JPH0320900B2 - - Google Patents
Info
- Publication number
- JPH0320900B2 JPH0320900B2 JP3358282A JP3358282A JPH0320900B2 JP H0320900 B2 JPH0320900 B2 JP H0320900B2 JP 3358282 A JP3358282 A JP 3358282A JP 3358282 A JP3358282 A JP 3358282A JP H0320900 B2 JPH0320900 B2 JP H0320900B2
- Authority
- JP
- Japan
- Prior art keywords
- wire
- thin metal
- tension
- metal wire
- path
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000002184 metal Substances 0.000 claims description 12
- 229910052751 metal Inorganic materials 0.000 claims description 12
- 230000035515 penetration Effects 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000008188 pellet Substances 0.000 claims description 3
- 238000007664 blowing Methods 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/78268—Discharge electrode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
- H01L2224/78621—Holding means, e.g. wire clampers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85009—Pre-treatment of the connector or the bonding area
- H01L2224/8503—Reshaping, e.g. forming the ball or the wedge of the wire connector
- H01L2224/85035—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball"
- H01L2224/85045—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball" using a corona discharge, e.g. electronic flame off [EFO]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Description
【発明の詳細な説明】
この発明はワイヤボンデイング中の金属細線に
かかる張力を調整することができるワイヤボンデ
イング装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a wire bonding device that can adjust the tension applied to a thin metal wire during wire bonding.
一般に、ワイヤボンデイング装置は半導体集積
回路装置などの組立工程における半導体ペレツト
の電極とリード間を金属細線（以下ワイヤと言
う）で接続するワイヤボンデイング装置が使用さ
れる。そして、ボンデイングスピードの高速化お
よびそれに伴なうワイヤの供給速度の増大の要求
により、従来は第１図に示すワイヤボンデイング
装置が実用化されている。 Generally, wire bonding equipment is used to connect electrodes and leads of semiconductor pellets with thin metal wires (hereinafter referred to as wires) during the assembly process of semiconductor integrated circuit devices and the like. In response to demands for higher bonding speeds and correspondingly higher wire supply speeds, the wire bonding apparatus shown in FIG. 1 has been put into practical use.
第１図は従来のワイヤボンデイング装置を示す
概略斜視図である。同図において、１はワイヤ、
２はこのワイヤ１が巻かれたスプール、３はこの
スプール２を強制的に回転させて、ワイヤ１を解
き出すモータ、４はこのワイヤ１のガイドロー
ラ、５は所定の間隔（ワイヤ１の直径より少し広
くして、ワイヤ１が接触しない程度）で配置した
一対の薄い板、６は一端が気体送り口７を形成
し、他端に気体送出ノズル８を装着し、薄い板５
の間へ、その下方から気体を吹きつける気体吹き
つけ器、９はワイヤ１が貫通するガイド、１０は
クランパ、１１はキヤピラリである。 FIG. 1 is a schematic perspective view showing a conventional wire bonding device. In the same figure, 1 is a wire,
2 is a spool on which this wire 1 is wound; 3 is a motor that forcibly rotates this spool 2 to unwind the wire 1; 4 is a guide roller for this wire 1; 5 is a predetermined interval (diameter of wire 1). A pair of thin plates 6 are arranged so that the wires 1 do not touch each other), one end of which forms a gas feed port 7, and the other end of which is equipped with a gas feed nozzle 8.
9 is a guide through which the wire 1 passes, 10 is a clamper, and 11 is a capillary.
なお、１２は前記一対の薄い板５および気体吹
きつけ器６から構成し、気体・送出ノズル８から
気体を吹きつけて、ワイヤ１をキヤピラリ１１の
真上方向（矢印ａ方向）に張力を加えるエアテン
シヨナである。 Note that 12 is composed of the pair of thin plates 5 and a gas blower 6, and blows gas from a gas/delivery nozzle 8 to apply tension to the wire 1 directly above the capillary 11 (in the direction of arrow a). It is an air tensioner.
