JPS579872A - Evaporation source for sputtering - Google Patents

Evaporation source for sputtering

Info

Publication number
JPS579872A
JPS579872A JP8209780A JP8209780A JPS579872A JP S579872 A JPS579872 A JP S579872A JP 8209780 A JP8209780 A JP 8209780A JP 8209780 A JP8209780 A JP 8209780A JP S579872 A JPS579872 A JP S579872A
Authority
JP
Japan
Prior art keywords
shield
target
sputtered
sputtering
evaporation source
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8209780A
Other languages
Japanese (ja)
Other versions
JPS5842270B2 (en
Inventor
Kazuo Yamaguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oki Electric Industry Co Ltd
Original Assignee
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Industry Co Ltd filed Critical Oki Electric Industry Co Ltd
Priority to JP8209780A priority Critical patent/JPS5842270B2/en
Publication of JPS579872A publication Critical patent/JPS579872A/en
Publication of JPS5842270B2 publication Critical patent/JPS5842270B2/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Electrodes Of Semiconductors (AREA)

Abstract

PURPOSE:To stably deposit and form a hardly protruded metallic film of high quality with high reproducibility by forming the cross section of the shield of a substance to be sputtered into a triangular shape. CONSTITUTION:The cross section of the shield 23 of a substance to be sputtered in the vicinity of a target 22 is formed into a triangular shape, and the shield 23 is attached on a target supporting table 21 while facing the oblique face 24 toward the target 22 so that the target material is chiefly deposited on the face 24. The shield 23 is made of metal with high heat conductivity such as Cu or Al. Using this evaporation source for sputtering a high purity sputtered film free from impurities is formed on a substrate. This source can be utilized in a process of wiring electrodes for a semiconductor integrated circuit.
JP8209780A 1980-06-19 1980-06-19 Spatuta evaporation source Expired JPS5842270B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8209780A JPS5842270B2 (en) 1980-06-19 1980-06-19 Spatuta evaporation source

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8209780A JPS5842270B2 (en) 1980-06-19 1980-06-19 Spatuta evaporation source

Publications (2)

Publication Number Publication Date
JPS579872A true JPS579872A (en) 1982-01-19
JPS5842270B2 JPS5842270B2 (en) 1983-09-19

Family

ID=13764911

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8209780A Expired JPS5842270B2 (en) 1980-06-19 1980-06-19 Spatuta evaporation source

Country Status (1)

Country Link
JP (1) JPS5842270B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60140761U (en) * 1984-02-29 1985-09-18 ホ−ヤ株式会社 Magnetron sputtering equipment
JPS62114058U (en) * 1986-01-09 1987-07-20

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60140761U (en) * 1984-02-29 1985-09-18 ホ−ヤ株式会社 Magnetron sputtering equipment
JPH0342035Y2 (en) * 1984-02-29 1991-09-03
JPS62114058U (en) * 1986-01-09 1987-07-20

Also Published As

Publication number Publication date
JPS5842270B2 (en) 1983-09-19

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