JPS58113366A - 無電解めつきのための基体表面を活性化する方法 - Google Patents
無電解めつきのための基体表面を活性化する方法Info
- Publication number
- JPS58113366A JPS58113366A JP57225100A JP22510082A JPS58113366A JP S58113366 A JPS58113366 A JP S58113366A JP 57225100 A JP57225100 A JP 57225100A JP 22510082 A JP22510082 A JP 22510082A JP S58113366 A JPS58113366 A JP S58113366A
- Authority
- JP
- Japan
- Prior art keywords
- compound
- minutes
- palladium
- nickel
- prepolymer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 28
- 239000000758 substrate Substances 0.000 title claims description 21
- 238000007772 electroless plating Methods 0.000 title claims description 10
- 230000003213 activating effect Effects 0.000 title claims description 6
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 36
- 238000007747 plating Methods 0.000 claims description 28
- 239000002904 solvent Substances 0.000 claims description 19
- 150000002902 organometallic compounds Chemical class 0.000 claims description 18
- 229910052763 palladium Inorganic materials 0.000 claims description 18
- 229920000642 polymer Polymers 0.000 claims description 17
- 150000001875 compounds Chemical class 0.000 claims description 12
- 230000009467 reduction Effects 0.000 claims description 9
- 150000002894 organic compounds Chemical class 0.000 claims description 5
- 230000004913 activation Effects 0.000 claims description 4
- 230000009471 action Effects 0.000 claims description 2
- 239000000010 aprotic solvent Substances 0.000 claims description 2
- 229920001577 copolymer Polymers 0.000 claims description 2
- 150000001993 dienes Chemical class 0.000 claims description 2
- 125000000524 functional group Chemical group 0.000 claims description 2
- 238000009736 wetting Methods 0.000 claims description 2
- 230000000379 polymerizing effect Effects 0.000 claims 1
- 229920006305 unsaturated polyester Polymers 0.000 claims 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 99
- 229910052759 nickel Inorganic materials 0.000 description 50
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 42
- 239000000243 solution Substances 0.000 description 33
- 239000010410 layer Substances 0.000 description 26
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 18
- 239000011888 foil Substances 0.000 description 13
- 239000005062 Polybutadiene Substances 0.000 description 12
- 239000011521 glass Substances 0.000 description 12
- 229920002857 polybutadiene Polymers 0.000 description 12
- 238000001035 drying Methods 0.000 description 11
- 239000000203 mixture Substances 0.000 description 11
- 239000000126 substance Substances 0.000 description 11
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 10
- 239000004816 latex Substances 0.000 description 10
- 229920000126 latex Polymers 0.000 description 10
- -1 polypropylene Polymers 0.000 description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 10
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 9
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 description 9
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 9
- 238000009713 electroplating Methods 0.000 description 9
- 239000003960 organic solvent Substances 0.000 description 9
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 description 9
- HIDYYJFXCDZTHJ-UHFFFAOYSA-L acetonitrile;dichloropalladium Chemical compound CC#N.Cl[Pd]Cl HIDYYJFXCDZTHJ-UHFFFAOYSA-L 0.000 description 8
- 238000000576 coating method Methods 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 239000011248 coating agent Substances 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 7
- 239000010949 copper Substances 0.000 description 7
- 229920000180 alkyd Polymers 0.000 description 6
- 239000003638 chemical reducing agent Substances 0.000 description 6
- 239000004922 lacquer Substances 0.000 description 6
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 5
- 229910000831 Steel Inorganic materials 0.000 description 5
