shown in Figure 2,
If the wire 5 is set so that it hangs down with a margin even when it is in contact with the upper contact 6, and the lower contact 7 is set so as to be adjusted, the tension applied to the wire will be almost constant. As a result, cutting failures due to wire tension in the wire bonding process can be completely eliminated.
この実施例装置において、送り出しローラ４はスプール
８に巻き付けられているワイヤ６を解き離すのに有効で
ある。すなわち、ワイヤが極く細い金線であると、スプ
ール面や細線同志との表面接着性、自重、空気抵抗ある
いは慣性などの要因によって、第３図で点線により示し
たように、ワイヤがスプールにまとい付いて離れにくい
現象がみられるが、送り出しロー２４を使用することに
よシ、その離れにくさが解消され、同図実線で示される
ように、スプールからのワイヤーれがよくなる。また、
この送シ出しローラ４はガラス製にすることによシ、ワ
イヤのすべ勺もよく、安定した解き離しかできる。In this embodiment, the delivery roller 4 is effective in unwinding the wire 6 from the spool 8. In other words, if the wire is an extremely thin gold wire, the wire will stick to the spool as shown by the dotted line in Figure 3 due to factors such as surface adhesion to the spool surface and other thin wires, its own weight, air resistance, or inertia. There is a phenomenon in which the wires get stuck together and are difficult to separate, but by using the feed-out row 24, this difficulty in separating is resolved, and as shown by the solid line in the same figure, the wires come loose from the spool better. Also,
By making the feed roller 4 made of glass, the wire can be smoothly moved and the wire can be unraveled stably.
さらに、この実施例装置において、接触子６゜アはスイ
ッチの一方の電極であってもよい。すなわち、ワイヤの
導電炸とその低接触抵抗性を利用して、このワイヤ５が
接触子６あるいは同７に接触したときに、所定の制御回
路が閉成されるように、各接触子６，７とワイヤ６との
間に所定の電位を与えた構成をなすこともできる。この
場合、ワイヤ６側を接地電位とし、かつ、各接触子６゜
７の印加電位ならびに接触時の動作電流は最小限に留め
るのが原則である。なお、同実施例装置において、接触
子６，７が、直接、スイッチの一方の電極ではなく、こ
れにワイヤ６が接触したときに所定の制御回路系を閉成
するためのスイッチに連接されたものであってもよいこ
とは、もちろんのことである。Furthermore, in this embodiment device, the contactor 6a may be one electrode of a switch. That is, by utilizing the conductive burst of the wire and its low contact resistance, each contactor 6, It is also possible to adopt a configuration in which a predetermined potential is applied between the wire 7 and the wire 6. In this case, as a general rule, the wire 6 side is set to the ground potential, and the potential applied to each contactor 6.7 and the operating current at the time of contact are kept to a minimum. In addition, in the device of the same embodiment, the contacts 6 and 7 are not directly connected to one electrode of the switch, but are connected to a switch for closing a predetermined control circuit system when the wire 6 comes into contact with this. Of course, it can be anything.
以上の実施例により詳しくのべたように、本発明は、要
約すると、金属細線スプールを取り付けた主ローラ、同
主ローラに連動された上記金属細線送り出しローラ、上
記スプールから送り出される上記金属細線の所定の弛み
を検知して応動する第１のスイッチ、同金属細線の所定
の張りを検知して応動する第２のスイッチをそなえて、
上記第１および第２のスイッチの動作により上記主ロー
ラの回動を制御することを特徴とする金属細線自動送シ
装置を提供するものである。従って、本発明の装置によ
れば、ワイヤポンディングの工程で、キャピラリーによ
ってワイヤを引き出して使用する従来装置にくらべて、
そのワイヤの切断故障率が格段に低減され、同ワイヤボ
ンディングの作業能率を大幅に向上させることがで酋る
。また、本発明装置によれば、ワイヤが自動的に送り出
され、しかも、ワイヤ自身にはほとんど引張り応力が加
わらないだめ、スプールに巻き付けられたワイヤは、同
スプールの大きさ、巻き量に無関係で取り扱うことがで
き、ワ身ヤポンダの自動化を一層促進することができる
。As described in detail in the above embodiments, the present invention can be summarized as follows: a main roller to which a fine metal wire spool is attached, a fine metal wire delivery roller interlocked with the main roller, and a predetermined amount of the fine metal wire fed out from the spool. A first switch that detects the slackness of the thin metal wire and responds, and a second switch that detects the predetermined tension of the thin metal wire and responds.
