JPH0143868Y2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an air tension control device used in a wire bonding device.

Generally, in small circuit boards, electrical wiring between IC terminals and lead wires formed on the circuit board is performed using several types of thin metal wires (10 μm to 50 μm).

Conventionally, during this bonding work, there were cases where metal wires were cut or metal wires of uneven length were supplied from the capillary section onto the board.
These can cause short circuit boards, and are one of the causes of lower yields in IC manufacturing.

The main cause of this series of phenomena is the sagging of the metal wire installed inside the wire bonding equipment, so various methods of physically controlling the wire tension have been studied as ways to improve this problem. However, it has not yet been possible to completely remove the slack.

The present invention overcomes the above-mentioned drawbacks of the prior art, and aims to provide an air tension control device that eliminates slack in metal wires, improves yield, and enables good bonding work.

That is, in the present invention, an insertion hole for passing a metal wire is provided through the main body of the device, and a small hole portion with a small hole diameter is formed approximately in the center of the insertion hole. The gist of the air tension control device is that air supply holes for air supply are connected to both sides of the air tension control device.

Hereinafter, embodiments of the present invention will be described in detail based on the drawings.

FIG. 1 shows an embodiment of the air tension control device of the present invention, where 1 is an air tension control device (hereinafter simply referred to as the device). Further, 2 in the figure is a metal wire inserted into the device 1. Furthermore, numeral 3 in the figure is a main body of the device, and an insertion hole 4 through which the metal wire 2 is inserted is provided through the main body 3.

The insertion hole 4 is composed of an insertion part 5, a pore part 6, and a discharge part 7, and the diameter of the pore part 6 is extremely smaller than that of the insertion part 5 and the discharge part 7.

The ratio of the pore diameter of the pore section 6 to the pore diameter of the insertion section 5 and the ratio of the pore diameter of the pore section 6 to the pore diameter of the discharge section 7 are 2/5 or less, preferably 1/10 or less.

Further, a tapered part 8 is provided at the boundary between the insertion part 5 and the pore part 6, so that the metal wire 2 can be easily inserted into the pore part 6 from the insertion part 5.

Air supply holes 9 and 10 for supplying air are connected to both sides of the small hole portion 6 of the insertion hole 4, respectively. The other end of each supply hole 9, 10 is connected to a switching valve 11.

The switching valve 11 is configured to be slidable within the device main body 3, and is provided with a wide ring groove-shaped connection portion 13 that connects to the air supply portion 12 provided in the device main body 3 and the air supply hole 9 or 10. There is.

When the switching valve 11 is set in a state protruding toward the discharge part 7 side of the insertion hole 4 as shown in FIG. 1, the connecting part 13 of the switching valve 11 and the air supply hole 10 are connected, and the air supply The hole 9 is in a closed state. On the other hand, when the switching valve 11 is slid and set in a state protruding toward the insertion portion 5 as shown in FIG. 2, the connecting portion 13 and the air supply hole 9 are connected, and the air
0 is a closed state.

The operation of the device 1 configured as described above will be explained below.

FIG. 3 shows an example of a wire bonding device 14 using the device 1 of the present invention.
is a compressor, and the compressor 15
is connected to the air supply section 12 of the device 1 by a hose 18 via an air filter 16 and a regulator 17 that controls the mounting speed of the metal wire 2 and the strength of the tension.

A vinyl tube 19 is attached to the end of the discharge portion 7 of the insertion hole 4.

Reference numeral 20 indicates a clamper, and 21 a capillary reach tip, each of which is movable up and down.

Further, 22 indicates an IC board, and 23 indicates a lead, each of which is provided on a lead frame 24. The lead frame 24 is placed on a table (not shown), and the table is movable in the horizontal direction. It is configured.

The metal wire 2 wound around the bobbin 25 is inserted into the insertion portion 4 of the device 1, and set through the vinyl tube 19, clamper 20 and capillary tip 21.

