JPH0218582B2 - - Google Patents
Info
- Publication number
- JPH0218582B2 JPH0218582B2 JP58055233A JP5523383A JPH0218582B2 JP H0218582 B2 JPH0218582 B2 JP H0218582B2 JP 58055233 A JP58055233 A JP 58055233A JP 5523383 A JP5523383 A JP 5523383A JP H0218582 B2 JPH0218582 B2 JP H0218582B2
- Authority
- JP
- Japan
- Prior art keywords
- inert gas
- wire
- ball
- bonding tool
- tip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000011261 inert gas Substances 0.000 claims description 34
- 238000003780 insertion Methods 0.000 claims description 6
- 230000037431 insertion Effects 0.000 claims description 6
- 239000004047 hole gas Substances 0.000 claims 1
- 238000002347 injection Methods 0.000 description 9
- 239000007924 injection Substances 0.000 description 9
- 239000007789 gas Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/78268—Discharge electrode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85009—Pre-treatment of the connector or the bonding area
- H01L2224/8503—Reshaping, e.g. forming the ball or the wedge of the wire connector
- H01L2224/85035—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball"
- H01L2224/85045—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball" using a corona discharge, e.g. electronic flame off [EFO]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85053—Bonding environment
- H01L2224/85054—Composition of the atmosphere
- H01L2224/85075—Composition of the atmosphere being inert
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01039—Yttrium [Y]
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Description
【発明の詳細な説明】
（発明の利用分野）
本発明はワイヤボンダ用ツールに係り、特に不
活性ガス雰囲気中での放電によつてワイヤの先端
にボールを形成する場合に好適なワイヤボンダ用
ツールに関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Application of the Invention) The present invention relates to a wire bonder tool, and more particularly to a wire bonder tool suitable for forming a ball at the tip of a wire by electric discharge in an inert gas atmosphere. .
（発明の背景）
アルミニウム、銅等のワイヤは、放電によつて
ワイヤの先端にボールを形成する際に酸化するの
で、ワイヤ先端付近の放電空間を不活性ガス雰囲
気にしてボールが形成される。(Background of the Invention) A wire made of aluminum, copper, or the like is oxidized when a ball is formed at the tip of the wire by electric discharge, so the ball is formed by creating an inert gas atmosphere in the discharge space near the tip of the wire.
従来、ワイヤ先端付近の放電空間を不活性ガス
雰囲気にする方法として、第１図〜第３図に示す
方法が知られている。第１図は特開昭55−88348
号公報に示す方法で、第２図及び第３図は特開昭
57−89232号公報に示す方法である。第１図は放
電電極１と不活性ガス噴射ノズル２とをそれぞれ
独立して設けているのに対し、第２図及び第３図
は放電電極１を不活性ガス噴射ノズル２に設けて
いる。なお、第１図〜第３図において、３はボン
デイングツール、４はボンデイングツール３に挿
通されたワイヤ、５はワイヤ４の先端に形成され
たボール、第３図において、６は不活性ガス噴射
ノズル２の上面を切欠いで形成された窓、８は不
活性ガス噴射ノズル２の端面に挿入された栓であ
る。 Conventionally, methods shown in FIGS. 1 to 3 are known as methods for creating an inert gas atmosphere in the discharge space near the tip of the wire. Figure 1 is Japanese Patent Publication No. 55-88348.
The method shown in the publication, Figures 2 and 3 are
This is the method shown in Publication No. 57-89232. In FIG. 1, the discharge electrode 1 and the inert gas injection nozzle 2 are provided independently, whereas in FIGS. 2 and 3, the discharge electrode 1 is provided in the inert gas injection nozzle 2. In addition, in FIGS. 1 to 3, 3 is a bonding tool, 4 is a wire inserted into the bonding tool 3, 5 is a ball formed at the tip of the wire 4, and in FIG. 3, 6 is an inert gas injection A window 8 formed by cutting out the upper surface of the nozzle 2 is a plug inserted into the end surface of the inert gas injection nozzle 2.