- 238000007605 air drying Methods 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 229920000647 polyepoxide Polymers 0.000 description 5
- 238000006116 polymerization reaction Methods 0.000 description 5
- 239000010959 steel Substances 0.000 description 5
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- 239000004743 Polypropylene Substances 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 4
- 238000001704 evaporation Methods 0.000 description 4
- 230000008020 evaporation Effects 0.000 description 4
- 239000004744 fabric Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 229920001155 polypropylene Polymers 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical compound C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 3
- 150000008064 anhydrides Chemical class 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 238000007598 dipping method Methods 0.000 description 3
- 239000012153 distilled water Substances 0.000 description 3
- 238000007654 immersion Methods 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
- 239000003380 propellant Substances 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- KMOUUZVZFBCRAM-UHFFFAOYSA-N 1,2,3,6-tetrahydrophthalic anhydride Chemical compound C1C=CCC2C(=O)OC(=O)C21 KMOUUZVZFBCRAM-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
- 229920000742 Cotton Polymers 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- 230000002378 acidificating effect Effects 0.000 description 2
- 239000012190 activator Substances 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- HENYYBLMWDENHQ-UHFFFAOYSA-N benzonitrile palladium Chemical compound [Pd].N#CC1=CC=CC=C1 HENYYBLMWDENHQ-UHFFFAOYSA-N 0.000 description 2
- 230000002051 biphasic effect Effects 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- 230000003197 catalytic effect Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229930195733 hydrocarbon Natural products 0.000 description 2
- 150000002430 hydrocarbons Chemical class 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 229910021645 metal ion Inorganic materials 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 150000002815 nickel Chemical class 0.000 description 2
- 239000007800 oxidant agent Substances 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 239000002574 poison Substances 0.000 description 2
- 231100000614 poison Toxicity 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 150000003378 silver Chemical class 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 230000008961 swelling Effects 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 239000008096 xylene Substances 0.000 description 2
- NWZSZGALRFJKBT-KNIFDHDWSA-N (2s)-2,6-diaminohexanoic acid;(2s)-2-hydroxybutanedioic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O.NCCCC[C@H](N)C(O)=O NWZSZGALRFJKBT-KNIFDHDWSA-N 0.000 description 1
- RZVAJINKPMORJF-UHFFFAOYSA-N Acetaminophen Chemical compound CC(=O)NC1=CC=C(O)C=C1 RZVAJINKPMORJF-UHFFFAOYSA-N 0.000 description 1
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 1
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonium chloride Substances [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 1
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 241000555825 Clupeidae Species 0.000 description 1
- 241000276457 Gadidae Species 0.000 description 1
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- WTKZEGDFNFYCGP-UHFFFAOYSA-N Pyrazole Chemical compound C=1C=NNC=1 WTKZEGDFNFYCGP-UHFFFAOYSA-N 0.000 description 1
- DWAQJAXMDSEUJJ-UHFFFAOYSA-M Sodium bisulfite Chemical compound [Na+].OS([O-])=O DWAQJAXMDSEUJJ-UHFFFAOYSA-M 0.000 description 1
- 235000014570 Stauntonia hexaphylla Nutrition 0.000 description 1
- 240000001490 Stauntonia hexaphylla Species 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 241000949477 Toona ciliata Species 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000013543 active substance Substances 0.000 description 1
