JPS59182533A - Tool for wire bonder - Google Patents

Tool for wire bonder

Info

Publication number
JPS59182533A
JPS59182533A JP58055233A JP5523383A JPS59182533A JP S59182533 A JPS59182533 A JP S59182533A JP 58055233 A JP58055233 A JP 58055233A JP 5523383 A JP5523383 A JP 5523383A JP S59182533 A JPS59182533 A JP S59182533A
Authority
JP
Japan
Prior art keywords
wire
tool
gas
inert gas
ball
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58055233A
Other languages
Japanese (ja)
Other versions
JPH0218582B2 (en
Inventor
Hiroshi Ushiki
博 丑木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP58055233A priority Critical patent/JPS59182533A/en
Publication of JPS59182533A publication Critical patent/JPS59182533A/en
Publication of JPH0218582B2 publication Critical patent/JPH0218582B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/78268—Discharge electrode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85009—Pre-treatment of the connector or the bonding area
    • H01L2224/8503—Reshaping, e.g. forming the ball or the wedge of the wire connector
    • H01L2224/85035—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball"
    • H01L2224/85045—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball" using a corona discharge, e.g. electronic flame off [EFO]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85053—Bonding environment
    • H01L2224/85054—Composition of the atmosphere
    • H01L2224/85075—Composition of the atmosphere being inert
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To avoid discrepancy of centering of a ball and mixing of an oxide when the ball is to be formed at the tip of a wire according to electric discharge in an inactive gas atmosphere by a method wherein inactive gas jetting holes are provided around a wire piercing hole, and gas is jetted therefrom to the under face of a bonding tool to form an inactive atmosphere. CONSTITUTION:A bonding tool 11 is fixed to a bonding arm 10 equipped enabling to be moved vertically to a bonding head not shown in the figure and to be transferred in the X, Y directions. A wire piercing hole 13 to pierce a wire 12 is provided in the tool 11 thereof, and moreover in addition thereto, inactive gas jetting holes 14 of the plural number of pieces are provided concentrically in the periphery thereof. Moreover a gas cover 15 is provided on the top surface of the tool 11, a gas introducing pipe 16 is engaged therewith, and a gas guide cover 17 to guide gas to the tip part of the tool 11 is equipped on the under side of the outer periphery of the tool 11. Accordingly gas is filled up effectively between the tip of the wire 12 and a discharge electrode 18 positioning thereunder.

Description

【発明の詳細な説明】 （発明の利用分野） 本発明はワイヤボンダ用ツールに係り、特に不活性ガス
雰囲気中での放電によってワイヤの先端にボールを形成
する場合に好適なワイヤボンダ用ツールに関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Application of the Invention) The present invention relates to a wire bonder tool, and particularly to a wire bonder tool suitable for forming a ball at the tip of a wire by electric discharge in an inert gas atmosphere.

（発明の背景） アルミニウム、銅等のワイヤは、放電ζこよってワイヤ
の先端ζこボールを形成する際に酸化するので、ワイヤ
先端付近の放電空間を不活性ガス雰囲気にしてボールが
形成される。(Background of the Invention) Wires made of aluminum, copper, etc. are oxidized when a ball is formed at the tip of the wire due to discharge, so the ball is formed by creating an inert gas atmosphere in the discharge space near the tip of the wire. .

従来、ワイヤ先端付近の放電空間を不活性ガス雰囲気に
する方法として、第１図〜第３図ζこ示す方法が知られ
ている。第１図は特開昭５５−８８３４８号公報に示す
方法で、第２図及び第３図は特開昭５７−８９２３２号
公報に示す方法である。Conventionally, the method shown in FIGS. 1 to 3 is known as a method of creating an inert gas atmosphere in the discharge space near the tip of the wire. FIG. 1 shows the method shown in Japanese Patent Application Laid-Open No. 55-88348, and FIGS. 2 and 3 show the method shown in Japanese Patent Application Laid-Open No. 57-89232.

第１図は放電電極１と不活性ガス噴射ノズル２とをそれ
ぞれ独立して設けているのに対し、第２図及び第３図は
放電電極１を不活性ガス噴射ノズル２に設けている。な
お、第１図〜第３図において、３はボンディングツール
、４はボンディングツール３１こ挿通されたワイヤ、５
はワイヤ４の先端に形成されたボール、第３図において
、６は不活性ガス噴射ノズル２の上面を切欠いで形成さ
れた窓、８は不活性ガス噴射ノズル２の端面に挿入され
た栓である。In FIG. 1, the discharge electrode 1 and the inert gas injection nozzle 2 are provided independently, whereas in FIGS. 2 and 3, the discharge electrode 1 is provided in the inert gas injection nozzle 2. In addition, in FIGS. 1 to 3, 3 is a bonding tool, 4 is a wire inserted through the bonding tool 31, and 5 is a bonding tool.
3 is a ball formed at the tip of the wire 4, 6 is a window formed by cutting out the upper surface of the inert gas injection nozzle 2, and 8 is a plug inserted into the end surface of the inert gas injection nozzle 2. be.

