JPS58102542A - バンプ電極の製造方法 - Google Patents
バンプ電極の製造方法Info
- Publication number
- JPS58102542A JPS58102542A JP56201845A JP20184581A JPS58102542A JP S58102542 A JPS58102542 A JP S58102542A JP 56201845 A JP56201845 A JP 56201845A JP 20184581 A JP20184581 A JP 20184581A JP S58102542 A JPS58102542 A JP S58102542A
- Authority
- JP
- Japan
- Prior art keywords
- bump
- forming
- layer
- forming region
- photoresist
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10W72/012—
-
- H10W72/01255—
-
- H10W72/234—
-
- H10W72/251—
Landscapes
- Electroplating Methods And Accessories (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56201845A JPS58102542A (ja) | 1981-12-15 | 1981-12-15 | バンプ電極の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56201845A JPS58102542A (ja) | 1981-12-15 | 1981-12-15 | バンプ電極の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58102542A true JPS58102542A (ja) | 1983-06-18 |
| JPS628943B2 JPS628943B2 (cg-RX-API-DMAC10.html) | 1987-02-25 |
Family
ID=16447837
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56201845A Granted JPS58102542A (ja) | 1981-12-15 | 1981-12-15 | バンプ電極の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58102542A (cg-RX-API-DMAC10.html) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60158647A (ja) * | 1984-01-28 | 1985-08-20 | Rohm Co Ltd | 半導体素子の製造方法 |
| JPS6442842A (en) * | 1987-08-10 | 1989-02-15 | Nec Corp | Manufacture of semiconductor device |
| US5310699A (en) * | 1984-08-28 | 1994-05-10 | Sharp Kabushiki Kaisha | Method of manufacturing a bump electrode |
| FR2707797A1 (fr) * | 1993-07-15 | 1995-01-20 | Samsung Electronics Co Ltd | Procédé de fabrication de bosses pour puces. |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0432949U (cg-RX-API-DMAC10.html) * | 1990-07-11 | 1992-03-17 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52155051A (en) * | 1976-06-18 | 1977-12-23 | Matsushita Electric Ind Co Ltd | Production of semiconductor device |
-
1981
- 1981-12-15 JP JP56201845A patent/JPS58102542A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52155051A (en) * | 1976-06-18 | 1977-12-23 | Matsushita Electric Ind Co Ltd | Production of semiconductor device |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60158647A (ja) * | 1984-01-28 | 1985-08-20 | Rohm Co Ltd | 半導体素子の製造方法 |
| US5310699A (en) * | 1984-08-28 | 1994-05-10 | Sharp Kabushiki Kaisha | Method of manufacturing a bump electrode |
| JPS6442842A (en) * | 1987-08-10 | 1989-02-15 | Nec Corp | Manufacture of semiconductor device |
| FR2707797A1 (fr) * | 1993-07-15 | 1995-01-20 | Samsung Electronics Co Ltd | Procédé de fabrication de bosses pour puces. |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS628943B2 (cg-RX-API-DMAC10.html) | 1987-02-25 |
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