- TVJORGWKNPGCDW-UHFFFAOYSA-N aminoboron Chemical compound N[B] TVJORGWKNPGCDW-UHFFFAOYSA-N 0.000 description 1
- 235000011114 ammonium hydroxide Nutrition 0.000 description 1
- 239000008346 aqueous phase Substances 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- UORVGPXVDQYIDP-UHFFFAOYSA-N borane Chemical class B UORVGPXVDQYIDP-UHFFFAOYSA-N 0.000 description 1
- 229910000085 borane Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- JOPOVCBBYLSVDA-UHFFFAOYSA-N chromium(6+) Chemical compound [Cr+6] JOPOVCBBYLSVDA-UHFFFAOYSA-N 0.000 description 1
- GRWVQDDAKZFPFI-UHFFFAOYSA-H chromium(III) sulfate Chemical compound [Cr+3].[Cr+3].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O GRWVQDDAKZFPFI-UHFFFAOYSA-H 0.000 description 1
- 150000001868 cobalt Chemical class 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229920006037 cross link polymer Polymers 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000001784 detoxification Methods 0.000 description 1
- YPTUAQWMBNZZRN-UHFFFAOYSA-N dimethylaminoboron Chemical compound [B]N(C)C YPTUAQWMBNZZRN-UHFFFAOYSA-N 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 125000004185 ester group Chemical group 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000008098 formaldehyde solution Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 229920000578 graft copolymer Polymers 0.000 description 1
- 229920005669 high impact polystyrene Polymers 0.000 description 1
- 239000004797 high-impact polystyrene Substances 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- IKDUDTNKRLTJSI-UHFFFAOYSA-N hydrazine monohydrate Substances O.NN IKDUDTNKRLTJSI-UHFFFAOYSA-N 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 159000000014 iron salts Chemical class 0.000 description 1
- 239000003446 ligand Substances 0.000 description 1
- 239000002932 luster Substances 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 239000002905 metal composite material Substances 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 1
- 150000002825 nitriles Chemical class 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 150000002940 palladium Chemical class 0.000 description 1
- 150000002941 palladium compounds Chemical class 0.000 description 1
- 239000000123 paper Substances 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 239000002798 polar solvent Substances 0.000 description 1
- 229920002239 polyacrylonitrile Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920001195 polyisoprene Polymers 0.000 description 1
- 229920002959 polymer blend Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000003586 protic polar solvent Substances 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 239000011541 reaction mixture Substances 0.000 description 1
- 239000012266 salt solution Substances 0.000 description 1
- 235000019512 sardine Nutrition 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 150000003384 small molecules Chemical class 0.000 description 1
- 235000010267 sodium hydrogen sulphite Nutrition 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- CVNKFOIOZXAFBO-UHFFFAOYSA-J tin(4+);tetrahydroxide Chemical compound [OH-].[OH-].[OH-].[OH-].[Sn+4] CVNKFOIOZXAFBO-UHFFFAOYSA-J 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 150000003626 triacylglycerols Chemical class 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- 229910000634 wood's metal Inorganic materials 0.000 description 1
- 210000002268 wool Anatomy 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Coating Of Shaped Articles Made Of Macromolecular Substances (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE31509851 | 1981-12-23 | ||
| DE19813150985 DE3150985A1 (de) | 1981-12-23 | 1981-12-23 | Verfahren zur aktivierung von substratoberflaechen fuer die stromlose metallisierung |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58113366A true JPS58113366A (ja) | 1983-07-06 |
