JPH03263844A - Insertion of wire into capillary in wire bonder - Google Patents

Insertion of wire into capillary in wire bonder

Info

Publication number
JPH03263844A
JPH03263844A JP2063232A JP6323290A JPH03263844A JP H03263844 A JPH03263844 A JP H03263844A JP 2063232 A JP2063232 A JP 2063232A JP 6323290 A JP6323290 A JP 6323290A JP H03263844 A JPH03263844 A JP H03263844A
Authority
JP
Japan
Prior art keywords
wire
capillary
electrode
clamper
interval
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2063232A
Other languages
Japanese (ja)
Other versions
JP2765168B2 (en
Inventor
Kazuyuki Funatsu
船津　和幸
Kyoichi Saida
斎田　京市
Masayoshi Mori
森　政義
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP2063232A priority Critical patent/JP2765168B2/en
Publication of JPH03263844A publication Critical patent/JPH03263844A/en
Application granted granted Critical
Publication of JP2765168B2 publication Critical patent/JP2765168B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/78268—Discharge electrode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85009—Pre-treatment of the connector or the bonding area
    • H01L2224/8503—Reshaping, e.g. forming the ball or the wedge of the wire connector
    • H01L2224/85035—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball"
    • H01L2224/85045—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball" using a corona discharge, e.g. electronic flame off [EFO]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/1016—Shape being a cuboid
    • H01L2924/10162—Shape being a cuboid with a square active surface

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To regulate an interval of a lower end of a wire to be again led from the lower end of a capillary to an electrode to a suitable size by leading a wire until it is brought into contact with an electrode, detecting the lower end of the wire, then clamping the wire, raising it, and regulating the interval of the lower end of the wire to the electrode. CONSTITUTION:In a wire bonder for leading a wire 4 inserted into a capillary 1 from the lower end of the capillary 1 while clamping the wire 4 by a clamper 12 and connecting a semiconductor chip to the electrode of a board via the wire 4, the clamper 12 is moved up and down, the wire 4 is led from the lower end of the capillary 1 until it is brought into contact with an electrode 9a waiting under the capillary 1, the lower end of the wire 4 is detected, the wire 4 is then clamped by the clamper 12, raised, and an interval L' from the lower end of the wire 4 to the electrode 9a is regulated. For example, after the contact of the lower end of the wire 4 with the electrode 9a is detected, the interval L' from the lower end of the wire 4 to the electrode 9a is regulated to a size capable of forming a melted ball 14 of a desired size by an electric spark.

Description

【発明の詳細な説明】 （産業上の利用分野） 本発明はワイヤボンダにおけるキャピラリへのワイヤの
挿通方法に関し、詳しくは、ワイヤボンディングの作業
中に、ワイヤが切れたような場合に、このワイヤの下端
部を、キャピラリの下端部から所定長導出させて、ワイ
ヤの下端部と電極部の間隔を調整するための方法に関す
る。Detailed Description of the Invention (Field of Industrial Application) The present invention relates to a method for inserting a wire into a capillary in a wire bonder. The present invention relates to a method for adjusting the distance between the lower end of a wire and an electrode by extending the lower end by a predetermined length from the lower end of a capillary.

（従来の技術） 半導体チップの電極と、半導体チ・７ブが搭載されたリ
ードフレームのような基板の電極を接続するワイヤボン
ダは、極細の金線のようなワイヤを、クランパーにより
クランプしながら、キャピラリの下端部から導出し、こ
のワイヤの下端部に電極部を接近させて、電気的スパー
クにより、溶融ボールを形成したうえで、半導体チップ
と基板の電極を接続するようになっている。(Prior art) A wire bonder that connects the electrodes of a semiconductor chip and the electrodes of a substrate such as a lead frame on which a semiconductor chip is mounted uses a clamper to clamp a wire such as an extremely thin gold wire. The wire is led out from the lower end of the capillary, and the electrode portion is brought close to the lower end of the wire to form a molten ball by an electric spark, and then the semiconductor chip and the electrodes of the substrate are connected.

ところが、ボンディング作業中には、ワイヤは切れやす
いものであり、このため、特公平１−３５５００号公報
に示されるように、クランパーの開閉昇降動作により、
ワイヤをキャピラリに挿通する手段が提案されている。However, the wire tends to break during bonding work, and for this reason, as shown in Japanese Patent Publication No. 1-35500, the clamper opens and closes and lifts and lowers the wire.
Means for passing wires through capillaries have been proposed.

