JPS6112235U - ワイヤボンデイング装置 - Google Patents

ワイヤボンデイング装置

Info

Publication number
JPS6112235U
JPS6112235U JP1984094957U JP9495784U JPS6112235U JP S6112235 U JPS6112235 U JP S6112235U JP 1984094957 U JP1984094957 U JP 1984094957U JP 9495784 U JP9495784 U JP 9495784U JP S6112235 U JPS6112235 U JP S6112235U
Authority
JP
Japan
Prior art keywords
wire
wire bonding
capillary
bonding equipment
bonding device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1984094957U
Other languages
English (en)
Inventor
隆 武井
十三男 小林
Original Assignee
株式会社 新川
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社 新川 filed Critical 株式会社 新川
Priority to JP1984094957U priority Critical patent/JPS6112235U/ja
Publication of JPS6112235U publication Critical patent/JPS6112235U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
図は本考案になるワイヤボンデイング装置の一実施例を
示す要部説明図である。 １・・・ワイヤ、２・・・ワイヤ保持用クランパー、３
・・・ワイヤ切断用クランパー、４・・・キャピラリ、
５・・・基板、６・・・ペレット。

Claims (2)

    【実用新案登録請求の範囲】
  1. （１）スプールに巻回されたワイヤをワイヤ保持用クラ
    ンパー及びワイヤ切断用クランバーを通してキャピラリ
    に挿通し、２つのボンド点間にワイヤを前記キャピラリ
    で接続するワイヤボンデイング装置において、前記ワイ
    ヤ保持用クランパのクランプ面にワイヤより柔り軟質材
    を設けたことを特徴とするワイヤボンデイング装置。
  2. （２）軟質材はゴムよりなることを特徴とする実用新案
    登録請求の範囲第１項記載のワイヤボンデイング装置。
JP1984094957U 1984-06-25 1984-06-25 ワイヤボンデイング装置 Pending JPS6112235U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984094957U JPS6112235U (ja) 1984-06-25 1984-06-25 ワイヤボンデイング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984094957U JPS6112235U (ja) 1984-06-25 1984-06-25 ワイヤボンデイング装置

Publications (1)

Publication Number Publication Date
JPS6112235U true JPS6112235U (ja) 1986-01-24

Family

ID=30653846

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984094957U Pending JPS6112235U (ja) 1984-06-25 1984-06-25 ワイヤボンデイング装置

Country Status (1)

Country Link
JP (1) JPS6112235U (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08206007A (ja) * 1994-10-25 1996-08-13 West Bend Co:The 複数の混練部材を備えた自動パン製造装置
JPH08206008A (ja) * 1994-10-25 1996-08-13 West Bend Co:The 幅広パン用受皿を備えた自動パン製造装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5326667A (en) * 1976-08-25 1978-03-11 Hitachi Ltd Clamp chip of wire bonder
JPS5958834A (ja) * 1982-09-28 1984-04-04 Shinkawa Ltd ワイヤボンダ−用クランパ

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5326667A (en) * 1976-08-25 1978-03-11 Hitachi Ltd Clamp chip of wire bonder
JPS5958834A (ja) * 1982-09-28 1984-04-04 Shinkawa Ltd ワイヤボンダ−用クランパ

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08206007A (ja) * 1994-10-25 1996-08-13 West Bend Co:The 複数の混練部材を備えた自動パン製造装置
JPH08206008A (ja) * 1994-10-25 1996-08-13 West Bend Co:The 幅広パン用受皿を備えた自動パン製造装置

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