At this time, if the device 1 is set so that the connection part 13 of the switching valve 11 is connected to the air supply hole 10 on the discharge part 7 side of the insertion hole 4 as shown in FIG. The cleanliness of the air is increased in the air filter 16 and introduced into the air supply section 12 in the device 1 via the regulator 17.The introduced air flows from the connection section 13 of the switching valve 11 to the air supply hole 10
and is discharged to the outside of the device 1 through the discharge portion 7 of the insertion hole 4. The hole diameter of the pore part 6 of the insertion hole 4 is the discharge part 7.
Since the diameter of the hole is extremely smaller than that of the metal wire 2, the air pressure decreases in the insertion portion 5 of the insertion hole 4, and air flows in the direction of the fine hole 6.
When the metal wire 2 is inserted into the insertion section 5, the metal wire 2 is easily inserted into the outside of the apparatus 1 through the insertion section 5, the pore section 6, and the discharge section 7, and is finally introduced all at once to the tip of the capillary reach tip 21. Therefore, the metal wire 2 can be easily set.

After setting the metal wire 2, as shown in FIG. 2, slide the switching valve 11 to switch it to the opposite direction, that is, to connect the connecting part 13 to the air supply hole 9 on the insertion part 5 side. After that, air is supplied from the compressor 15 again. At this time, the air introduced from the air supply section 12 is discharged to the outside of the device 1 through the switching valve 11, the air supply hole 9, and the insertion section 5 of the insertion hole 4. Therefore,
This time, the air pressure decreases in the discharge section 7 of the insertion hole 4, and air flows from the discharge section 7 toward the pore section 6. As a result, the metal wire 2 moves from the discharge section 7 toward the insertion section 5. You will be under pressure.

For example, as shown in FIG. 4, the bonding operation is performed by bonding the metal wire 2 to the IC board 22 (FIG. 4A), and then the clamper 20 is opened and the clamper 20 and the capillary reach tip 21 are raised to a predetermined position ( FIG. 4B) At this time, as mentioned above, the metal wire 2 is always pulled in the direction of the device 1 by the device 1, so there is no slack. Next, the clamper 20 closes again, and the table (not shown) moves to move the lead frame 24 in the horizontal direction, and the clamper 20 and capillary reach tip 21 descend to move the metal wire 2 to the position of the lead 23 and perform bonding. (Figure 4 C). At this time, the clamper 20 pulls out the metal wire 2 at the top against the tension of the device 1, but
Since the metal wire 2 is always pulled in the direction of the device 1 by the device 1, even if some slack occurs in the metal wire 2 on the upper part of the clamper 20 due to inertia when the metal wire 2 is pulled out, the device 1 The slack is eliminated by the tension.

In this way, since the metal wire 2 is always pulled in the direction of the device 1 by the device 1 during the bonding operation, the metal wire 2 of the required length is supplied between the IC board 22 and the leads 23, and the IC board 22, Good bonding work can be performed without causing problems such as slack in the metal wire 2 between the leads 23 and cutting of the metal wire 2.

As explained above, the device of the present invention has an insertion hole for passing a metal wire through the device body, and a small hole portion with a small hole diameter is formed approximately in the center of the insertion hole. Since air supply holes for air supply are connected to both sides of the pore part, when used in a wire bonding machine, the metal wire is constantly pulled in the direction of the machine during bonding work, and the bonding This prevents the metal wires from sagging during installation, which in turn prevents shortening of the circuit board.
This has the effect of increasing the yield of IC production.

Furthermore, it has various effects such as the ability to easily insert metal wires into the device.

[Brief explanation of the drawing]

The drawings show an embodiment of the present invention. Figures 1 and 2 are longitudinal sectional views showing an embodiment of the air tension control device of the present invention, and Figure 3 is a wire bonding device using the device of the present invention. FIG. 4 is a schematic side view showing an example of a bonding process. DESCRIPTION OF SYMBOLS 1...Air tension control device, 2...Metal wire, 3...Device main body, 4...Through hole, 6...Small hole portion, 9, 10...Air supply hole.

Claims (1)

[Scope of utility model registration request] An insertion hole for passing a metal wire is provided through the main body of the device, and a small hole portion with a small hole diameter is formed approximately in the center of the insertion hole, and air supply holes are provided on both sides of the hole portion of the insertion hole. An air tension control device characterized in that the air tension control device is formed by connecting air supply holes of.