（発明が解決しようとする課題） 上述のように、キャピラリの下端部から導出したワイヤ
の下端部に電極部を接近させて、電気的スパークにより
熔融ボールを形成する場合、ワイヤの下端部と電極部の
間隔は適正に保持されている必要があり、この間隔が過
大であると、溶融ボールは過小となり、またこの間隔が
過小であると、溶融ボールは過大となる。(Problems to be Solved by the Invention) As described above, when the electrode portion is brought close to the lower end of the wire led out from the lower end of the capillary and a molten ball is formed by electric spark, the lower end of the wire and the electrode The spacing between the parts must be maintained properly; if the spacing is too large, the molten ball will be too small; if the spacing is too small, the molten ball will be too large.

そこで本発明は、ワイヤが切れるなどして、ワイヤをキ
ャピラリの下端部から再度導出させる場合に、このワイ
ヤの下端部と電極部の間隔を、適正な大きさに調整でき
る手段を提供することを目的とする。Therefore, the present invention aims to provide a means for adjusting the distance between the lower end of the wire and the electrode section to an appropriate size when the wire is led out from the lower end of the capillary due to breakage or the like. purpose.

（課題を解決するための手段） このために本発明は、キャピラリに挿通されたワイヤを
、クランパーによりクランプしながら、キャピラリの下
端部から導出して、このワイヤにより半導体チップと基
板の電極を接続するワイヤボンダにおいて、 上記クランパーを上下動させて、上記ワイヤを上記キャ
ピラリの下端部からキャピラリの下方に待機する電極部
に接触するまで導出して、ワイヤの下端部を検出し、次
いで上記クランパーによりこのワイヤをクランプして引
き上げて、ワイヤの下端部と上記電極部の間隔を調整す
るようにしたものである。(Means for Solving the Problems) For this purpose, the present invention provides a method in which a wire inserted into a capillary is clamped by a clamper and led out from the lower end of the capillary, and the wire connects the semiconductor chip and the electrodes of the substrate. In the wire bonder, the clamper is moved up and down to lead out the wire from the lower end of the capillary until it comes into contact with an electrode section waiting below the capillary, the lower end of the wire is detected, and then the clamper guides the wire. The wire is clamped and pulled up to adjust the distance between the lower end of the wire and the electrode section.

（作用） 上記構成において、クランパーを上下動させることによ
り、ワイヤをキャピラリの下端部から導出させるが、そ
の際、ワイヤの下端部が、キャピラリの下方に待機する
電極部に接触するまで導出させることにより、この下端
部をこの電極部により検出する。次いでクランパーによ
りワイヤをわずかに引き上げることにより、ワイヤの下
端部と電極部の間隔が、所望大きさの溶融ボールが形成
できる適正な間隔となるように調整する。(Function) In the above configuration, by moving the clamper up and down, the wire is led out from the lower end of the capillary, but at this time, the wire is led out until the lower end of the wire comes into contact with the electrode section waiting below the capillary. Accordingly, this lower end portion is detected by this electrode portion. Next, by slightly pulling up the wire with a clamper, the distance between the lower end of the wire and the electrode section is adjusted to an appropriate distance that allows formation of a molten ball of a desired size.

（実施例） 次に、図面を参照しながら本発明の詳細な説明する。(Example) Next, the present invention will be described in detail with reference to the drawings.

第１図はワイヤボンダのトーチ装置の斜視図であって、
１は垂直なキャピラリ、４はこのキャピラリ１に挿通さ
れたワイヤであり、リードフレームのリードのような基
板の電極２の中央部に搭載された半導体チップ３へ向っ
て、その下端部からワイヤ４を導出する。２１．１２は
キャピラリ１の上方にあって、開閉動作によりワイヤ４
をクランプするテンションクランパーとカントクランパ
ーである。FIG. 1 is a perspective view of a torch device of a wire bonder,
1 is a vertical capillary, 4 is a wire inserted into this capillary 1, and the wire 4 is inserted from the lower end toward the semiconductor chip 3 mounted in the center of the electrode 2 of the substrate, such as the lead of a lead frame. Derive. 21.12 is located above the capillary 1, and the wire 4 is
There is a tension clamper and a cant clamper.

６はキャピラリ１の側方に位置するアーム部であり、そ
の先端部にはヒンジ部７を介して揺動アーム８が揺動自
在に装着されており、また揺動アーム８の下端部には、
上記キャピラリ１の下方に延出するトーチロッド９が装
着されている。Reference numeral 6 designates an arm section located on the side of the capillary 1. A swinging arm 8 is swingably attached to the tip end of the arm section 6 via a hinge section 7. ,
A torch rod 9 extending below the capillary 1 is attached.

