JPS58122759A - 半導体装置 - Google Patents
半導体装置Info
- Publication number
- JPS58122759A JPS58122759A JP57004422A JP442282A JPS58122759A JP S58122759 A JPS58122759 A JP S58122759A JP 57004422 A JP57004422 A JP 57004422A JP 442282 A JP442282 A JP 442282A JP S58122759 A JPS58122759 A JP S58122759A
- Authority
- JP
- Japan
- Prior art keywords
- package
- cap
- ground terminal
- high frequency
- contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/66—High-frequency adaptations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Health & Medical Sciences (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57004422A JPS58122759A (ja) | 1982-01-14 | 1982-01-14 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57004422A JPS58122759A (ja) | 1982-01-14 | 1982-01-14 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58122759A true JPS58122759A (ja) | 1983-07-21 |
| JPH044753B2 JPH044753B2 (enExample) | 1992-01-29 |
Family
ID=11583827
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57004422A Granted JPS58122759A (ja) | 1982-01-14 | 1982-01-14 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58122759A (enExample) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60121653U (ja) * | 1984-01-27 | 1985-08-16 | 株式会社東芝 | 半導体装置の外囲器 |
| JPS60180852A (ja) * | 1984-02-28 | 1985-09-14 | Kyocera Corp | 熱印刷装置 |
| JPS60163751U (ja) * | 1984-04-04 | 1985-10-30 | スタンレー電気株式会社 | 半導体装置 |
| JPS61114564A (ja) * | 1984-11-09 | 1986-06-02 | Nec Corp | 静電破壊防止機構付きicパツケ−ジ |
| JPS61195067U (enExample) * | 1985-05-24 | 1986-12-04 | ||
| JPS6230356U (enExample) * | 1985-08-07 | 1987-02-24 | ||
| FR2774810A1 (fr) * | 1998-02-10 | 1999-08-13 | St Microelectronics Sa | Boitier semi-conducteur blinde et procede pour sa fabrication |
| US9070793B2 (en) | 2010-08-02 | 2015-06-30 | Advanced Semiconductor Engineering, Inc. | Semiconductor device packages having electromagnetic interference shielding and related methods |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4863657U (enExample) * | 1971-11-22 | 1973-08-13 | ||
| JPS51138165A (en) * | 1975-05-23 | 1976-11-29 | Mitsubishi Electric Corp | Package stracture for thermal resistance and shield |
-
1982
- 1982-01-14 JP JP57004422A patent/JPS58122759A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4863657U (enExample) * | 1971-11-22 | 1973-08-13 | ||
| JPS51138165A (en) * | 1975-05-23 | 1976-11-29 | Mitsubishi Electric Corp | Package stracture for thermal resistance and shield |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60121653U (ja) * | 1984-01-27 | 1985-08-16 | 株式会社東芝 | 半導体装置の外囲器 |
| JPS60180852A (ja) * | 1984-02-28 | 1985-09-14 | Kyocera Corp | 熱印刷装置 |
| JPS60163751U (ja) * | 1984-04-04 | 1985-10-30 | スタンレー電気株式会社 | 半導体装置 |
| JPS61114564A (ja) * | 1984-11-09 | 1986-06-02 | Nec Corp | 静電破壊防止機構付きicパツケ−ジ |
| JPS61195067U (enExample) * | 1985-05-24 | 1986-12-04 | ||
| JPS6230356U (enExample) * | 1985-08-07 | 1987-02-24 | ||
| FR2774810A1 (fr) * | 1998-02-10 | 1999-08-13 | St Microelectronics Sa | Boitier semi-conducteur blinde et procede pour sa fabrication |
| US6312975B1 (en) | 1998-02-10 | 2001-11-06 | Stmicroelectronics S.A. | Semiconductor package and method of manufacturing the same |
| US9070793B2 (en) | 2010-08-02 | 2015-06-30 | Advanced Semiconductor Engineering, Inc. | Semiconductor device packages having electromagnetic interference shielding and related methods |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH044753B2 (enExample) | 1992-01-29 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4871883A (en) | Electro-magnetic shielding | |
| US4829432A (en) | Apparatus for shielding an electrical circuit from electromagnetic interference | |
| US20030218873A1 (en) | Structure for fastening a component | |
| JPH10284867A (ja) | プリント回路板に装架するための2部品電磁放射遮蔽装置 | |
| US6166429A (en) | Lead-frame package with shield means between signal terminal electrodes | |
| JPS58122759A (ja) | 半導体装置 | |
| KR100297225B1 (ko) | 방사차폐안테나장치를가진휴대용통신장치 | |
| KR0175000B1 (ko) | 전자파 억제구조를 갖는 반도체 소자 | |
| FI72239C (fi) | Anordning foer undertryckande av radiofrekventa stoerningar. | |
| JPH08102607A (ja) | 無線機へのアンテナ要素装着 | |
| JPH09129316A (ja) | コネクタ及びコネクタ取り付け構造 | |
| JPH1140709A (ja) | 半導体実装構造およびその製造方法 | |
| JP2000114843A (ja) | 表面実装型アンテナおよびそれを用いたアンテナ装置およびそれを用いた通信機 | |
| JPH0822867A (ja) | 電子機構部品とケーブルの接続部の電磁シールド手段 | |
| JP3597326B2 (ja) | 高周波機器及びそれを用いた電子機器 | |
| JP2767998B2 (ja) | 電子部品のシールド構造 | |
| JPH0644679B2 (ja) | 高周波回路装置のシ−ルド構造 | |
| KR200162128Y1 (ko) | 모니터의 음극선관 전자파 차폐용 실드 | |
| JPH084744Y2 (ja) | 弾性表面波装置 | |
| JPH1174669A (ja) | 無線周波シールド電子回路基板 | |
| JPS607741A (ja) | 混成集積回路装置 | |
| JPH0117835Y2 (enExample) | ||
| JPH06163810A (ja) | ハイブリッドic面実装用リードブロック | |
| JPH10173468A (ja) | 弾性表面波装置 | |
| JPH0362595A (ja) | 電子装置のシールド構造 |