JPS5779618A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS5779618A
JPS5779618A JP15467480A JP15467480A JPS5779618A JP S5779618 A JPS5779618 A JP S5779618A JP 15467480 A JP15467480 A JP 15467480A JP 15467480 A JP15467480 A JP 15467480A JP S5779618 A JPS5779618 A JP S5779618A
Authority
JP
Japan
Prior art keywords
glass
wafer
nickel
electrode
resist ink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15467480A
Other languages
Japanese (ja)
Inventor
Yutaka Misawa
Katsuhiko Shioda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP15467480A priority Critical patent/JPS5779618A/en
Publication of JPS5779618A publication Critical patent/JPS5779618A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electrodes Of Semiconductors (AREA)

Abstract

PURPOSE:To prevent a glass from being corroded during a plating process, by a method wherein, in case an electrode is formed by a plating method on a semiconductor device with a recess having an exposed junction and being coated with glass, the glass is previously protected with a medicine resistant ink. CONSTITUTION:A wafer 1, wherein a recess is covered with a glass 2, is prepared, and a medicine-resistant resist ink 4 is screen-printed on a region, except a part where an electrode is formed, of the wafer 1. An oxidized film 3 is etched with a mixture liquid of hydrofluoric acid and ammonium fluoride through the mask of the resist ink 4. The wafer 1, continuously, is placed in a nickel plated liquid in pH8 and at 80 deg.C, consisting of nickel sulphite hydrophosphorous acid soda, sodium citrate, and ammonium chloride, to form a nickel-plated layer 5. Finally, the resist ink 4 is removed to complete an electrode forming process. This enables the mass production of plated electrodes without the damage of the glass.
JP15467480A 1980-11-05 1980-11-05 Manufacture of semiconductor device Pending JPS5779618A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15467480A JPS5779618A (en) 1980-11-05 1980-11-05 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15467480A JPS5779618A (en) 1980-11-05 1980-11-05 Manufacture of semiconductor device

Publications (1)

Publication Number Publication Date
JPS5779618A true JPS5779618A (en) 1982-05-18

Family

ID=15589418

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15467480A Pending JPS5779618A (en) 1980-11-05 1980-11-05 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5779618A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009021713A1 (en) * 2007-08-16 2009-02-19 Deutsche Cell Gmbh Method for producing a semiconductor component, a semiconductor component, and an intermediate product in the production thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009021713A1 (en) * 2007-08-16 2009-02-19 Deutsche Cell Gmbh Method for producing a semiconductor component, a semiconductor component, and an intermediate product in the production thereof

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