しかしながら、第１図及び第２図の構造は、強
い流れの不活性ガスが一方向の真横からワイヤ４
に当るので、不活性ガス噴射方向と反対側のボー
ル５部分には十分に不活性ガス雰囲気がとどかな
く、ボール５に酸化物が混在すると共に、ワイヤ
４の中心からボール５の中心がずれるという欠点
を有する。 However, in the structure shown in FIGS. 1 and 2, a strong flow of inert gas flows directly across the wire in one direction.
Therefore, the inert gas atmosphere does not reach the part of the ball 5 on the opposite side of the inert gas injection direction, and oxides are mixed in the ball 5 and the center of the ball 5 is shifted from the center of the wire 4. It has its drawbacks.
また第２図及び第３図の構造は、不活性ガス噴
射ノズル２に放電電極１が設けられているので、
不活性ガス噴射ノズル２がワイヤ４の下方に移動
してきてから初めてワイヤ４の放電空間が不活性
ガス雰囲気化される。多くの場合、放電電極１は
高速で移動させるので、この移動によつて折角で
きている不活性ガス雰囲気が流されてしまう。こ
のため、放電電極１がワイヤ４の先端の真下に移
動してきてからしばらく停止させ、十分な不活性
ガス雰囲気ができるのを待たなければならないと
いう欠点を有する。 Furthermore, in the structure shown in FIGS. 2 and 3, since the discharge electrode 1 is provided on the inert gas injection nozzle 2,
Only after the inert gas injection nozzle 2 moves below the wire 4 does the discharge space of the wire 4 become an inert gas atmosphere. In many cases, the discharge electrode 1 is moved at high speed, so that the inert gas atmosphere that has been built up through this movement is washed away. For this reason, there is a drawback that after the discharge electrode 1 moves directly below the tip of the wire 4, it must be stopped for a while and wait for a sufficient inert gas atmosphere to be created.
（発明の目的）
本発明の目的は、ボールの芯ずれ及び酸化物の
混在が防止されると共に、高速化が図れるワイヤ
ボンダ用ツールを提供することにある。(Objective of the Invention) An object of the present invention is to provide a wire bonder tool that can prevent ball misalignment and mixing of oxides, and can increase speed.
（発明の実施例）
以下、本発明の一実施例を第４図により説明す
る。XY方向に移動するボンデイングヘツド（図
示せず）に上下動可能に取付けられたボンデイン
グアーム１０には、ボンデイングツール１１が固
定されている。ボンデイングツール１１にはワイ
ヤ１２が挿通されるワイヤ挿通用穴１３が形成さ
れ、このワイヤ挿通用穴１３の周りに複数個の不
活性ガス噴出用穴１４が形成されている。またボ
ンデイングツール１１の上面にはガスカバー１５
が取付けられており、このガスカバー１５に不活
性ガス導入用パイプ１６が取付けられている。前
記不活性ガス導入用パイプ１６には図示しないガ
ス供給源に接続されたチユーブが接続されてお
り、不活性ガスが供給される。またボンデイング
ツール１１の外周下方には不活性ガスをボンデイ
ングツール１１の先端部に導くガスガイドカバー
１７が取付けられている。なお、１８は放電電極
を示す。(Embodiment of the Invention) An embodiment of the present invention will be described below with reference to FIG. A bonding tool 11 is fixed to a bonding arm 10 that is vertically movably attached to a bonding head (not shown) that moves in the XY directions. A wire insertion hole 13 into which the wire 12 is inserted is formed in the bonding tool 11, and a plurality of inert gas injection holes 14 are formed around the wire insertion hole 13. Also, a gas cover 15 is provided on the top surface of the bonding tool 11.
is attached, and an inert gas introduction pipe 16 is attached to this gas cover 15. A tube connected to a gas supply source (not shown) is connected to the inert gas introduction pipe 16, and inert gas is supplied thereto. Further, a gas guide cover 17 is attached below the outer periphery of the bonding tool 11 to guide inert gas to the tip of the bonding tool 11. Note that 18 indicates a discharge electrode.