次に、上記構成によるワイヤボンデイング装置
の動作について説明する。まず、モータ３を強制
的に一定量だけ回転すると、ワイヤ１はスプール
２から一定量だけ解き出される。そして、この解
き出されたワイヤ１はガイドローラ４およびエア
テンシヨナ１２を介してキヤピラリ１１へ供給さ
れるが、このとき、エアテンシヨナ１２の気体吹
きつけ器６の気体・送出ノズル８から上方に吹き
出される気体の作用により、ワイヤ１には矢印ａ
方向に一定の張力を加えることができる。 Next, the operation of the wire bonding apparatus having the above configuration will be explained. First, when the motor 3 is forcibly rotated by a certain amount, the wire 1 is unwound from the spool 2 by a certain amount. Then, this unraveled wire 1 is supplied to the capillary 11 via the guide roller 4 and the air tensioner 12, but at this time, it is blown upward from the gas/delivery nozzle 8 of the gas blower 6 of the air tensioner 12. Due to the action of the gas, the wire 1 has an arrow a
A constant tension can be applied in the direction.
しかしながら、従来のワイヤボンデイング装置
では張力の微調整が困難であるうえ、ワイヤリン
グ時（半導体ペレツト電極に金ボールを圧着さ
せ、リードにキヤピラリが移動する時）にクラン
パ１０が開放されるため、ワイヤ１のループ形状
は前記張力によつて左右され、特にキヤピラリ１
１に対し上方向（矢印ａ方向）の張力が多くかか
る場合はワイヤループが低くなりやすく、かつワ
イヤリング時に金ボールのすぐ上でワイヤ１が切
れ（ネツク切れ）易くなる欠点があつた。 However, with conventional wire bonding equipment, fine adjustment of the tension is difficult, and the clamper 10 is opened during wiring (when the gold ball is crimped to the semiconductor pellet electrode and the capillary is moved to the lead), so the wire 1 The loop shape of the capillary 1 depends on the tension, especially for the capillary 1.
If a large amount of tension is applied in the upward direction (in the direction of arrow a) to the wire 1, the wire loop tends to become low, and the wire 1 tends to break just above the gold ball during wiring.
したがつて、この発明の目的はワイヤボンデイ
ン中のワイヤにかかる張力をほぼ零とし、最適な
ワイヤループを形成して、ネツク切れを防止する
ことができるワイヤボンデイング装置を提供する
ものである。 SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a wire bonding device that can reduce the tension applied to the wire during wire bonding to almost zero, form an optimal wire loop, and prevent the wire from breaking.
このような目的を達成するため、この発明はワ
イヤが貫通し、ワイヤのガイドの役目をする貫通
経路と一方の開口からこの貫通経路の中央付近で
結合する支管経路とからなる張力付加機構をキヤ
ピラリとエアーテンシヨナの間に設け、この支管
経路から気体を吹き込み、前記ワイヤに前記エア
ーテンシヨナによつて加えられる張力と逆方向の
張力を加え、ワイヤにかかる張力を微調可能にす
るものであり、以下実施例を用いて詳細に説明す
る。 In order to achieve such an object, the present invention provides a tension applying mechanism to a capillary, which is composed of a penetration path through which a wire passes and serves as a guide for the wire, and a branch channel that connects from one opening to near the center of this penetration path. and an air tensioner, and blows gas from this branch pipe path to apply tension to the wire in the opposite direction to the tension applied by the air tensioner, thereby making it possible to finely adjust the tension applied to the wire. will be described in detail below using examples.
第２図はこの発明に係るワイヤボンデイング装
置の一実施例を示す概略斜視図である。同図にお
いて、１３はその詳細な構造を第３図に示すよう
に金属製の張力付加機構である。 FIG. 2 is a schematic perspective view showing an embodiment of the wire bonding apparatus according to the present invention. In the same figure, 13 is a metal tension applying mechanism whose detailed structure is shown in FIG.
