JPS58159361A - 多層混成集積回路装置 - Google Patents

多層混成集積回路装置

Info

Publication number
JPS58159361A
JPS58159361A JP4326082A JP4326082A JPS58159361A JP S58159361 A JPS58159361 A JP S58159361A JP 4326082 A JP4326082 A JP 4326082A JP 4326082 A JP4326082 A JP 4326082A JP S58159361 A JPS58159361 A JP S58159361A
Authority
JP
Japan
Prior art keywords
substrates
integrated circuit
hybrid integrated
circuit device
external leads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4326082A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6250063B2 (enrdf_load_stackoverflow
Inventor
Yoshio Miura
三浦　敬男
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Sanyo Electric Co Ltd
Sanyo Electric Co Ltd
Sanyo Denki Co Ltd
Original Assignee
Tokyo Sanyo Electric Co Ltd
Sanyo Electric Co Ltd
Sanyo Denki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Sanyo Electric Co Ltd, Sanyo Electric Co Ltd, Sanyo Denki Co Ltd filed Critical Tokyo Sanyo Electric Co Ltd
Priority to JP4326082A priority Critical patent/JPS58159361A/ja
Publication of JPS58159361A publication Critical patent/JPS58159361A/ja
Publication of JPS6250063B2 publication Critical patent/JPS6250063B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5385—Assembly of a plurality of insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3405—Edge mounted components, e.g. terminals

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP4326082A 1982-03-17 1982-03-17 多層混成集積回路装置 Granted JPS58159361A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4326082A JPS58159361A (ja) 1982-03-17 1982-03-17 多層混成集積回路装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4326082A JPS58159361A (ja) 1982-03-17 1982-03-17 多層混成集積回路装置

Publications (2)

Publication Number Publication Date
JPS58159361A true JPS58159361A (ja) 1983-09-21
JPS6250063B2 JPS6250063B2 (enrdf_load_stackoverflow) 1987-10-22

Family

ID=12658876

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4326082A Granted JPS58159361A (ja) 1982-03-17 1982-03-17 多層混成集積回路装置

Country Status (1)

Country Link
JP (1) JPS58159361A (enrdf_load_stackoverflow)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4862322A (en) * 1988-05-02 1989-08-29 Bickford Harry R Double electronic device structure having beam leads solderlessly bonded between contact locations on each device and projecting outwardly from therebetween
US5296737A (en) * 1990-09-06 1994-03-22 Hitachi, Ltd. Semiconductor device with a plurality of face to face chips
US5313367A (en) * 1990-06-26 1994-05-17 Seiko Epson Corporation Semiconductor device having a multilayer interconnection structure
US5479051A (en) * 1992-10-09 1995-12-26 Fujitsu Limited Semiconductor device having a plurality of semiconductor chips
US5602420A (en) * 1992-09-07 1997-02-11 Hitachi, Ltd. Stacked high mounting density semiconductor devices
NL2021293A (en) * 2017-07-14 2019-01-25 Shindengen Electric Mfg Electronic module

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4862322A (en) * 1988-05-02 1989-08-29 Bickford Harry R Double electronic device structure having beam leads solderlessly bonded between contact locations on each device and projecting outwardly from therebetween
US5313367A (en) * 1990-06-26 1994-05-17 Seiko Epson Corporation Semiconductor device having a multilayer interconnection structure
US5296737A (en) * 1990-09-06 1994-03-22 Hitachi, Ltd. Semiconductor device with a plurality of face to face chips
US5602420A (en) * 1992-09-07 1997-02-11 Hitachi, Ltd. Stacked high mounting density semiconductor devices
US5479051A (en) * 1992-10-09 1995-12-26 Fujitsu Limited Semiconductor device having a plurality of semiconductor chips
NL2021293A (en) * 2017-07-14 2019-01-25 Shindengen Electric Mfg Electronic module

Also Published As

Publication number Publication date
JPS6250063B2 (enrdf_load_stackoverflow) 1987-10-22

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