| JPH026834B2 JPH026834B2 (enExample) | 1990-02-14 |
Family
ID=6149500
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57225100A Granted JPS58113366A (ja) | 1981-12-23 | 1982-12-23 | 無電解めつきのための基体表面を活性化する方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (2) | US4493861A (enExample) |
| EP (1) | EP0082438B1 (enExample) |
| JP (1) | JPS58113366A (enExample) |
| DE (2) | DE3150985A1 (enExample) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60175549A (ja) * | 1983-09-28 | 1985-09-09 | ロ−ム アンド ハ−ス カンパニ− | 触媒方法および触媒系 |
| JPS6115984A (ja) * | 1984-06-29 | 1986-01-24 | バイエル・アクチエンゲゼルシヤフト | 無電解メタライズのための基質表面の活性化方法 |
| JPS62149884A (ja) * | 1985-12-24 | 1987-07-03 | Nippon Mining Co Ltd | 無電解銅めつきの前処理方法 |
| JPS63209174A (ja) * | 1987-02-26 | 1988-08-30 | Toshiba Corp | 絶縁ゲ−ト型サイリスタ |
| JPH01104782A (ja) * | 1987-07-02 | 1989-04-21 | Fuji Photo Film Co Ltd | 無電解メッキ用触媒材料およびそれを用いた金属化材料 |
Families Citing this family (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3242162A1 (de) * | 1982-11-13 | 1984-05-17 | Bayer Ag, 5090 Leverkusen | Verfahren zur herstellung von verbundwerkstoffen |
| DE3248778A1 (de) * | 1982-12-31 | 1984-07-12 | Bayer Ag, 5090 Leverkusen | Verfahren zur herstellung metallisierter poroeser festkoerper |
| US4719145A (en) * | 1983-09-28 | 1988-01-12 | Rohm And Haas Company | Catalytic process and systems |
| DE3339857A1 (de) * | 1983-11-04 | 1985-05-15 | Bayer Ag, 5090 Leverkusen | Verfahren zur vorbehandlung von polyamidsubstraten fuer die stromlose metallisierung |
| DE3339856A1 (de) * | 1983-11-04 | 1985-05-15 | Bayer Ag, 5090 Leverkusen | Verfahren zur haftaktivierung von polyamidsubstraten fuer die stromlose metallisierung |
| DE3407114A1 (de) * | 1984-02-28 | 1985-09-05 | Bayer Ag, 5090 Leverkusen | Verfahren zur herstellung von leiterplatten |
| DE3419755A1 (de) * | 1984-05-26 | 1985-11-28 | Bayer Ag, 5090 Leverkusen | Chemisches versilberungsbad |
| JPH0694592B2 (ja) * | 1986-04-22 | 1994-11-24 | 日産化学工業株式会社 | 無電解メッキ法 |
| US4701351A (en) * | 1986-06-16 | 1987-10-20 | International Business Machines Corporation | Seeding process for electroless metal deposition |
| US5182135A (en) * | 1986-08-12 | 1993-01-26 | Bayer Aktiengesellschaft | Process for improving the adherency of metallic coatings deposited without current on plastic surfaces |
| US5075037A (en) * | 1986-11-07 | 1991-12-24 | Monsanto Company | Selective catalytic activation of polymeric films |
| US4910072A (en) * | 1986-11-07 | 1990-03-20 | Monsanto Company | Selective catalytic activation of polymeric films |
| DE3743780A1 (de) * | 1987-12-23 | 1989-07-06 | Bayer Ag | Verfahren zur verbesserung der haftfestigkeit von stromlos abgeschiedenen metallschichten auf polyimidoberflaechen |
| US5030742A (en) * | 1988-12-16 | 1991-07-09 | Ciba-Geigy Corporation | Ultrathin layers of palladium(O) complexes |
| DE3938710A1 (de) * | 1989-11-17 | 1991-05-23 | Schering Ag | Komplexverbindungen mit oligomerem bis polymerem charakter |
| US5227223A (en) * | 1989-12-21 | 1993-07-13 | Monsanto Company | Fabricating metal articles from printed images |
| US5279899A (en) * | 1992-03-17 | 1994-01-18 | Monsanto Company | Sulfonated polyamides |
| US5517338A (en) * | 1992-10-20 | 1996-05-14 | Monsanto Company | Composite mirrors |
| US5419954A (en) * | 1993-02-04 | 1995-05-30 | The Alpha Corporation | Composition including a catalytic metal-polymer complex and a method of manufacturing a laminate preform or a laminate which is catalytically effective for subsequent electroless metallization thereof |
| DE4319759A1 (de) * | 1993-06-15 | 1994-12-22 | Bayer Ag | Pulvermischungen zum Metallisieren von Substratoberflächen |
| DE19941043B4 (de) * | 1999-08-28 | 2004-04-29 | Robert Bosch Gmbh | Bekeimungsbad und Verfahren zur Bekeimung von pulverförmigen Werkstoffen, Verfahren zur Metallisierung eines bekeimten pulverförmigen Werkstoffs und Verfahren zur Herstellung metallisch begrenzter Hohlkörper |
