JPS62114058U - - Google Patents

Info

Publication number
JPS62114058U
JPS62114058U JP186686U JP186686U JPS62114058U JP S62114058 U JPS62114058 U JP S62114058U JP 186686 U JP186686 U JP 186686U JP 186686 U JP186686 U JP 186686U JP S62114058 U JPS62114058 U JP S62114058U
Authority
JP
Japan
Prior art keywords
target
sputtering apparatus
shield plate
plasma
holds
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP186686U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP186686U priority Critical patent/JPS62114058U/ja
Publication of JPS62114058U publication Critical patent/JPS62114058U/ja
Pending legal-status Critical Current

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Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の一実施例を示すスパツタリン
グ装置の一部断面図である。第２図は第１図の要
部を拡大した断面図である。第３図は本考案の変
形実施例を示すスパツタリング装置の一部断面図
である。第４図は従来例を示すスパツタリング装
置の一部断面図である。 １…ターゲツト、１ａ…ターゲツト周縁部、２
…ホルダ、３…ターゲツト抑え、４…ターゲツト
シールド板、４ａ…屈曲部、５…開口部。 FIG. 1 is a partial sectional view of a sputtering apparatus showing an embodiment of the present invention. FIG. 2 is an enlarged sectional view of the main part of FIG. 1. FIG. 3 is a partial sectional view of a sputtering apparatus showing a modified embodiment of the present invention. FIG. 4 is a partial sectional view of a conventional sputtering apparatus. 1...Target, 1a...Target periphery, 2
...Holder, 3...Target holding, 4...Target shield plate, 4a...Bending portion, 5...Opening.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ターゲツトの周縁部を抑えるターゲツト抑えを
プラズマから遮断するターゲツトシールド板の内
周端に、前記ターゲツトに向かう屈曲部を延設し
たことを特徴とするスパツタリング装置。 1. A sputtering apparatus characterized in that a bent portion extending toward the target is provided at an inner peripheral end of a target shield plate that blocks a target holder that holds a peripheral edge of a target from plasma.
JP186686U 1986-01-09 1986-01-09 Pending JPS62114058U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP186686U JPS62114058U (en) 1986-01-09 1986-01-09

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP186686U JPS62114058U (en) 1986-01-09 1986-01-09

Publications (1)

Publication Number Publication Date
JPS62114058U true JPS62114058U (en) 1987-07-20

Family

ID=30780172

Family Applications (1)

Application Number Title Priority Date Filing Date
JP186686U Pending JPS62114058U (en) 1986-01-09 1986-01-09

Country Status (1)

Country Link
JP (1) JPS62114058U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010116605A (en) * 2008-11-13 2010-05-27 Fujikura Ltd Target-holding device, and film-forming apparatus and film-forming method using the same
WO2014132308A1 (en) * 2013-02-28 2014-09-04 キヤノンアネルバ株式会社 Sputtering device
JP2016003388A (en) * 2014-06-19 2016-01-12 東京エレクトロン株式会社 Fixing mechanism for plate-like member, pvd processing device, and fixing method for plate-like member

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS579872A (en) * 1980-06-19 1982-01-19 Oki Electric Ind Co Ltd Evaporation source for sputtering

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS579872A (en) * 1980-06-19 1982-01-19 Oki Electric Ind Co Ltd Evaporation source for sputtering

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010116605A (en) * 2008-11-13 2010-05-27 Fujikura Ltd Target-holding device, and film-forming apparatus and film-forming method using the same
WO2014132308A1 (en) * 2013-02-28 2014-09-04 キヤノンアネルバ株式会社 Sputtering device
US9368331B2 (en) 2013-02-28 2016-06-14 Canon Anelva Corporation Sputtering apparatus
JP5934427B2 (en) * 2013-02-28 2016-06-15 キヤノンアネルバ株式会社 Sputtering equipment
JP2016003388A (en) * 2014-06-19 2016-01-12 東京エレクトロン株式会社 Fixing mechanism for plate-like member, pvd processing device, and fixing method for plate-like member

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