しかしながら、第１図及び第２図の構造は、強い流れの
不活性ガスが一方向の真横からワイヤ４に当るので、不
活性ガス噴出方向と反対側のボール５部分ζこけ十分に
不活性ガス雰囲気がとどかなく、ボール５に酸化物が混
在すると共に、ワイヤ４の中心からボール５の中心がず
れるきいう欠点を有する。However, in the structure shown in FIGS. 1 and 2, since a strong flow of inert gas hits the wire 4 from right sideways in one direction, the part of the ball 5 ζ on the opposite side to the inert gas jetting direction is sufficiently inert gas. The disadvantage is that the atmosphere does not reach the ball 5, oxides are mixed in the ball 5, and the center of the ball 5 is shifted from the center of the wire 4.

また第２図及び第３図の構造は、不活性ガス噴射ノズル
２（こ放電電極１が設けられているので、不活性ガス噴
射ノズル２がワイヤ４の下方に移動してきてから初めて
ワイヤ４の放電空間が不活性ガス雰囲気化される。多く
の場合、放電電極１は高速で移動させるので、この移動
によって折角できている不活性ガス雰囲気が流されてし
まう。このため、放電電極ｌがワイヤ４の先端の真下に
移動してきてからしばらく停止させ、十分な不活性ガス
雰囲気ができるのを待たなければならないという欠点を
有する。Furthermore, in the structure shown in FIGS. 2 and 3, since the inert gas injection nozzle 2 (discharge electrode 1) is provided, the wire 4 is not activated until the inert gas injection nozzle 2 moves below the wire 4. The discharge space is made into an inert gas atmosphere.In many cases, the discharge electrode 1 is moved at high speed, so the inert gas atmosphere that has been created through this movement is washed away.For this reason, the discharge electrode 1 is It has the disadvantage that it has to be stopped for a while after moving directly below the tip of No. 4 and wait for a sufficient inert gas atmosphere to be created.

（発明の目的） 本発明の目的は、ボールの芯ずれ及び酸化物の混在が防
止されると共に、高速化が図れるワイヤボンダ用ツール
を提供するＣとにある。(Objective of the Invention) An object of the present invention is to provide a wire bonder tool that can prevent ball misalignment and oxide mixture, and can increase speed.

（発明の実施例） 以下、本発明の一実施例を第４図により説明する。ＸＹ
方向に移動するボンディングヘッド（図示せず）に上下
動可能に取付けられたボンディングアーム１０には、ボ
ンディングツール１１が固定されている。ボンディング
ツール１１にはワイヤ■２が挿通されるワイヤ挿通用穴
１３が形成され、このワイヤ挿通用穴１３の周りに複数
個の不活性ガス噴出用穴１４が形成されている。またボ
ンディングツール１１の上面にはガスカバー１５が取付
けられており、このガスカバー１５に不活性ガス導入用
パイプ１６が取付けられている。前記不活性ガス導入用
パイプ１６には図示しないガス供給源（こ接続されたチ
ューブが接続されており、不活性ガスが供給される。ま
たボンディングツール１１の外周下方には不活性ガスを
ボンディングツールｌｉの先端部に導くガスガイドカバ
ー１７が取付けられている。なお、１８は放電電極を示
す。(Embodiment of the Invention) An embodiment of the present invention will be described below with reference to FIG. XY
A bonding tool 11 is fixed to a bonding arm 10 that is vertically movably attached to a bonding head (not shown) that moves in the direction. A wire insertion hole 13 into which the wire 2 is inserted is formed in the bonding tool 11, and a plurality of inert gas injection holes 14 are formed around the wire insertion hole 13. Further, a gas cover 15 is attached to the upper surface of the bonding tool 11, and an inert gas introduction pipe 16 is attached to this gas cover 15. A gas supply source (not shown) is connected to the inert gas introduction pipe 16, and inert gas is supplied to the bonding tool 11. A gas guide cover 17 is attached to guide the tip of the li. Note that 18 indicates a discharge electrode.