１０は電気回路部であって、トーチロッド９に高電圧を
印加し、またトーチロッド９の先端の電極部９ａにワイ
ヤ４の下端部が接触して、両者４，９ａが短絡したこと
を検出する。】３は上記アーム部６の先端上部に設けら
れたソレノイドであって、このソレノイド１３が作動す
ると、揺動アーム８はヒンジ部７を中心に左右に揺動し
、トーチロッド９の先端の電極部９ａをキャピラリｌの
下端部から導出したワイヤ４の直下に移動させ、またキ
ャピラリ１の下降動作の障害にならないように、側方に
退去させる。Reference numeral 10 denotes an electric circuit section that applies a high voltage to the torch rod 9 and detects that the lower end of the wire 4 has come into contact with the electrode section 9a at the tip of the torch rod 9, resulting in a short circuit between both 4 and 9a. do. ] Reference numeral 3 denotes a solenoid provided at the top of the tip of the arm portion 6. When the solenoid 13 is activated, the swinging arm 8 swings left and right around the hinge portion 7, and the electrode at the tip of the torch rod 9 is moved. The portion 9a is moved directly below the wire 4 led out from the lower end of the capillary l, and is moved to the side so as not to interfere with the lowering movement of the capillary 1.

本装置は上記のような構成より戒り、次に動作の説明を
行う。This device has the above-mentioned configuration, and the operation will be explained next.

テンションクランパー１１と力・ノドクランパー１２が
開閉して、ワイヤ４をクランプしながら上下動すること
により、キャピラリｌの下端部からワイヤ４を導出し、
ワイヤ４の下端部を、キャピラリ１の下方に待機する電
極部９ａに接近させる。次いで電極部９ａに高電圧を印
加すると、ワイヤ４の下端部と電極部９ａの間に電気的
スパークが発生し、ワイヤ４の下端部に熔融ボール１４
が形成される。次いでソレノイド１３を作動させて、電
極部９ａを側方へ退去させたうえで、キャピラリ１を下
降させ、溶融ボール１４を半導体チップ３の電極にボン
ディングする。次いでキャピラリ１を側方へ移動させて
、ワイヤ４を基板の電極２にボンディングする。By opening and closing the tension clamper 11 and the force/throat clamper 12 and moving up and down while clamping the wire 4, the wire 4 is led out from the lower end of the capillary l.
The lower end of the wire 4 is brought close to the electrode section 9a waiting below the capillary 1. Next, when a high voltage is applied to the electrode part 9a, an electric spark is generated between the lower end of the wire 4 and the electrode part 9a, and the molten ball 14 is generated at the lower end of the wire 4.
is formed. Next, the solenoid 13 is activated to move the electrode portion 9a to the side, and then the capillary 1 is lowered to bond the molten ball 14 to the electrode of the semiconductor chip 3. The capillary 1 is then moved laterally to bond the wire 4 to the electrode 2 on the substrate.

上記のようにして、半導体チップ３と電極２は、ワイヤ
４により次々に接続されるが、ワイヤ４は極細であるこ
とから、ボンディング作業中に、ワイヤ４が切れる場合
がある。そこで次に、そのような場合の動作の説明を行
う。As described above, the semiconductor chip 3 and the electrodes 2 are connected one after another by the wires 4, but since the wires 4 are extremely thin, the wires 4 may break during the bonding operation. Therefore, the operation in such a case will be explained next.

第２図（ａ）は、ワイヤ４が切れて、その下端部がキャ
ピラリ１の内部に位置する状態を示している。この状態
で、テンションクランパー１１を開、カットクランパー
１２を閉にして、カットクランパー１２を下降させ（同
図（ｂ））、次いでテンションクランパー１１を閉、カ
ットクランパー１２を開にして、カットクランパー１２
を上昇させ（同図（Ｃ））、次いで再びテンションクラ
ンパー１１を開、カントクランパー１２を閉にして、再
度カプトクランパー１２を下降させ、ワイヤ４の下端部
を、キャピラリ１の下方に待機する電極部９ａに接触さ
せる。FIG. 2(a) shows a state in which the wire 4 is cut and its lower end is located inside the capillary 1. In this state, the tension clamper 11 is opened, the cut clamper 12 is closed, and the cut clamper 12 is lowered (FIG. 2(b)). Next, the tension clamper 11 is closed, the cut clamper 12 is opened, and the cut clamper 12 is
((C) in the figure), then open the tension clamper 11 again, close the cant clamper 12, lower the capt clamper 12 again, and connect the lower end of the wire 4 to the electrode waiting below the capillary 1. 9a.

