JPS55138078A - Selective etching liquid for laminated metallic film - Google Patents
Selective etching liquid for laminated metallic filmInfo
- Publication number
- JPS55138078A JPS55138078A JP4332479A JP4332479A JPS55138078A JP S55138078 A JPS55138078 A JP S55138078A JP 4332479 A JP4332479 A JP 4332479A JP 4332479 A JP4332479 A JP 4332479A JP S55138078 A JPS55138078 A JP S55138078A
- Authority
- JP
- Japan
- Prior art keywords
- film
- etching
- liquid
- etching liquid
- laminated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE: To enable the etching of a minute pattern without forming side etching by a method wherein a surface active agent is added to an etching liquid when selectively etching the laminated metallic films being mounted as the electrodes of a semiconductor.
CONSTITUTION: A SiO2 surface protecting film 2 is installed onto a Si substrate 1, and the window portion is coated with a metallic film 3 of Cr, Ti, Mo, etc. contacting with Si. A Cu film 4 and an Ni film 5 are further laminated on the film 3, a photoresist film 6 for forming a pattern is further applied onto the film 5, and the Cu film 4 and the Ni film 5 are selectively etched according to an optical etching method. In this case, a liquid, which is manufactured by adding a surface active agent such as polyethyleneglycol alkylphenylether, etc. to a mixed acid liquid produced by compounding sulfuric acid, phosphoric acid, hydrogen peroxide and water at the rate of 2:3:1:4 at the rate of 1vol% and by keeping the mixture at 50°C, is used as an etching liquid. Side etching is also extremely little, and uniform etching can also be formed to a minute pattern.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4332479A JPS55138078A (en) | 1979-04-10 | 1979-04-10 | Selective etching liquid for laminated metallic film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4332479A JPS55138078A (en) | 1979-04-10 | 1979-04-10 | Selective etching liquid for laminated metallic film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS55138078A true JPS55138078A (en) | 1980-10-28 |
Family
ID=12660626
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4332479A Pending JPS55138078A (en) | 1979-04-10 | 1979-04-10 | Selective etching liquid for laminated metallic film |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS55138078A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61124589A (en) * | 1984-11-17 | 1986-06-12 | Daikin Ind Ltd | Composition for etching agent |
| JPH07263718A (en) * | 1993-03-19 | 1995-10-13 | Ramot Univ Authority For Appl Res & Ind Dev Ltd | Schottky semiconductor device and its preparation |
| JP2005146358A (en) * | 2003-11-17 | 2005-06-09 | Mitsubishi Gas Chem Co Inc | Etching liquid for titanium or titanium alloy |
-
1979
- 1979-04-10 JP JP4332479A patent/JPS55138078A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61124589A (en) * | 1984-11-17 | 1986-06-12 | Daikin Ind Ltd | Composition for etching agent |
| JPH07263718A (en) * | 1993-03-19 | 1995-10-13 | Ramot Univ Authority For Appl Res & Ind Dev Ltd | Schottky semiconductor device and its preparation |
| JP2005146358A (en) * | 2003-11-17 | 2005-06-09 | Mitsubishi Gas Chem Co Inc | Etching liquid for titanium or titanium alloy |
| JP4535232B2 (en) * | 2003-11-17 | 2010-09-01 | 三菱瓦斯化学株式会社 | Titanium or titanium alloy etchant |
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