JPS58134454A - リ−ドボンデイング構造 - Google Patents

リ−ドボンデイング構造

Info

Publication number
JPS58134454A
JPS58134454A JP1775182A JP1775182A JPS58134454A JP S58134454 A JPS58134454 A JP S58134454A JP 1775182 A JP1775182 A JP 1775182A JP 1775182 A JP1775182 A JP 1775182A JP S58134454 A JPS58134454 A JP S58134454A
Authority
JP
Japan
Prior art keywords
leads
bent
lead
bonding
group
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1775182A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6364916B2 (enrdf_load_html_response
Inventor
Keiji Yamamura
山村　圭司
Yuichi Yoshida
裕一 吉田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP1775182A priority Critical patent/JPS58134454A/ja
Publication of JPS58134454A publication Critical patent/JPS58134454A/ja
Publication of JPS6364916B2 publication Critical patent/JPS6364916B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Wire Bonding (AREA)
JP1775182A 1982-02-05 1982-02-05 リ−ドボンデイング構造 Granted JPS58134454A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1775182A JPS58134454A (ja) 1982-02-05 1982-02-05 リ−ドボンデイング構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1775182A JPS58134454A (ja) 1982-02-05 1982-02-05 リ−ドボンデイング構造

Publications (2)

Publication Number Publication Date
JPS58134454A true JPS58134454A (ja) 1983-08-10
JPS6364916B2 JPS6364916B2 (enrdf_load_html_response) 1988-12-14

Family

ID=11952437

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1775182A Granted JPS58134454A (ja) 1982-02-05 1982-02-05 リ−ドボンデイング構造

Country Status (1)

Country Link
JP (1) JPS58134454A (enrdf_load_html_response)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61210648A (ja) * 1985-03-15 1986-09-18 Matsushita Electric Ind Co Ltd デイスプレイパネルの実装体
JPS62238684A (ja) * 1986-04-10 1987-10-19 松下電器産業株式会社 リ−ド接続方法
JPS6313393A (ja) * 1986-07-04 1988-01-20 日本電気株式会社 電子部品の実装構造
JPH03119786A (ja) * 1989-09-30 1991-05-22 Toshiba Corp 半導体装置
EP0813237A1 (fr) * 1996-06-13 1997-12-17 Bull S.A. Procédé de montage d'un circuit intégré sur un support et support en résultant

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61210648A (ja) * 1985-03-15 1986-09-18 Matsushita Electric Ind Co Ltd デイスプレイパネルの実装体
JPS62238684A (ja) * 1986-04-10 1987-10-19 松下電器産業株式会社 リ−ド接続方法
JPS6313393A (ja) * 1986-07-04 1988-01-20 日本電気株式会社 電子部品の実装構造
JPH03119786A (ja) * 1989-09-30 1991-05-22 Toshiba Corp 半導体装置
EP0813237A1 (fr) * 1996-06-13 1997-12-17 Bull S.A. Procédé de montage d'un circuit intégré sur un support et support en résultant
WO1997048130A1 (fr) * 1996-06-13 1997-12-18 Bull S.A. Procede de montage d'un circuit integre sur un support et support en resultant
FR2749974A1 (fr) * 1996-06-13 1997-12-19 Bull Sa Procede de montage d'un circuit integre sur un support et support en resultant
US6305074B1 (en) 1996-06-13 2001-10-23 Bull, S.A. Support for integrated circuit and process for mounting an integrated circuit on a support

Also Published As

Publication number Publication date
JPS6364916B2 (enrdf_load_html_response) 1988-12-14

Similar Documents

Publication Publication Date Title
US6657124B2 (en) Advanced electronic package
US6405920B1 (en) Enhanced mounting pads for printed circuit boards
US6504104B2 (en) Flexible wiring for the transformation of a substrate with edge contacts into a ball grid array
JPH0368151A (ja) 第１の電子部品と第２の電子部品とをボンディングする方法
JPH1174301A (ja) 半田バンプ形状及びスタンドオフ高さを制御する方法
JPH04192596A (ja) 電子部品の表面実装構造
JPS58134454A (ja) リ−ドボンデイング構造
JPH08288658A (ja) Ｂｇａパッケージ搭載用印刷配線基板
JPH04314355A (ja) チップキャリア及びその半田付け方法
JP3830803B2 (ja) 電子回路ユニットの製造方法
US7064451B2 (en) Area array semiconductor device and electronic circuit board utilizing the same
JPH10313167A (ja) 配線基板
JP3410199B2 (ja) 接続部材の橋絡防止装置並びにこれを有する半導体集積回路及び実装基板
US6531664B1 (en) Surface mount devices with solder
JPS61102089A (ja) フラツトパツケ−ジｉｃの実装構造
JPS61242097A (ja) 電子部品の実装方法
JPS63126258A (ja) 半導体装置
JPH0758244A (ja) 半導体パッケージ及び半導体パッケージの製造方法
JPS6272473A (ja) はんだ付装置
JP2751897B2 (ja) ボールグリッドアレイ実装構造及び実装方法
JPH05347473A (ja) 配線基板
JPS6059743B2 (ja) 半導体集積回路装置
JPH05283587A (ja) 多リード素子の半田付方法
JPH08153824A (ja) ボール・グリッド・アレイ・パッケージ
JPH0252495A (ja) フラットパッケージｉｃの実装方法