The present invention provides an automatic thin metal wire feeding device characterized in that the rotation of the main roller is controlled by the operation of the first and second switches. Therefore, according to the device of the present invention, compared to the conventional device which uses a capillary to pull out the wire in the wire bonding process,
The wire cutting failure rate is significantly reduced, and the wire bonding work efficiency is greatly improved. Furthermore, according to the device of the present invention, the wire is automatically fed out, and since almost no tensile stress is applied to the wire itself, the wire wound around the spool is independent of the size and amount of winding of the spool. It is possible to further promote the automation of the wrapping machine.
第１図は本発明実施例の主要部展開図、第２図および第
３図はその動作状態の説明図である。
１・・・・・・枠体、２・・・・・・主ローラ、３・・
・・・・ベルト、４・・・・・・送り出しローラ、５・
・・・・・ワイヤ、６．７・・・・・・接触子、８−・
・・・・スプール、９・・・・・・スプールホルダ、１
ｏ・・・・・・磁石片、１１・・・・・・キャピラリ。FIG. 1 is an exploded view of the main parts of an embodiment of the present invention, and FIGS. 2 and 3 are illustrations of its operating state. 1...Frame body, 2...Main roller, 3...
...Belt, 4...Feeding roller, 5.
...Wire, 6.7...Contactor, 8-...
... Spool, 9 ... Spool holder, 1
o... Magnet piece, 11... Capillary.
Claims (1)
プールから送シ出される前記金属細線の所定の弛みを検
知して応動する第１のスイッチ、同金属細勝の所定の張
りを検知して応動する第２のスイッチをそなえて、前記
第１および第２のスイッチの動作により前記主ローラの
回動を制御することを特徴とする金属細線自動送り装置
。 （巧 第１および第２のスイッチが、金属細線の弛み、
張りに応じて、同金属細線の接触により応動することを
特徴とする特許請求の範囲第１項に記載の金属細線自動
送り装置。 （３）第１のスイッチが金属細線の弛みによる接触で応
動して、主ローラの回動を停止させ、第２のスイッチが
前記金属細線の、張りによる接触で応動して、前記主ロ
ーラの回動を始めさせる電動機制御手段に接続されたこ
とを特徴とする特許端＊範囲第１項または第２項に記載
の金属細線自動送シ装置。 （４）主ローラに連動して、金属細線の送り出しを補助
する送り出しローラをそなえたことを特徴とする特許請
求の範囲第１項に記載の金属細線自動送り装置。[Scope of Claims] (1) A main roller to which a spool of thin metal wire is attached; a first switch that detects and responds to a predetermined slack in the thin metal wire fed from the spool; An automatic fine metal wire feeding device comprising a second switch that detects and responds to tension, and controls rotation of the main roller by operating the first and second switches. (Takumi The first and second switches are activated when the thin metal wire is loosened.
2. The automatic thin metal wire feeding device according to claim 1, wherein the automatic thin metal wire feeding device responds to the tension by contacting the thin metal wire. (3) The first switch responds to the contact caused by the loosening of the thin metal wire and stops the rotation of the main roller, and the second switch responds to the contact caused by the tension of the thin metal wire to stop the rotation of the main roller. The automatic thin metal wire feeding device according to item 1 or 2 of the patent application, characterized in that the device is connected to a motor control means for starting rotation. (4) The automatic thin metal wire feeding device according to claim 1, further comprising a feed roller that is interlocked with the main roller and assists in feeding out the thin metal wire.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57045021A JPS58162463A (en) | 1982-03-19 | 1982-03-19 | Automatic feeder for metallic fine-wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57045021A JPS58162463A (en) | 1982-03-19 | 1982-03-19 | Automatic feeder for metallic fine-wire |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58162463A true JPS58162463A (en) | 1983-09-27 |
| JPH0462988B2 JPH0462988B2 (en) | 1992-10-08 |
Family
ID=12707680
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57045021A Granted JPS58162463A (en) | 1982-03-19 | 1982-03-19 | Automatic feeder for metallic fine-wire |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58162463A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61263572A (en) * | 1985-03-29 | 1986-11-21 | ジエラ−ド・パトリツク・マ−ナン | Reel winding wire storing and dispensing device |
| KR100510175B1 (en) * | 2001-11-26 | 2005-08-30 | 주식회사 포스코 | Apparatus for automatic detecting of reel cable |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5132475U (en) * | 1974-08-31 | 1976-03-10 |
-
1982
- 1982-03-19 JP JP57045021A patent/JPS58162463A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5132475U (en) * | 1974-08-31 | 1976-03-10 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61263572A (en) * | 1985-03-29 | 1986-11-21 | ジエラ−ド・パトリツク・マ−ナン | Reel winding wire storing and dispensing device |
| KR100510175B1 (en) * | 2001-11-26 | 2005-08-30 | 주식회사 포스코 | Apparatus for automatic detecting of reel cable |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0462988B2 (en) | 1992-10-08 |
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