するとワイヤ４と電極部９ａは短絡し、ワイヤ４の下端
部が所定高さまで下降したことが検出される（同図（ｄ
））。両クランパー１１，１２の相対的な上下動による
上記のようなワイヤ４のキャピラリ１の下端部からの導
出は、ワイヤ４の下端部が電極部９ａに接触するまで繰
り返される。Then, the wire 4 and the electrode part 9a are short-circuited, and it is detected that the lower end of the wire 4 has descended to a predetermined height ((d)
)). The above-described drawing out of the wire 4 from the lower end of the capillary 1 by the relative vertical movement of both clampers 11 and 12 is repeated until the lower end of the wire 4 comes into contact with the electrode section 9a.

次いでテンションクランパー１１を開、カットクランパ
ー１２を閉にして、ワイヤ４をわずかに（引き上げ量Ｌ
）引き上げ、ワイヤ４の下端部と電極部９ａの間隔Ｌ゛
が、電気的スパークにより所望の大きさの溶融ボール１
４を形威できる大きさに調整する（同図（ｅ））。この
場合、電気的スパークにより形威される溶融ボール１４
の大きさは、間隔Ｌ°　の大きさにより制御することが
できる。したがって大きな熔融ボール１４を形威したい
ときには、ワイヤ４の引き上げ量りを小さくして、間隔
Ｌ゛　を小とし、また小さな溶融ボール１４を形威した
いときは、ワイヤ４の引き上げ量りを大きくして、間隔
Ｌ゛　を大きくする。Next, the tension clamper 11 is opened, the cut clamper 12 is closed, and the wire 4 is pulled up slightly (lifting amount L).
), the distance L' between the lower end of the wire 4 and the electrode part 9a becomes molten ball 1 of a desired size due to electric sparks.
4 to a size that can be seen ((e) in the same figure). In this case, the molten ball 14 is shaped by an electrical spark.
The size of the distance L° can be controlled by the size of the interval L°. Therefore, when it is desired to form a large molten ball 14, the amount by which the wire 4 is pulled is made small, and the interval L' is made small, and when it is desired to form a small molten ball 14, the amount from which the wire 4 is pulled is made large. Increase the interval L゛.

このように間隔Ｌ′が調整されたならば、再び電極部９
ａに高電圧を印加して、熔融ボール１４を形威しく同図
（ｆ））、上記のような半導体チップ３と電極２の接続
作業を再開する。Once the distance L' has been adjusted in this way, the electrode section 9
A high voltage is applied to the molten ball 14 (FIG. 6(f)), and the above-described connection work between the semiconductor chip 3 and the electrode 2 is resumed.

このように本方法によれば、ワイヤボンディング中にワ
イヤ４が切れたような場合には、ワイヤ４の下端部を、
キャピラリ１の下端部から、適正な長さだけ導出させて
、ボンディング作業を再開することができる。According to this method, if the wire 4 breaks during wire bonding, the lower end of the wire 4 can be
An appropriate length can be led out from the lower end of the capillary 1, and the bonding operation can be restarted.

なお本実施例では、トーチロッド９の電極部９ａを、ワ
イヤ４の下端部を検出する手段として兼務させているの
で、構造を簡単化できるが、ワイヤ４の下端部を検出す
る電極部を別個に設けてもよいものである。また切れた
ワイヤ４の下端部を、キャピラリ１から導出させるため
のクランパーの上下動モードも種々考えられるのであっ
て、例えば上記特公平１３５５００号公報の第４図に示
されるモードでもよい。In this embodiment, the electrode part 9a of the torch rod 9 also serves as a means for detecting the lower end of the wire 4, so the structure can be simplified. It may also be provided. Furthermore, various modes of vertical movement of the clamper for leading out the lower end of the cut wire 4 from the capillary 1 can be considered, and for example, the mode shown in FIG. 4 of the above-mentioned Japanese Patent Publication No. 135500 may be used.

（発明の効果） 以上説明したように本発明は、キャピラリに挿通された
ワイヤを、クランパーによりクランプしながら、キャピ
ラリの下端部から導出して、このワイヤにより半導体チ
ップと基板の電極を接続するワイヤボンダにおいて、 上記クランパーを上下動させて、上記ワイヤを上記キャ
ピラリの下端部からキャピラリの下方に待機する電極部
に接触するまで導出して、ワイヤの下端部を検出し、次
いで上記クランパーによりこのワイヤをクランプして引
き上げて、ワイヤの下端部と上記電極部の間隔を調整す
るようにしているので、ワイヤボンディング中に、ワイ
ヤが切れたような場合には、ワイヤの下端部をキャピラ
リの下端部から所定長導出させて、ワイヤの下端部と電
極部の間隔を適正に調整し、速かにボンディング作業を
再開することができる。(Effects of the Invention) As explained above, the present invention provides a wire bonder in which a wire inserted into a capillary is clamped by a clamper and led out from the lower end of the capillary, and the wire connects a semiconductor chip and an electrode on a substrate. In this step, the clamper is moved up and down to lead out the wire from the lower end of the capillary until it comes into contact with an electrode section waiting below the capillary, the lower end of the wire is detected, and then the wire is pulled out by the clamper. The distance between the lower end of the wire and the electrode is adjusted by clamping and pulling it up, so if the wire breaks during wire bonding, pull the lower end of the wire away from the lower end of the capillary. By drawing out a predetermined length, the distance between the lower end portion of the wire and the electrode portion can be adjusted appropriately, and the bonding work can be quickly resumed.

