JPS579867A - Electroless copper plating solution - Google Patents
Electroless copper plating solutionInfo
- Publication number
- JPS579867A JPS579867A JP8291580A JP8291580A JPS579867A JP S579867 A JPS579867 A JP S579867A JP 8291580 A JP8291580 A JP 8291580A JP 8291580 A JP8291580 A JP 8291580A JP S579867 A JPS579867 A JP S579867A
- Authority
- JP
- Japan
- Prior art keywords
- ion complexing
- electroless copper
- kinds
- copper plating
- plating soln
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007747 plating Methods 0.000 title abstract 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title abstract 3
- 229910052802 copper Inorganic materials 0.000 title abstract 3
- 239000010949 copper Substances 0.000 title abstract 3
- 239000008139 complexing agent Substances 0.000 abstract 4
- VMQMZMRVKUZKQL-UHFFFAOYSA-N Cu+ Chemical compound [Cu+] VMQMZMRVKUZKQL-UHFFFAOYSA-N 0.000 abstract 2
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 abstract 2
- 239000003381 stabilizer Substances 0.000 abstract 2
- 150000001412 amines Chemical class 0.000 abstract 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 abstract 1
- 239000003638 chemical reducing agent Substances 0.000 abstract 1
- 150000001879 copper Chemical class 0.000 abstract 1
- 230000008021 deposition Effects 0.000 abstract 1
- 230000002708 enhancing effect Effects 0.000 abstract 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 abstract 1
- 238000002156 mixing Methods 0.000 abstract 1
- 239000004094 surface-active agent Substances 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 1
Landscapes
- Chemically Coating (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8291580A JPS579867A (en) | 1980-06-20 | 1980-06-20 | Electroless copper plating solution |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8291580A JPS579867A (en) | 1980-06-20 | 1980-06-20 | Electroless copper plating solution |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS579867A true JPS579867A (en) | 1982-01-19 |
| JPS6259181B2 JPS6259181B2 (enrdf_load_stackoverflow) | 1987-12-09 |
Family
ID=13787540
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8291580A Granted JPS579867A (en) | 1980-06-20 | 1980-06-20 | Electroless copper plating solution |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS579867A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5059243A (en) * | 1989-04-28 | 1991-10-22 | International Business Machines Corporation | Tetra aza ligand systems as complexing agents for electroless deposition of copper |
-
1980
- 1980-06-20 JP JP8291580A patent/JPS579867A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5059243A (en) * | 1989-04-28 | 1991-10-22 | International Business Machines Corporation | Tetra aza ligand systems as complexing agents for electroless deposition of copper |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6259181B2 (enrdf_load_stackoverflow) | 1987-12-09 |
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