この第３図に示す張力付加機構１３において、
１４はワイヤ１が貫通し、ワイヤ１のガイドの役
目をするワイヤ用貫通孔からなる貫通経路、１５
はワイヤ１が送り出される方向とほぼ同一方向に
斜行し、一方の開口が貫通経路１４の中央付近で
結合し、他端の開口１５ａから気体が吹き込まれ
るようにした気体送入用貫通孔からなる支管経路
である。 In the tension applying mechanism 13 shown in FIG.
14 is a through path consisting of a wire through hole through which the wire 1 passes and serves as a guide for the wire 1; 15;
is obliquely moved in substantially the same direction as the direction in which the wire 1 is sent out, one opening is connected near the center of the through path 14, and gas is blown into the through hole from the opening 15a at the other end. This is a branch route.
次に上記構成によるワイヤボンデイング装置の
動作について説明する。まず、モータ３を強制的
に一定量だけ回転すると、ワイヤ１はスプール２
から一定量だけ解き出される。そして、この解き
出されたワイヤ１はガイドローラ４を介してエア
テンシヨナ１２に供給される。そして、このエア
テンシヨナ１２の気体吹きつけ器６の気体送出ノ
ズル８から上方に吹き出される気体の作用によ
り、ワイヤ１には矢印ｃの向きに張力T1が加え
られる。そして、更に、ワイヤ１は張力付加機構
１３を介してキヤピラリ１１へ供給されるが、こ
のとき、この張力付加機構１３の支管経路１５の
開口１５ａから気体を吹き込むと、この吹き込ま
れた気体は貫通経路１４中にワイヤ１をその送り
方向に送るように作用する。すなわち、ワイヤ１
に矢印ｃと逆向きである矢印ｂ方向に張力T2を
与える。このため、張力T1＝T2になるように、
気体を支管経路１５の開口１５ａから吹き込む
と、キヤピラリ１１の付近のワイヤ１にかかる張
力をほぼ零にすることができる。 Next, the operation of the wire bonding apparatus having the above configuration will be explained. First, when the motor 3 is forcibly rotated by a certain amount, the wire 1 is moved to the spool 2.
Only a certain amount is solved from. The unraveled wire 1 is then supplied to the air tensioner 12 via the guide roller 4. Then, by the action of the gas blown upward from the gas delivery nozzle 8 of the gas blower 6 of the air tensioner 12, a tension T1 is applied to the wire 1 in the direction of the arrow c. Further, the wire 1 is supplied to the capillary 11 via the tension applying mechanism 13, but at this time, when gas is blown from the opening 15a of the branch pipe path 15 of the tension applying mechanism 13, the blown gas penetrates through the capillary 11. It serves to feed the wire 1 into the path 14 in its feeding direction. That is, wire 1
Apply tension T 2 in the direction of arrow b, which is opposite to arrow c. Therefore, so that the tension T 1 = T 2 ,
By blowing gas through the opening 15a of the branch channel 15, the tension applied to the wire 1 near the capillary 11 can be reduced to almost zero.
なお、以上の実施例では張力付加機構１３を金
属で作つたが、任意の材質で作つてもよいことは
もちろんである。 In the above embodiment, the tension applying mechanism 13 was made of metal, but it goes without saying that it may be made of any material.
