JPS5815240A - 半導体製造装置 - Google Patents

半導体製造装置

Info

Publication number
JPS5815240A
JPS5815240A JP56112144A JP11214481A JPS5815240A JP S5815240 A JPS5815240 A JP S5815240A JP 56112144 A JP56112144 A JP 56112144A JP 11214481 A JP11214481 A JP 11214481A JP S5815240 A JPS5815240 A JP S5815240A
Authority
JP
Japan
Prior art keywords
section
distribution
mold
lead frame
assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56112144A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0225253B2 (OSRAM
Inventor
Osamu Sumiya
修 角谷
Tsutomu Mimata
巳亦　力
Takeshi Shimizu
猛 清水
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP56112144A priority Critical patent/JPS5815240A/ja
Publication of JPS5815240A publication Critical patent/JPS5815240A/ja
Publication of JPH0225253B2 publication Critical patent/JPH0225253B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H05K13/0046—

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP56112144A 1981-07-20 1981-07-20 半導体製造装置 Granted JPS5815240A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56112144A JPS5815240A (ja) 1981-07-20 1981-07-20 半導体製造装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56112144A JPS5815240A (ja) 1981-07-20 1981-07-20 半導体製造装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP29128289A Division JPH02168633A (ja) 1989-11-10 1989-11-10 半導体製造装置

Publications (2)

Publication Number Publication Date
JPS5815240A true JPS5815240A (ja) 1983-01-28
JPH0225253B2 JPH0225253B2 (OSRAM) 1990-06-01

Family

ID=14579317

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56112144A Granted JPS5815240A (ja) 1981-07-20 1981-07-20 半導体製造装置

Country Status (1)

Country Link
JP (1) JPS5815240A (OSRAM)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009267414A (ja) * 2008-04-25 2009-11-12 Sts Semiconductor & Telecommunications Co Ltd 幅広リードフレーム用の半導体パッケージ製造装置及びこれを利用した半導体パッケージ製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54105479A (en) * 1978-02-06 1979-08-18 Mitsubishi Electric Corp Manufacture unit of resin sealed type semiconductor device
JPS5596642A (en) * 1979-01-17 1980-07-23 Hitachi Ltd Automatic molding machine
JPS5617238A (en) * 1979-07-24 1981-02-19 Toshiba Corp Mold device for molding resin
JPH0225253A (ja) * 1988-07-14 1990-01-26 Nkk Corp 連続鋳造用浸漬ノズル

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54105479A (en) * 1978-02-06 1979-08-18 Mitsubishi Electric Corp Manufacture unit of resin sealed type semiconductor device
JPS5596642A (en) * 1979-01-17 1980-07-23 Hitachi Ltd Automatic molding machine
JPS5617238A (en) * 1979-07-24 1981-02-19 Toshiba Corp Mold device for molding resin
JPH0225253A (ja) * 1988-07-14 1990-01-26 Nkk Corp 連続鋳造用浸漬ノズル

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009267414A (ja) * 2008-04-25 2009-11-12 Sts Semiconductor & Telecommunications Co Ltd 幅広リードフレーム用の半導体パッケージ製造装置及びこれを利用した半導体パッケージ製造方法

Also Published As

Publication number Publication date
JPH0225253B2 (OSRAM) 1990-06-01

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