JPS58138336U - ワイヤボンデイング装置 - Google Patents

ワイヤボンデイング装置

Info

Publication number
JPS58138336U
JPS58138336U JP1982036086U JP3608682U JPS58138336U JP S58138336 U JPS58138336 U JP S58138336U JP 1982036086 U JP1982036086 U JP 1982036086U JP 3608682 U JP3608682 U JP 3608682U JP S58138336 U JPS58138336 U JP S58138336U
Authority
JP
Japan
Prior art keywords
wire
wire bonding
bonding equipment
predetermined
needle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1982036086U
Other languages
English (en)
Inventor
洋 近藤
Original Assignee
富士電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士電機株式会社 filed Critical 富士電機株式会社
Priority to JP1982036086U priority Critical patent/JPS58138336U/ja
Publication of JPS58138336U publication Critical patent/JPS58138336U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus

Landscapes

  • Wire Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
図は本考案の一実施例の要部斜視図である。 １・・・ボンディングワイヤ、２・・・半導体チップ、
３・・・フレーム、４・・・フレームリード部、５・・
・針。

Claims (1)

    【実用新案登録請求の範囲】
  1. ボンディングを終えた部品の送り方向の前方に、進行す
    る部品内のボンディングされたワイヤに抵′抗して該ワ
    イヤに所定の張力を与えた後ワイヤか、　らそれる弾性
    を有する針が所定の易位置に配置されたことを特徴とす
    るワイヤボンディング装置。
JP1982036086U 1982-03-15 1982-03-15 ワイヤボンデイング装置 Pending JPS58138336U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982036086U JPS58138336U (ja) 1982-03-15 1982-03-15 ワイヤボンデイング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982036086U JPS58138336U (ja) 1982-03-15 1982-03-15 ワイヤボンデイング装置

Publications (1)

Publication Number Publication Date
JPS58138336U true JPS58138336U (ja) 1983-09-17

Family

ID=30047533

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982036086U Pending JPS58138336U (ja) 1982-03-15 1982-03-15 ワイヤボンデイング装置

Country Status (1)

Country Link
JP (1) JPS58138336U (ja)

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