KR0166819B1 - Wire supply apparatus of wire bonding machine - Google Patents
Wire supply apparatus of wire bonding machine Download PDFInfo
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- KR0166819B1 KR0166819B1 KR1019950047412A KR19950047412A KR0166819B1 KR 0166819 B1 KR0166819 B1 KR 0166819B1 KR 1019950047412 A KR1019950047412 A KR 1019950047412A KR 19950047412 A KR19950047412 A KR 19950047412A KR 0166819 B1 KR0166819 B1 KR 0166819B1
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- wire
- compressed air
- clamper
- branch pipe
- supply
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- 238000010586 diagram Methods 0.000 description 4
- 238000007689 inspection Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 239000000835 fiber Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Wire Bonding (AREA)
Abstract
본 발명은 다이본딩이 완료된 상태에서 다이의 패드와 리드프레임의 인너리드사이에 와이어를 본딩하는 와이어본딩머신에서 캐필러리측으로 와이어를 공급하는 장치에 관한 것으로써, 좀더 구체적으로는 스풀에 감긴 와이어가 풀릴 때 와이어 브레이크불량 및 와이어가 빠지는 현상을 미연에 방지하기 위한 것이다.The present invention relates to an apparatus for supplying a wire to a capillary side in a wire bonding machine for bonding wires between a pad of a die and an inner lead of a lead frame in a state where die bonding is completed, and more specifically, a wire wound on a spool. This is to prevent the wire brake failure and the wire falling out when the is released.
이를 위해, 한쌍의 가이더(4a)(4b) 사이에 와이어 텐션부(5)를 설치하고 설치판(3)의 직하방에는 제1,2와이어 클램퍼 및 캐필러리(8)를 차례로 설치하여 스풀(2)에 감겨진 와이어(1)를 송급하도록 된 것에 있어서, 상기 와이어 텐션부(5)로 압축공기를 공급하는 공급관(10)에 분기관(11)을 연결하여 상기 분기관상에 스피드 콘트롤러(13)를 설치하고 상기 분기관(11)은 압축공기의 공급에 의해 동작하는 공지의 압축공기 와이어 클램퍼(14)와 연결하여 상기 압축공기 와이어 클램퍼(14)가 제2와이어 클램퍼역할을 하도록 된 것이다.To this end, the wire tensioning portion 5 is installed between the pair of guiders 4a and 4b, and the first and second wire clampers and the capillary 8 are sequentially installed directly under the mounting plate 3, and then the spool is installed. In the feeding of the wire (1) wound on (2), the branch pipe (11) is connected to a supply pipe (10) for supplying compressed air to the wire tension section (5), and the speed controller 13) and the branch pipe 11 is connected to a known compressed air wire clamper 14 operated by supply of compressed air so that the compressed air wire clamper 14 serves as a second wire clamper. .
Description
제1도는 종래의 장치를 나타낸 구성도.1 is a block diagram showing a conventional device.
제2도는 본 발명이 적용된 장치의 구성도.2 is a block diagram of a device to which the present invention is applied.
* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings
1 : 와이어 2 : 스풀1: wire 2: spool
3 : 설치판 4a,4b : 가이더3: mounting plate 4a, 4b: guider
5 : 와이어 텐션부 8 : 캐필러리5: wire tension part 8: capillary
10 : 압축공기 공급관 11 : 분기관10: compressed air supply pipe 11: branch pipe
13 : 스피드 콘트롤러 14 : 공지의 압축공기 와이어 클램프13: Speed controller 14: Known compressed air wire clamp
본 발명은 다이본딩이 완료된 상태에서 다이의 패드와 리드프레임의 인너리드사이에 와이어를 본딩하는 와이어본딩머신에서 캐필러리측으로 와이어를 공급하는 장치에 관한 것으로써, 좀더 구체적으로는 스풀에 감긴 와이어가 풀릴 때 와이어 브레이크불량 및 와이어가 빠지는 현상을 미연에 방지할 수 있도록 한 것이다.The present invention relates to an apparatus for supplying a wire to a capillary side in a wire bonding machine for bonding wires between a pad of a die and an inner lead of a lead frame in a state where die bonding is completed, and more specifically, a wire wound on a spool. Is to prevent the wire brake failure and the wire falling out when the is released.