| US20040031404A1 (en) * | 2002-08-19 | 2004-02-19 | John Dixon | Seamless embossing shim |
| US8465469B2 (en) * | 2002-09-12 | 2013-06-18 | Medtronic Vascular, Inc. | Reinforced catheter and methods of making |
| CN1329554C (zh) * | 2004-01-13 | 2007-08-01 | 长沙力元新材料股份有限公司 | 非金属基材表面化学镀覆金属的方法及其采用的前处理体系 |
| WO2008050715A1 (fr) * | 2006-10-23 | 2008-05-02 | Fujifilm Corporation | Matériau revêtu d'une pellicule métallique, et procédé pour sa fabrication, matériau portant un motif métallique et procédé pour sa fabrication, composition pour la formation d'une couche polymère, polymère de nitrile et procédé pour synthétiser ce |
| KR101385086B1 (ko) * | 2010-05-04 | 2014-04-14 | 유니-픽셀 디스플레이스, 인코포레이티드 | 전기 전도성 패턴을 가진 미세 구조 표면을 제조하는 방법 |
| US8591636B2 (en) | 2010-12-14 | 2013-11-26 | Rohm And Haas Electronics Materials Llc | Plating catalyst and method |
| US8591637B2 (en) * | 2010-12-14 | 2013-11-26 | Rohm And Haas Electronic Materials Llc | Plating catalyst and method |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4842928A (enExample) * | 1971-09-30 | 1973-06-21 |
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| FR1553822A (enExample) * | 1965-08-13 | 1969-01-17 | ||
| FR1543792A (fr) * | 1966-12-29 | 1900-01-01 | Ibm | Métallisation de matières plastiques |
| US3560257A (en) * | 1967-01-03 | 1971-02-02 | Kollmorgen Photocircuits | Metallization of insulating substrates |
| US3488166A (en) * | 1967-01-13 | 1970-01-06 | Ibm | Method for activating plastics,subsequent metallization and article of manufacture resulting therefrom |
| US3501332A (en) * | 1967-04-28 | 1970-03-17 | Shell Oil Co | Metal plating of plastics |
| US3956041A (en) * | 1972-07-11 | 1976-05-11 | Kollmorgen Corporation | Transfer coating process for manufacture of printing circuits |
| US3998602A (en) * | 1975-02-07 | 1976-12-21 | Carl Horowitz | Metal plating of polymeric substrates |
| DE2727245C3 (de) * | 1977-06-16 | 1980-06-26 | Brintzinger, Hans, Prof. Dr., 7750 Konstanz | Polymergebundene CyclopentadienylÜbergangsmetall-Verbindungen und ihre Ligand-Substitutions-Derivate, Verfahren zu ihrer Herstellung und ihre Verwendung als Katalysatoren |
| DE3025307A1 (de) * | 1980-07-04 | 1982-01-28 | Bayer Ag, 5090 Leverkusen | Verfahren zur aktivierung von oberflaechen fuer die stromlose metallisierung |
| DE3148280A1 (de) * | 1981-12-05 | 1983-06-09 | Bayer Ag, 5090 Leverkusen | Verfahren zur aktivierung von substratoberflaechen fuer die stromlose metallisierung |
-
1981
- 1981-12-23 DE DE19813150985 patent/DE3150985A1/de not_active Withdrawn
-
1982
- 1982-12-10 DE DE8282111461T patent/DE3266873D1/de not_active Expired
- 1982-12-10 EP EP82111461A patent/EP0082438B1/de not_active Expired
- 1982-12-13 US US06/449,043 patent/US4493861A/en not_active Expired - Fee Related
- 1982-12-23 JP JP57225100A patent/JPS58113366A/ja active Granted
-
1984
- 1984-10-25 US US06/664,668 patent/US4622411A/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4842928A (enExample) * | 1971-09-30 | 1973-06-21 |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60175549A (ja) * | 1983-09-28 | 1985-09-09 | ロ−ム アンド ハ−ス カンパニ− | 触媒方法および触媒系 |
| JPS6115984A (ja) * | 1984-06-29 | 1986-01-24 | バイエル・アクチエンゲゼルシヤフト | 無電解メタライズのための基質表面の活性化方法 |
| JPS62149884A (ja) * | 1985-12-24 | 1987-07-03 | Nippon Mining Co Ltd | 無電解銅めつきの前処理方法 |
| JPS63209174A (ja) * | 1987-02-26 | 1988-08-30 | Toshiba Corp | 絶縁ゲ−ト型サイリスタ |
| JPH01104782A (ja) * | 1987-07-02 | 1989-04-21 | Fuji Photo Film Co Ltd | 無電解メッキ用触媒材料およびそれを用いた金属化材料 |
Also Published As
| Publication number | Publication date |
|---|---|
| DE3150985A1 (de) | 1983-06-30 |
| EP0082438A1 (de) | 1983-06-29 |
| EP0082438B1 (de) | 1985-10-09 |
| JPH026834B2 (enExample) | 1990-02-14 |
| DE3266873D1 (en) | 1985-11-14 |
| US4493861A (en) | 1985-01-15 |
| US4622411A (en) | 1986-11-11 |
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