JPS5798676A - Etching agent for electroless nickel thin film - Google Patents

Etching agent for electroless nickel thin film

Info

Publication number
JPS5798676A
JPS5798676A JP16140180A JP16140180A JPS5798676A JP S5798676 A JPS5798676 A JP S5798676A JP 16140180 A JP16140180 A JP 16140180A JP 16140180 A JP16140180 A JP 16140180A JP S5798676 A JPS5798676 A JP S5798676A
Authority
JP
Japan
Prior art keywords
etching agent
thin film
acid
electroless
soln
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16140180A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6211070B2 (enrdf_load_stackoverflow
Inventor
Mitsuo Takano
Makoto Kusakabe
Eiji Usu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Nippon Peroxide Co Ltd
Original Assignee
Toshiba Corp
Nippon Peroxide Co Ltd
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Nippon Peroxide Co Ltd, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP16140180A priority Critical patent/JPS5798676A/ja
Publication of JPS5798676A publication Critical patent/JPS5798676A/ja
Publication of JPS6211070B2 publication Critical patent/JPS6211070B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/28—Acidic compositions for etching iron group metals
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/44—Compositions for etching metallic material from a metallic material substrate of different composition
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/067—Etchants

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • ing And Chemical Polishing (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
JP16140180A 1980-11-18 1980-11-18 Etching agent for electroless nickel thin film Granted JPS5798676A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16140180A JPS5798676A (en) 1980-11-18 1980-11-18 Etching agent for electroless nickel thin film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16140180A JPS5798676A (en) 1980-11-18 1980-11-18 Etching agent for electroless nickel thin film

Publications (2)

Publication Number Publication Date
JPS5798676A true JPS5798676A (en) 1982-06-18
JPS6211070B2 JPS6211070B2 (enrdf_load_stackoverflow) 1987-03-10

Family

ID=15734384

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16140180A Granted JPS5798676A (en) 1980-11-18 1980-11-18 Etching agent for electroless nickel thin film

Country Status (1)

Country Link
JP (1) JPS5798676A (enrdf_load_stackoverflow)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58123878A (ja) * 1982-01-11 1983-07-23 エンソ−ン・インコ−ポレ−テツド 剥離材
US4554049A (en) * 1984-06-07 1985-11-19 Enthone, Incorporated Selective nickel stripping compositions and method of stripping
US7504719B2 (en) 1998-09-28 2009-03-17 Ibiden Co., Ltd. Printed wiring board having a roughened surface formed on a metal layer, and method for producing the same
JP2012144791A (ja) * 2011-01-13 2012-08-02 National Institute Of Advanced Industrial Science & Technology 無電解ニッケル合金膜のパターニング方法
CN103952561A (zh) * 2014-04-24 2014-07-30 上海第二工业大学 一种用于浸取电子废弃物中金的浸金溶液及方法
EP2021519A4 (en) * 2006-05-03 2016-11-09 Omg Electronic Chemicals Inc PROCESS AND COMPOSITION FOR SELECTIVE CUTTING OF NICKEL FROM SUBSTRATE

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5120972A (ja) * 1974-08-14 1976-02-19 Canon Kk Mutsugimekanjotai
JPS5323244A (en) * 1976-08-16 1978-03-03 Hitachi Ltd Information processing unit
JPS5419381A (en) * 1977-07-14 1979-02-14 Toshiba Corp Semiconductor device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5120972A (ja) * 1974-08-14 1976-02-19 Canon Kk Mutsugimekanjotai
JPS5323244A (en) * 1976-08-16 1978-03-03 Hitachi Ltd Information processing unit
JPS5419381A (en) * 1977-07-14 1979-02-14 Toshiba Corp Semiconductor device

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58123878A (ja) * 1982-01-11 1983-07-23 エンソ−ン・インコ−ポレ−テツド 剥離材
US4554049A (en) * 1984-06-07 1985-11-19 Enthone, Incorporated Selective nickel stripping compositions and method of stripping
WO1986000086A1 (en) * 1984-06-07 1986-01-03 Enthone, Incorporated Selective nickel stripping compositions and method of stripping
AU570325B2 (en) * 1984-06-07 1988-03-10 Enthone, Incorporated Selective nickel stripping compositions and method of stripping
US8018045B2 (en) 1998-09-28 2011-09-13 Ibiden Co., Ltd. Printed circuit board
US7535095B1 (en) 1998-09-28 2009-05-19 Ibiden Co., Ltd. Printed wiring board and method for producing the same
US7994433B2 (en) 1998-09-28 2011-08-09 Ibiden Co., Ltd. Printed wiring board and method for producing the same
US8006377B2 (en) 1998-09-28 2011-08-30 Ibiden Co., Ltd. Method for producing a printed wiring board
US7504719B2 (en) 1998-09-28 2009-03-17 Ibiden Co., Ltd. Printed wiring board having a roughened surface formed on a metal layer, and method for producing the same
US8020291B2 (en) 1998-09-28 2011-09-20 Ibiden Co., Ltd. Method of manufacturing a printed wiring board
US8030577B2 (en) 1998-09-28 2011-10-04 Ibiden Co., Ltd. Printed wiring board and method for producing the same
US8093507B2 (en) 1998-09-28 2012-01-10 Ibiden Co., Ltd. Printed wiring board and method for producing the same
US8533943B2 (en) 1998-09-28 2013-09-17 Ibiden Co., Ltd. Printed wiring board and method for producing the same
EP2021519A4 (en) * 2006-05-03 2016-11-09 Omg Electronic Chemicals Inc PROCESS AND COMPOSITION FOR SELECTIVE CUTTING OF NICKEL FROM SUBSTRATE
JP2012144791A (ja) * 2011-01-13 2012-08-02 National Institute Of Advanced Industrial Science & Technology 無電解ニッケル合金膜のパターニング方法
CN103952561A (zh) * 2014-04-24 2014-07-30 上海第二工业大学 一种用于浸取电子废弃物中金的浸金溶液及方法

Also Published As

Publication number Publication date
JPS6211070B2 (enrdf_load_stackoverflow) 1987-03-10

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