첨부도면 제1도는 종래의 장치를 나타낸 구성도로써, 와이어(1)가 감긴 스풀(2)이 회전가능하게 설치된 하측에 설치판(3)이 설치되어 있고 상기 설치판에는 스풀(Spool)(2)에서 풀리는 와이어를 가이드하기 위한 가이더(4a)(4b)가 설치되어 있으며 상기 가이더사이에는 압축공기를 유입시켜 풀어지는 와이어에 텐션(Tension)을 가하는 와이어 텐션부(5)가 설치되어 있다.1 is a configuration diagram showing a conventional apparatus, in which a mounting plate 3 is installed at a lower side of which a spool 2 wound with a wire 1 is rotatably installed, and a spool 2 is installed on the mounting plate. Guides (4a) and (4b) for guiding the wires to be released in () is provided between the wires are provided with a tension portion (5) for applying a tension (tension) to the wire to be released by flowing compressed air.
그리고 상기 설치판(3)의 하측에는 와이어본딩을 실시할 때 와이어(1)를 클램핑하는 제2와이어 클램퍼(7)가 설치되어 있고 상기 제2와이어 클램퍼의 직하방에는 제1와이어 클램퍼(6)와 캐필러리(Capillary)(8)가 차례로 설치되어 있다.In addition, a second wire clamper 7 is provided below the mounting plate 3 to clamp the wire 1 when wire bonding. The first wire clamper 6 is directly below the second wire clamper. And capillary 8 are installed in this order.
상기 제1,2와이어 클램퍼(6)(7)는 솔레노이드(도시는 생략함)의 온,오프동작에 의해 기계적으로 동작된다.The first and second wire clampers 6 and 7 are mechanically operated by on and off operations of solenoids (not shown).
상기 캐필러리(8)를 통해 와이어(1)를 송급하면서 와이어본딩을 실시함에 따라 스풀(2)에 감겨진 와이어가 점진적으로 풀리게 되는데, 그 과정을 살펴 보면 다음과 같다.As the wire bonding is performed while feeding the wire 1 through the capillary 8, the wire wound on the spool 2 is gradually released, and the process is as follows.
상기 스풀(2)에 감겨진 와이어(1)를 풀기 위해 제2와이어 클램퍼(7)의 솔레노이드에 전원이 인가되면 와이어가 제2와이어 클램퍼에 의해 이송이 중단된다.When power is applied to the solenoid of the second wire clamper 7 to release the wire 1 wound on the spool 2, the wire is stopped by the second wire clamper.
이러한 상태에서 와이어 텐션부(5)에 압축공기가 공급되어 이를 화이버(Fiber) 센서가 감지하면 스풀(2)에 감겨져 있던 와이어가 풀리거나, 상기 와이어의 풀어짐이 중단된다.In this state, when compressed air is supplied to the wire tension unit 5 and sensed by the fiber sensor, the wire wound on the spool 2 is released or the wire is stopped.
그러나 이러한 종래의 와이어 공급장치에서 와이어를 클램핑하기 위해 제1,2와이어 클램퍼(6)(7)에 솔레노이드를 사용하였기 때문에 제2와이어 클램퍼의 동작시 와이어가 상기 제2와이어 클램퍼에서 빠지므로 인해 와이어 브레이크현상이 발생되었음은 물론 월1회씩 실시하는 정기 점검시에 솔레노이드와 와이어사이의 갭(Gap)을 조절하는데 많은 시간을 필요로 하게 되므로 생산성의 저하를 초래하게 되었다.However, since the solenoid is used in the first and second wire clampers 6 and 7 to clamp the wire in the conventional wire supply device, the wire is pulled out of the second wire clamper during the operation of the second wire clamper. In addition to the occurrence of brakes, the regular inspection, which is carried out once a month, requires a lot of time to adjust the gap between the solenoid and the wire, resulting in a decrease in productivity.