従つて、ボール形成時に不活性ガスを不活性ガ
ス導入用パイプ１６に供給すると、不活性ガスは
ワイヤ挿通用穴１３及び不活性ガス噴射用穴１４
を通つてボンデイングツール１１の下面に流れ、
ワイヤ１２の先端部付近（放電空間）を不活性ガ
ス雰囲気化する。 Therefore, when inert gas is supplied to the inert gas introduction pipe 16 during ball formation, the inert gas flows through the wire insertion hole 13 and the inert gas injection hole 14.
and flows to the lower surface of the bonding tool 11 through the
The vicinity of the tip of the wire 12 (discharge space) is made into an inert gas atmosphere.
このように、不活性ガスはワイヤ１２の軸線方
向に流れてワイヤ１２の先端の周囲から放電空間
を不活性ガス雰囲気にするので、ボールの芯ずれ
及び酸化物の混入は防止される。またワイヤ１２
が挿通されたボンデイングツール１１に設けた穴
１３，１４を通して放電空間を不活性ガス雰囲気
にするので、ボール形成のために放電電極１７が
高速でワイヤ１２の真下に移動した後に即座に放
電を行わせることができる。 In this way, since the inert gas flows in the axial direction of the wire 12 and creates an inert gas atmosphere in the discharge space from around the tip of the wire 12, misalignment of the ball and incorporation of oxides are prevented. Also, the wire 12
The discharge space is made into an inert gas atmosphere through the holes 13 and 14 provided in the bonding tool 11 through which the wires are inserted, so that discharge occurs immediately after the discharge electrode 17 moves at high speed directly below the wire 12 to form a ball. can be set.
（発明の効果）
以上の説明から明らかな如く、本発明によれ
ば、ボンデイングツールを通して不活性ガスを供
給して放電空間を不活性ガス雰囲気にするので、
ボールの芯ずれ及び酸化物の混入が防止できると
共に、ボール形成動作の高速化が図れる。(Effects of the Invention) As is clear from the above description, according to the present invention, inert gas is supplied through the bonding tool to create an inert gas atmosphere in the discharge space.
Ball misalignment and oxide contamination can be prevented, and ball forming operations can be made faster.
第１図、第２図、第３図はそれぞれ従来例の断
面図、第４図は本発明の一実施例を示し、ａは平
面図、ｂは縦断面図である。
１１……ボンデイングツール、１２……ワイ
ヤ、１３……ワイヤ挿通用穴、１４……不活性ガ
ス噴出用穴。
1, 2, and 3 are sectional views of a conventional example, and FIG. 4 shows an embodiment of the present invention, in which a is a plan view and b is a vertical sectional view. 11...Bonding tool, 12...Wire, 13...Wire insertion hole, 14...Inert gas jetting hole.
Claims (1)
不活性ガス噴出用穴を設け、前記ワイヤ挿通用穴
及び前記不活性ガス噴出用穴を通してボンデイン
グツール下面に不活性ガスを供給することを特徴
とするワイヤボンダ用ツール。1. A hole for inert gas blowout is provided in the part of the tool itself around the wire insertion hole, and inert gas is supplied to the lower surface of the bonding tool through the wire insertion hole and the inert gas blowout hole. Wire bonder tool.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58055233A JPS59182533A (en) | 1983-04-01 | 1983-04-01 | Tool for wire bonder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58055233A JPS59182533A (en) | 1983-04-01 | 1983-04-01 | Tool for wire bonder |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59182533A JPS59182533A (en) | 1984-10-17 |
| JPH0218582B2 true JPH0218582B2 (en) | 1990-04-26 |
Family
ID=12992880
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58055233A Granted JPS59182533A (en) | 1983-04-01 | 1983-04-01 | Tool for wire bonder |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59182533A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8186562B1 (en) * | 2010-12-14 | 2012-05-29 | Asm Technology Singapore Pte Ltd | Apparatus for increasing coverage of shielding gas during wire bonding |
| CN108981374A (en) * | 2018-08-10 | 2018-12-11 | 德淮半导体有限公司 | wafer dryer |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5574044U (en) * | 1978-11-13 | 1980-05-21 |
-
1983
- 1983-04-01 JP JP58055233A patent/JPS59182533A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59182533A (en) | 1984-10-17 |
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