従って、ボール形成時に不活性ガスを不活性ガス導入用
パイプ１６１こ供給すると、不活性ガスはワイヤ挿通用
穴１３及び不活性ガス噴出用穴１４を通ってボンディン
グツール１１の下面に流れ、ワイヤ１２の先端部付近（
放電空間）を不活硅ガス雰囲気化する。Therefore, when an inert gas is supplied through the inert gas introduction pipe 161 during ball formation, the inert gas flows to the lower surface of the bonding tool 11 through the wire insertion hole 13 and the inert gas injection hole 14, and the wire 12 Near the tip of (
(discharge space) is made into an inert silica gas atmosphere.

このように、不活性ガスはワイヤ１２の軸線方向（こ流
れてワイヤＪ２の先端の周囲から放電空間を不活性ガス
雰囲気ｌこするので、ボールの芯ずれ及び酸化物の混入
は防止される。またワイヤ１２が挿通されたホンディン
グツール１１に設けた穴１３．１４を通して放電空間を
不活性ガス雰囲気にするので、ボール形成のため（こ放
電電極１７が高速でワイヤ１２の真下に移動した後に即
座に放電を行わせることができる。In this way, since the inert gas flows in the axial direction of the wire 12 and rubs the discharge space from around the tip of the wire J2, misalignment of the ball and incorporation of oxides are prevented. In addition, since the discharge space is made into an inert gas atmosphere through the holes 13 and 14 provided in the honding tool 11 through which the wire 12 is inserted, in order to form a ball (after the discharge electrode 17 moves directly under the wire 12 at high speed) Discharge can occur immediately.

（発明の効果） 以上の説明から明らかな如く、本発明によれば、ボンデ
ィングツールを通して不活性ガスを供給して放電空間を
不活性ガス雰囲気にするので、ボールの芯ずれ及び酸化
物の混入が防止できると共に、ボール形成動作の高速化
が図れる。(Effects of the Invention) As is clear from the above description, according to the present invention, an inert gas is supplied through the bonding tool to create an inert gas atmosphere in the discharge space, thereby preventing ball misalignment and oxide contamination. This can be prevented and the speed of the ball forming operation can be increased.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図、第２図、第３図はそれぞれ従来例の断面図、第
４図は本発明の一実施例を示し、（ａｌは平面図、（ｂ
）は縦断面図である。 １１・・・ボンティングツール、　　　１２・・・ワイ
ヤ、１３・・・ワイヤ挿通用穴、　　　１４・・・不活
性ガス噴出用穴。1, 2, and 3 are sectional views of a conventional example, and FIG. 4 shows an embodiment of the present invention, (al is a plan view, (b
) is a longitudinal sectional view. 11... Bonding tool, 12... Wire, 13... Wire insertion hole, 14... Inert gas blowout hole.

Claims (1)

【特許請求の範囲】[Claims] ワイヤ挿通用穴の周りに不活性ガス１貫出用穴を設け、
前記穴を通してボンディングツール下面Ｑこ不活性ガス
を供給することを特徴とするワイヤボンダ用ツール。A hole for inert gas 1 is provided around the wire insertion hole,
A wire bonder tool characterized in that an inert gas is supplied to the lower surface of the bonding tool through the hole.
JP58055233A 1983-04-01 1983-04-01 Tool for wire bonder Granted JPS59182533A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58055233A JPS59182533A (en) 1983-04-01 1983-04-01 Tool for wire bonder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58055233A JPS59182533A (en) 1983-04-01 1983-04-01 Tool for wire bonder

Publications (2)

Publication Number Publication Date
JPS59182533A true JPS59182533A (en) 1984-10-17
JPH0218582B2 JPH0218582B2 (en) 1990-04-26

Family

ID=12992880

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58055233A Granted JPS59182533A (en) 1983-04-01 1983-04-01 Tool for wire bonder

Country Status (1)

Country Link
JP (1) JPS59182533A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8186562B1 (en) * 2010-12-14 2012-05-29 Asm Technology Singapore Pte Ltd Apparatus for increasing coverage of shielding gas during wire bonding
CN108981374A (en) * 2018-08-10 2018-12-11 德淮半导体有限公司 wafer dryer

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5574044U (en) * 1978-11-13 1980-05-21

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5574044U (en) * 1978-11-13 1980-05-21

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8186562B1 (en) * 2010-12-14 2012-05-29 Asm Technology Singapore Pte Ltd Apparatus for increasing coverage of shielding gas during wire bonding
US20120145770A1 (en) * 2010-12-14 2012-06-14 Song Keng Yew James Apparatus for increasing coverage of shielding gas during wire bonding
CN108981374A (en) * 2018-08-10 2018-12-11 德淮半导体有限公司 wafer dryer

Also Published As

Publication number Publication date
JPH0218582B2 (en) 1990-04-26

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