본 발명은 종래의 이와 같은 문제점을 해결하기 위해 안출한 것으로써, 제2와이어 클램퍼에서 와이어를 기계적으로 클램핑하는 방식을 달리하여 와이어 브레이크 현상이 발생되는 것을 미연에 방지함과 동시에 정기 점검시 제2와이어 클램퍼에서 갭조정을 하지 않도록 하는데 그 목적이 있다.The present invention has been made to solve such a problem in the prior art, by preventing the occurrence of the wire brake phenomenon by a different way of mechanically clamping the wire in the second wire clamper and at the same time the second inspection The purpose is to avoid gap adjustment in the wire clamper.
상기 목적을 달성하기 위한 본 발명의 형태에 따르면, 한쌍의 가이더사이에 와이어 텐션부를 설치하고 설치판의 직하방에는 제1,2와이어 클램퍼 및 캐필러리를 차례로 설치하여 스풀에 감겨진 와이어를 송급하도록 된 것에 있어서, 상기 와이어 텐션부로 압축공기를 공급하는 공급관에 분기관을 연결하여 상기 분기관상에 스피드 콘트롤러를 설치하고 상기 분기관은 압축공기의 공급에 의해 동작하는 공지의 압축공기 와이어 클램퍼와 연결하여 상기 압축공기 와이어 클램퍼가 제2와이어 클램퍼역할을 하도록 구성됨을 특징으로 하는 와이어본딩머신의 와이어 공급장치가 제공된다.According to an aspect of the present invention for achieving the above object, a wire tensioning portion is provided between a pair of guiders, and the first and second wire clampers and capillaries are sequentially installed directly below the mounting plate to supply the wire wound on the spool. In this configuration, a branch pipe is connected to a supply pipe for supplying compressed air to the wire tension unit, a speed controller is installed on the branch pipe, and the branch pipe is connected to a known compressed air wire clamper operated by supply of compressed air. Thus, the compressed air wire clamper is provided to provide a wire supply device for a wire bonding machine, characterized in that configured to act as a second wire clamper.
이하 본 발명을 일 실시예로 도시한 첨부된 도면 제2도를 참고로 하여 더욱 상세히 설명하면 다음과 같다.Hereinafter, the present invention will be described in more detail with reference to FIG. 2 of the accompanying drawings.
첨부도면 제2도는 본 발명이 적용된 장치의 구성도로써, 본 발명의 구성중 종래의 구성과 동일한 부분은 그 설명을 생략하고 동일부호를 부여하기로 한다.2 is a block diagram of an apparatus to which the present invention is applied, and the same parts as those of the conventional structure of the present invention will be omitted with the same reference numerals.
본 발명은 와이어 텐션부(5)로 압축공기를 공급하는 공급관(10)에 분기관(11)이 한쌍의 T형 연결관(12)에 의해 연결되어 있고 상기 분기관상에는 공급되는 압축공기의 공급속도를 조절하는 스피드 콘트롤러(13)가 설치되어 있으며 상기 분기관(11)의 끝단은 압축공기의 공급에 의해 동작하는 공지의 압축공기 와이어 클램퍼(14)와 연결되어 있어 상기 압축공기 와이어 클램퍼(14)가 종래 장치의 제2와이어 클램퍼 역할을 하도록 되어 있다.According to the present invention, a branch pipe (11) is connected to a supply pipe (10) for supplying compressed air to the wire tension unit (5) by a pair of T-shaped connecting pipes (12), and supply of compressed air supplied on the branch pipe. A speed controller 13 for adjusting the speed is provided, and an end of the branch pipe 11 is connected to a known compressed air wire clamper 14 operated by supply of compressed air, thereby providing the compressed air wire clamper 14. ) Serves as the second wire clamper of the conventional device.
그리고 가이더(4a)(4b)의 사이에는 상기 와이어 텐션부(5)로 압축공기가 공급됨을 검출하는 센서(15)가 설치되어 있고 압축공기 공급관(10)에는 압축공기의 흐름량을 검출하는 유량계(16)가 설치되어 있다.A sensor 15 is installed between the guiders 4a and 4b to detect the supply of compressed air to the wire tension section 5, and the compressed air supply pipe 10 detects the flow rate of the compressed air. 16) is installed.
이와 같이 구성된 본 발명의 작용, 효과를 설명하면 다음과 같다.Referring to the operation and effects of the present invention configured as described above are as follows.