【図面の簡単な説明】[Brief explanation of drawings]

図は本発明の実施例を示すものであって、第１図はワイ
ヤボンダのトーチ装置の斜視図、第２図 オヨ本は作業中の要部正面図である。 １・・・キャピラリ ２・・・電極 ３・・・半導体チップ ４・・・ワイヤ ９ａ・・・電極部 １１・・・テンションクランパー １２・・・カントクランパーThe drawings show an embodiment of the present invention, in which FIG. 1 is a perspective view of a torch device of a wire bonder, and FIG. 2 is a front view of the main part during operation. 1... Capillary 2... Electrode 3... Semiconductor chip 4... Wire 9a... Electrode portion 11... Tension clamper 12... Cant clamper

Claims (1)

【特許請求の範囲】 キャピラリに挿通されたワイヤを、クランパーによりク
ランプしながら、キャピラリの下端部から導出して、こ
のワイヤにより半導体チップと基板の電極を接続するワ
イヤボンダにおいて、 上記クランパーを上下動させて、上記ワイヤを上記キャ
ピラリの下端部からキャピラリの下方に待機する電極部
に接触するまで導出して、ワイヤの下端部を検出し、次
いで上記クランパーによりこのワイヤをクランプして引
き上げて、ワイヤの下端部と上記電極部の間隔を調整す
ることを特徴とするワイヤボンダにおけるキャピラリへ
のワイヤの挿通方法。[Claims] In a wire bonder in which a wire inserted into a capillary is clamped by a clamper and led out from the lower end of the capillary, and the wire connects a semiconductor chip and an electrode of a substrate, the clamper is moved up and down. Then, the wire is led out from the lower end of the capillary until it comes into contact with an electrode section waiting below the capillary, the lower end of the wire is detected, and then the wire is clamped and pulled up by the clamper to remove the wire. A method for inserting a wire into a capillary in a wire bonder, the method comprising adjusting the distance between the lower end portion and the electrode portion.
JP2063232A 1990-03-14 1990-03-14 Wire insertion method to capillary in wire bonder Expired - Lifetime JP2765168B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2063232A JP2765168B2 (en) 1990-03-14 1990-03-14 Wire insertion method to capillary in wire bonder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2063232A JP2765168B2 (en) 1990-03-14 1990-03-14 Wire insertion method to capillary in wire bonder

Publications (2)

Publication Number Publication Date
JPH03263844A true JPH03263844A (en) 1991-11-25
JP2765168B2 JP2765168B2 (en) 1998-06-11

Family

ID=13223263

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2063232A Expired - Lifetime JP2765168B2 (en) 1990-03-14 1990-03-14 Wire insertion method to capillary in wire bonder

Country Status (1)

Country Link
JP (1) JP2765168B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100610943B1 (en) * 2000-11-03 2006-08-09 앰코 테크놀로지 코리아 주식회사 Wire Bonding Method for Semiconductor Package
US7857190B2 (en) * 2005-12-28 2010-12-28 Kabushiki Kaisha Shinkawa Wire bonding apparatus, record medium storing bonding control program, and bonding method
US8078348B2 (en) 2007-10-25 2011-12-13 Honda Motor Co., Ltd. Electric vehicle and regeneration control method for electric vehicle

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100610943B1 (en) * 2000-11-03 2006-08-09 앰코 테크놀로지 코리아 주식회사 Wire Bonding Method for Semiconductor Package
US7857190B2 (en) * 2005-12-28 2010-12-28 Kabushiki Kaisha Shinkawa Wire bonding apparatus, record medium storing bonding control program, and bonding method
US8078348B2 (en) 2007-10-25 2011-12-13 Honda Motor Co., Ltd. Electric vehicle and regeneration control method for electric vehicle

Also Published As

Publication number Publication date
JP2765168B2 (en) 1998-06-11

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