以上詳細に説明したように、この発明に係るワ
イヤボンデイング装置によれば(A)張力の微調整が
可能である。(B)張力が零近くに設定できるので、
ワイヤボンデイング中にネツク切れが防止でき
る。しかも極端に短いワイヤループの防止もで
き、安定して正常なループを作る所望のワイヤボ
ンデイングができる。(C)ワイヤにほぼ非接触で張
力を与えることができ、ワイヤの供給がスムーズ
となり、供給の速度が増加しても追従できるた
め、ワイヤボンデイングスピードを増しても、張
力系は安定に動作するなどの効果がある。 As described above in detail, according to the wire bonding apparatus according to the present invention, (A) fine adjustment of tension is possible. (B) Since the tension can be set close to zero,
Prevents wire breakage during wire bonding. Moreover, it is possible to prevent extremely short wire loops, and it is possible to perform the desired wire bonding that stably creates a normal loop. (C) Tension can be applied to the wire almost without contact, the wire is fed smoothly, and the tension system can operate stably even if the wire bonding speed increases, as it can follow the increase in feeding speed. There are effects such as
第１図は従来のワイヤボンデイング装置を示す
概略斜視図、第２図はこの発明に係るワイヤボン
デイング装置の一実施例を示す概略斜視図、第３
図は第２図の張力付加機構の詳細な斜視図であ
る。
１……金属細線（ワイヤ）、２……スプール、
３……モータ、４……ガイドローラ、５……一対
の薄い板、６……気体吹きつけ器、７……気体送
入口、８……気体送出ノズル、９……ガイド、１
０……クランパ、１１……キヤピラリ、１２……
エアテンシヨナ、１３……張力付加機構、１４…
…貫通経路、１５……支管経路。
FIG. 1 is a schematic perspective view showing a conventional wire bonding device, FIG. 2 is a schematic perspective view showing an embodiment of the wire bonding device according to the present invention, and FIG.
The figure is a detailed perspective view of the tensioning mechanism of FIG. 2. 1...Thin metal wire (wire), 2...Spool,
3... Motor, 4... Guide roller, 5... Pair of thin plates, 6... Gas blower, 7... Gas inlet, 8... Gas delivery nozzle, 9... Guide, 1
0... Clamper, 11... Capillary, 12...
Air tensioner, 13...Tension adding mechanism, 14...
...through route, 15...branch route.
Claims (1)
で接続するワイヤボンデイング装置において、金
属細線を巻いたスプールと、このスプールから供
給される金属細線に対してキヤピラリの真上方向
に所定の張力を加えるエアテンシヨナと、金属細
線が貫通し、金属細線のガイドの役目をする貫通
経路と一方の開口からこの貫通経路の中央付近で
結合する支管経路とからなる張力付加機構とを備
え、この張力付加機構の支管経路から気体を吹き
込み、前記金属細線に、前記エアテンシヨナによ
つて加えられる張力と逆方向の張力を加え、金属
細線にかかる張力を微調可能にしたことを特徴と
するワイヤボンデイング装置。1 In a wire bonding device that connects the electrode of a semiconductor pellet and a lead with a thin metal wire, a spool wound with a thin metal wire and an air tensioner that applies a predetermined tension directly above the capillary to the thin metal wire supplied from the spool. and a tensioning mechanism consisting of a penetration path through which a thin metal wire passes and serves as a guide for the thin metal wire, and a branch path that connects from one opening to near the center of this penetration path, and a branch of the tensioning mechanism. A wire bonding device characterized in that the tension applied to the thin metal wire can be finely adjusted by blowing gas through a path and applying tension to the thin metal wire in a direction opposite to the tension applied by the air tensioner.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57033582A JPS58151038A (en) | 1982-03-02 | 1982-03-02 | Wire bonding apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57033582A JPS58151038A (en) | 1982-03-02 | 1982-03-02 | Wire bonding apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58151038A JPS58151038A (en) | 1983-09-08 |
| JPH0320900B2 true JPH0320900B2 (en) | 1991-03-20 |
Family
ID=12390514
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57033582A Granted JPS58151038A (en) | 1982-03-02 | 1982-03-02 | Wire bonding apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58151038A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5984533A (en) * | 1982-11-08 | 1984-05-16 | Hitachi Tokyo Electronics Co Ltd | Feeding mechanism of wire |
| JPH0254947A (en) * | 1988-08-19 | 1990-02-23 | Hitachi Ltd | Method and apparatus for assembly of semiconductor device |
-
1982
- 1982-03-02 JP JP57033582A patent/JPS58151038A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58151038A (en) | 1983-09-08 |
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