먼저, 스풀(2)에 감겨진 와이어(1)를 풀기 위해 와이어 텐션부(5)와 연결된 압축 공기 공급관(10)으로 압축공기가 공급되면 상기 압축공기는 압축공기 공급관(10)과 분기관(11)을 통해 와이어 텐션부(5)와 제2와이어 클램프역할을 하는 공지의 와이어 클램퍼(14)로 공급되므로 와이어 텐션부(5)에 압축공기가 공급됨을 센서(15)가 감지하여 스풀(2)에 감겨져 있던 와이어를 풀거나, 상기 와이어의 풀어짐을 중단시키게 된다.First, when compressed air is supplied to the compressed air supply pipe 10 connected to the wire tension unit 5 to unwind the wire 1 wound on the spool 2, the compressed air is supplied to the compressed air supply pipe 10 and the branch pipe ( 11, the sensor 15 detects that the compressed air is supplied to the wire tension unit 5 because it is supplied to the wire tension unit 5 and the known wire clamper 14 serving as the second wire clamp. ), Or the wire is stopped.
상기한 바와 같은 동작시 압축공기 공급관(10)을 통해 공급되는 일부의 압축공기는 분기관(11)을 통해 제2와이어 클램프역할을 하는 공지의 압축공기 와이어 클램퍼(14)로 공급되므로 와이어를 클램핑하게 되고, 이에 따라 제1와이어 클램퍼(6)와 캐필러리(8)의 동작에 의해 와이어본딩을 실시할 수 있게 된다.Some of the compressed air supplied through the compressed air supply pipe 10 during the operation as described above is supplied to the known compressed air wire clamper 14 serving as a second wire clamp through the branch pipe 11, thereby clamping the wire. Accordingly, wire bonding may be performed by the operations of the first wire clamper 6 and the capillary 8.
이와 같이 분기관(11)을 통해 공지의 압축공기 와이어 클램퍼(14)로 공급되는 압축공기의 속도는 분기관(11)상에 설치된 스피드 콘트롤러(13)가 조절하게 되는 것이다.As such, the speed of the compressed air supplied to the known compressed air wire clamper 14 through the branch pipe 11 is controlled by the speed controller 13 installed on the branch pipe 11.
이상에서와 같이 본 발명은 와이어 텐션부(5)로 공급되는 압축공기를 이용하여 공지의 압축공기 와이어 클램퍼(14)를 동작시켜 와이어의 이송을 제어하도록 되어 있으므로 와이어의 송급시 와이어가 빠지는 와이어 브레이크 현상을 미연에 방지하게 됨은 물론 기기의 정기 점검시에도 공지의 압축공기 와이어 클램퍼에서 와이어의 갭을 조절할 필요가 없게 되므로 신속한 정기 점검이 가능해지게 되고, 이에 따라 기기의 가동률을 향상시키게 되므로 생산성이 향상되는 효과를 얻게 된다.As described above, the present invention is to control the conveying of the wire by operating the known compressed air wire clamper 14 by using the compressed air supplied to the wire tensioning unit 5, so that the wire breaks when the wire is fed. As well as preventing the phenomenon, it is not necessary to adjust the gap of the wire in the well-known compressed air wire clamper during regular inspection of the device, so that it is possible to quickly perform regular inspection, thereby improving the operation rate of the device, thereby improving productivity. You get the effect.
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019950047412A KR0166819B1 (en) | 1995-12-07 | 1995-12-07 | Wire supply apparatus of wire bonding machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019950047412A KR0166819B1 (en) | 1995-12-07 | 1995-12-07 | Wire supply apparatus of wire bonding machine |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR970053162A KR970053162A (en) | 1997-07-29 |
| KR0166819B1 true KR0166819B1 (en) | 1999-02-01 |
Family
ID=19438267
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019950047412A KR0166819B1 (en) | 1995-12-07 | 1995-12-07 | Wire supply apparatus of wire bonding machine |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR0166819B1 (en) |
-
1995
- 1995-12-07 KR KR1019950047412A patent/KR0166819B1/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| KR970053162A (en) | 1997-07-29 |
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