JPS58138588A - 光照射加工装置 - Google Patents

光照射加工装置

Info

Publication number
JPS58138588A
JPS58138588A JP57019582A JP1958282A JPS58138588A JP S58138588 A JPS58138588 A JP S58138588A JP 57019582 A JP57019582 A JP 57019582A JP 1958282 A JP1958282 A JP 1958282A JP S58138588 A JPS58138588 A JP S58138588A
Authority
JP
Japan
Prior art keywords
light
slit
slit forming
irradiation
light irradiation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57019582A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6254591B2 (enExample
Inventor
Katsuro Mizukoshi
克郎 水越
Mikio Hongo
幹雄 本郷
Takeoki Miyauchi
宮内 建興
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP57019582A priority Critical patent/JPS58138588A/ja
Publication of JPS58138588A publication Critical patent/JPS58138588A/ja
Publication of JPS6254591B2 publication Critical patent/JPS6254591B2/ja
Granted legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
JP57019582A 1982-02-12 1982-02-12 光照射加工装置 Granted JPS58138588A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57019582A JPS58138588A (ja) 1982-02-12 1982-02-12 光照射加工装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57019582A JPS58138588A (ja) 1982-02-12 1982-02-12 光照射加工装置

Publications (2)

Publication Number Publication Date
JPS58138588A true JPS58138588A (ja) 1983-08-17
JPS6254591B2 JPS6254591B2 (enExample) 1987-11-16

Family

ID=12003250

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57019582A Granted JPS58138588A (ja) 1982-02-12 1982-02-12 光照射加工装置

Country Status (1)

Country Link
JP (1) JPS58138588A (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1994003134A1 (en) * 1992-08-03 1994-02-17 Sunrise Technologies, Inc. Method and apparatus for exposing a human eye to a controlled pattern of radiation spots
GB2417130A (en) * 2004-08-10 2006-02-15 Lg Philips Lcd Co Ltd Amorphous silicon crystallization
JP2006239743A (ja) * 2005-03-03 2006-09-14 V Technology Co Ltd レーザ加工方法
JP2011194432A (ja) * 2010-03-18 2011-10-06 Olympus Corp レーザ加工方法、及び、レーザ加工装置
JP2012247791A (ja) * 2012-07-13 2012-12-13 Lasertec Corp 直線駆動装置、可変シャッター装置、ビーム成形装置、ビーム照射装置、欠陥修正方法及びパターン基板の製造方法本発明は、直線駆動装置、可変シャッター装置、ビーム成形装置、及びビーム照射装置、並びにビーム成形装置を用いた欠陥修正方法及びパターン基板の製造方法に関する。

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1994003134A1 (en) * 1992-08-03 1994-02-17 Sunrise Technologies, Inc. Method and apparatus for exposing a human eye to a controlled pattern of radiation spots
GB2417130A (en) * 2004-08-10 2006-02-15 Lg Philips Lcd Co Ltd Amorphous silicon crystallization
GB2417130B (en) * 2004-08-10 2007-02-21 Lg Philips Lcd Co Ltd Variable mask device for crystallizing silicon layer and method for crystalling using the same
US7429760B2 (en) 2004-08-10 2008-09-30 Lg Display Co., Ltd. Variable mask device for crystallizing silicon layer
JP2006239743A (ja) * 2005-03-03 2006-09-14 V Technology Co Ltd レーザ加工方法
JP2011194432A (ja) * 2010-03-18 2011-10-06 Olympus Corp レーザ加工方法、及び、レーザ加工装置
JP2012247791A (ja) * 2012-07-13 2012-12-13 Lasertec Corp 直線駆動装置、可変シャッター装置、ビーム成形装置、ビーム照射装置、欠陥修正方法及びパターン基板の製造方法本発明は、直線駆動装置、可変シャッター装置、ビーム成形装置、及びビーム照射装置、並びにビーム成形装置を用いた欠陥修正方法及びパターン基板の製造方法に関する。

Also Published As

Publication number Publication date
JPS6254591B2 (enExample) 1987-11-16

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