JPS58153332A - ドライエツチング装置 - Google Patents
ドライエツチング装置Info
- Publication number
- JPS58153332A JPS58153332A JP3766582A JP3766582A JPS58153332A JP S58153332 A JPS58153332 A JP S58153332A JP 3766582 A JP3766582 A JP 3766582A JP 3766582 A JP3766582 A JP 3766582A JP S58153332 A JPS58153332 A JP S58153332A
- Authority
- JP
- Japan
- Prior art keywords
- etching
- chamber
- temperature
- container
- upper electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/20—Means for supporting or positioning the object or the material; Means for adjusting diaphragms or lenses associated with the support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/20—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
- H01J2237/2001—Maintaining constant desired temperature
Landscapes
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Drying Of Semiconductors (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3766582A JPS58153332A (ja) | 1982-03-08 | 1982-03-08 | ドライエツチング装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3766582A JPS58153332A (ja) | 1982-03-08 | 1982-03-08 | ドライエツチング装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS58153332A true JPS58153332A (ja) | 1983-09-12 |
JPH0442821B2 JPH0442821B2 (enrdf_load_html_response) | 1992-07-14 |
Family
ID=12503922
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3766582A Granted JPS58153332A (ja) | 1982-03-08 | 1982-03-08 | ドライエツチング装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58153332A (enrdf_load_html_response) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60140723A (ja) * | 1983-12-28 | 1985-07-25 | Oki Electric Ind Co Ltd | ドライエッチング方法 |
JPS60154529A (ja) * | 1984-01-23 | 1985-08-14 | Mitsubishi Electric Corp | ドライエツチング装置 |
JPS6163030A (ja) * | 1984-08-20 | 1986-04-01 | Kokusai Electric Co Ltd | プラズマエッチング装置の電極温度制御方法 |
JPS61260637A (ja) * | 1985-05-15 | 1986-11-18 | Mitsubishi Electric Corp | ドライエツチング装置 |
JPS6230329A (ja) * | 1985-07-31 | 1987-02-09 | Toshiba Corp | ドライエツチング装置 |
JPS6310522A (ja) * | 1986-07-02 | 1988-01-18 | Sony Corp | ドライエツチング方法 |
US4938839A (en) * | 1986-02-14 | 1990-07-03 | Fujitsu Limited | Method of removing photoresist on a semiconductor wafer |
US5045652A (en) * | 1988-06-02 | 1991-09-03 | Kabushiki Kaisha Toshiba | Disconnector of gas insulated switchgear |
JPH04180222A (ja) * | 1990-11-15 | 1992-06-26 | Anelva Corp | エッチング方法および装置 |
EP0732729A3 (en) * | 1995-03-16 | 1997-03-26 | Hitachi Ltd | Plasma processing device and method |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3367303A (en) * | 1963-05-29 | 1968-02-06 | Monsanto Co | Chemical equipment |
JPS53123669A (en) * | 1977-04-05 | 1978-10-28 | Fujitsu Ltd | Wafer holding method |
JPS6056431A (ja) * | 1983-09-07 | 1985-04-02 | Tokyo Electric Power Co Inc:The | 硬銅線単線又は撚線の残留応力除去方法 |
-
1982
- 1982-03-08 JP JP3766582A patent/JPS58153332A/ja active Granted
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3367303A (en) * | 1963-05-29 | 1968-02-06 | Monsanto Co | Chemical equipment |
JPS53123669A (en) * | 1977-04-05 | 1978-10-28 | Fujitsu Ltd | Wafer holding method |
JPS6056431A (ja) * | 1983-09-07 | 1985-04-02 | Tokyo Electric Power Co Inc:The | 硬銅線単線又は撚線の残留応力除去方法 |
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60140723A (ja) * | 1983-12-28 | 1985-07-25 | Oki Electric Ind Co Ltd | ドライエッチング方法 |
JPS60154529A (ja) * | 1984-01-23 | 1985-08-14 | Mitsubishi Electric Corp | ドライエツチング装置 |
JPS6163030A (ja) * | 1984-08-20 | 1986-04-01 | Kokusai Electric Co Ltd | プラズマエッチング装置の電極温度制御方法 |
JPS61260637A (ja) * | 1985-05-15 | 1986-11-18 | Mitsubishi Electric Corp | ドライエツチング装置 |
JPS6230329A (ja) * | 1985-07-31 | 1987-02-09 | Toshiba Corp | ドライエツチング装置 |
US4938839A (en) * | 1986-02-14 | 1990-07-03 | Fujitsu Limited | Method of removing photoresist on a semiconductor wafer |
JPS6310522A (ja) * | 1986-07-02 | 1988-01-18 | Sony Corp | ドライエツチング方法 |
US5045652A (en) * | 1988-06-02 | 1991-09-03 | Kabushiki Kaisha Toshiba | Disconnector of gas insulated switchgear |
JPH04180222A (ja) * | 1990-11-15 | 1992-06-26 | Anelva Corp | エッチング方法および装置 |
EP0732729A3 (en) * | 1995-03-16 | 1997-03-26 | Hitachi Ltd | Plasma processing device and method |
EP0881662A1 (en) * | 1995-03-16 | 1998-12-02 | Hitachi, Ltd. | Plasma processing apparatus and plasma processing method |
US6171438B1 (en) | 1995-03-16 | 2001-01-09 | Hitachi, Ltd. | Plasma processing apparatus and plasma processing method |
US6815365B2 (en) | 1995-03-16 | 2004-11-09 | Hitachi, Ltd. | Plasma etching apparatus and plasma etching method |
US7208422B2 (en) | 1995-03-16 | 2007-04-24 | Hitachi, Ltd. | Plasma processing method |
US7565879B2 (en) | 1995-03-16 | 2009-07-28 | Hitachi, Ltd | Plasma processing apparatus |
Also Published As
Publication number | Publication date |
---|---|
JPH0442821B2 (enrdf_load_html_response) | 1992-07-14 |
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