JPS6090836U - Air tension control device - Google Patents

Air tension control device

Info

Publication number
JPS6090836U
JPS6090836U JP18442083U JP18442083U JPS6090836U JP S6090836 U JPS6090836 U JP S6090836U JP 18442083 U JP18442083 U JP 18442083U JP 18442083 U JP18442083 U JP 18442083U JP S6090836 U JPS6090836 U JP S6090836U
Authority
JP
Japan
Prior art keywords
control device
tension control
air tension
wires
metal wires
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP18442083U
Other languages
Japanese (ja)
Other versions
JPH0143868Y2 (en
Inventor
三橋　江史
Original Assignee
アダマンド工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by アダマンド工業株式会社 filed Critical アダマンド工業株式会社
Priority to JP18442083U priority Critical patent/JPS6090836U/en
Publication of JPS6090836U publication Critical patent/JPS6090836U/en
Application granted granted Critical
Publication of JPH0143868Y2 publication Critical patent/JPH0143868Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8512—Aligning
    • H01L2224/85148—Aligning involving movement of a part of the bonding apparatus

Landscapes

  • Wire Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

□　第１図はホンディング装置に対する本考案装置の挿
入位置を示すもので、第２図及び第３図は本考案装置の
構造及び機構を説明する、詳細断面図と側面図を示すも
、のである。 ア・・・・・・コンプレッサー、イ・・・・・・エアー
フィルター、つ・・・・・・本考案装置、工・・・・・
・レギュレーター、オ・・・・・・第１クランパー、力
・・・・・・第２クランパー、　　−キ・・・・・・キ
ャピラリーチップ、り・・・・・・ＩＣ基板、ケ・・・
・・・リード、コ・・・・・・ビニールチューブ、す・
・・・・・ワイヤー、シ・・・・・・ボビン。□ Figure 1 shows the insertion position of the device of the present invention into the honding device, and Figures 2 and 3 show detailed sectional views and side views to explain the structure and mechanism of the device of the present invention. be. A... Compressor, B... Air filter,... Device of this invention, Engineering...
・Regulator, O...First clamper, Force...Second clamper, -Key...Capillary chip, Ri...IC board, cable...
...Lead, co...vinyl tube, su...
...wire, wire, bobbin.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ワイヤーホンディング装置によるボンディング作業で生
じる金属線のたるみを除去し、併せてＩＣの端子からリ
ード線へ配線される金属線のループ形状を一定にするこ
とを目的として、使用細線の装置を容易に行なう事がで
きる、図２の様な構造を有したエアーテンション制御装
置。With the aim of removing slack in metal wires that occurs during bonding work using wire bonding equipment, and at the same time making the loop shape of metal wires wired from IC terminals to lead wires constant, it is easy to use equipment that uses thin wires. An air tension control device with a structure as shown in Fig. 2 that can perform
JP18442083U 1983-11-29 1983-11-29 Air tension control device Granted JPS6090836U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18442083U JPS6090836U (en) 1983-11-29 1983-11-29 Air tension control device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18442083U JPS6090836U (en) 1983-11-29 1983-11-29 Air tension control device

Publications (2)

Publication Number Publication Date
JPS6090836U true JPS6090836U (en) 1985-06-21
JPH0143868Y2 JPH0143868Y2 (en) 1989-12-19

Family

ID=30398882

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18442083U Granted JPS6090836U (en) 1983-11-29 1983-11-29 Air tension control device

Country Status (1)

Country Link
JP (1) JPS6090836U (en)

Also Published As

Publication number Publication date
JPH0143868Y2 (en) 1989-12-19

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