JPS58126062A - 研摩装置 - Google Patents

研摩装置

Info

Publication number
JPS58126062A
JPS58126062A JP57006436A JP643682A JPS58126062A JP S58126062 A JPS58126062 A JP S58126062A JP 57006436 A JP57006436 A JP 57006436A JP 643682 A JP643682 A JP 643682A JP S58126062 A JPS58126062 A JP S58126062A
Authority
JP
Japan
Prior art keywords
workpiece
polishing
turntable
top plate
swinging arm
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57006436A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0232113B2 (enrdf_load_stackoverflow
Inventor
Yasuyuki Onomi
尾身 康行
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujikoshi Machinery Corp
Original Assignee
Fujikoshi Kikai Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujikoshi Kikai Kogyo KK filed Critical Fujikoshi Kikai Kogyo KK
Priority to JP57006436A priority Critical patent/JPS58126062A/ja
Publication of JPS58126062A publication Critical patent/JPS58126062A/ja
Publication of JPH0232113B2 publication Critical patent/JPH0232113B2/ja
Granted legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/34Accessories
    • B24B37/345Feeding, loading or unloading work specially adapted to lapping

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP57006436A 1982-01-19 1982-01-19 研摩装置 Granted JPS58126062A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57006436A JPS58126062A (ja) 1982-01-19 1982-01-19 研摩装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57006436A JPS58126062A (ja) 1982-01-19 1982-01-19 研摩装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP57033438A Division JPS58126063A (ja) 1982-03-03 1982-03-03 研摩機用ワ−クピ−ス・ロ−デイング装置

Publications (2)

Publication Number Publication Date
JPS58126062A true JPS58126062A (ja) 1983-07-27
JPH0232113B2 JPH0232113B2 (enrdf_load_stackoverflow) 1990-07-18

Family

ID=11638342

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57006436A Granted JPS58126062A (ja) 1982-01-19 1982-01-19 研摩装置

Country Status (1)

Country Link
JP (1) JPS58126062A (enrdf_load_stackoverflow)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5264996U (enrdf_load_stackoverflow) * 1975-11-10 1977-05-13
JPS5669071A (en) * 1979-09-12 1981-06-10 Mitsubishi Motors Corp Lapping machine

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5264996U (enrdf_load_stackoverflow) * 1975-11-10 1977-05-13
JPS5669071A (en) * 1979-09-12 1981-06-10 Mitsubishi Motors Corp Lapping machine

Also Published As

Publication number Publication date
JPH0232113B2 (enrdf_load_stackoverflow) 1990-07-18

Similar Documents

Publication Publication Date Title
US6159079A (en) Carrier head for chemical mechanical polishing a substrate
US4481741A (en) Polishing machines incorporating rotating plate
JP2716653B2 (ja) ウェーハの研磨装置および研磨方法
CN205325448U (zh) 一种自动打磨设备
CA2245498A1 (en) Lapping and polishing method and apparatus for planarizing photoresist and metal microstructure layers
KR20160141656A (ko) 처리 대상물을 보유 지지하기 위한 테이블 및 당해 테이블을 갖는 처리 장치
CN113501664A (zh) 一种玻璃深加工智能制造生产线
JPS62162466A (ja) ウエハ用ラツピング装置
JPH11104942A (ja) ワークエッジの研磨方法及び装置
JP2016016485A (ja) インゴットブロックの複合面取り加工装置および面取り加工方法
JPH09314457A (ja) ドレッサ付き片面研磨装置
JP2001138233A (ja) 研磨装置、研磨方法および研磨工具の洗浄方法
JPS58126062A (ja) 研摩装置
JP2006181659A (ja) レンズ自動研磨装置
US3721465A (en) Method and apparatus for holding gems
JP2539753B2 (ja) 半導体基板の鏡面研磨装置
JPS59227361A (ja) 平面研削装置
CN215317808U (zh) 一种智能抛光打磨装置
JPH065568A (ja) 半導体ウエハの全自動ポリッシング装置
JPH044099B2 (enrdf_load_stackoverflow)
JP4205263B2 (ja) 自動ラップ装置およびそれを用いる基板の研磨方法
JPH05123952A (ja) 半導体ウエーハの周縁ポリシング装置
CN222269792U (zh) 一种新型机器人力控自动打磨复合材料产品工艺装备
CN218363951U (zh) 一种具有固定机构的打磨抛光装置
JPH08267358A (ja) 半導体基板の同時鏡面研磨装置