JPS5773954A - Integrated circuit - Google Patents

Integrated circuit

Info

Publication number
JPS5773954A
JPS5773954A JP55149896A JP14989680A JPS5773954A JP S5773954 A JPS5773954 A JP S5773954A JP 55149896 A JP55149896 A JP 55149896A JP 14989680 A JP14989680 A JP 14989680A JP S5773954 A JPS5773954 A JP S5773954A
Authority
JP
Japan
Prior art keywords
chips
pads
sides
wafer
manner
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP55149896A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6124823B2 (enExample
Inventor
Hiroshi Iwahashi
Masamichi Asano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP55149896A priority Critical patent/JPS5773954A/ja
Publication of JPS5773954A publication Critical patent/JPS5773954A/ja
Publication of JPS6124823B2 publication Critical patent/JPS6124823B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1306—Field-effect transistor [FET]
    • H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Wire Bonding (AREA)
JP55149896A 1980-10-25 1980-10-25 Integrated circuit Granted JPS5773954A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55149896A JPS5773954A (en) 1980-10-25 1980-10-25 Integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55149896A JPS5773954A (en) 1980-10-25 1980-10-25 Integrated circuit

Publications (2)

Publication Number Publication Date
JPS5773954A true JPS5773954A (en) 1982-05-08
JPS6124823B2 JPS6124823B2 (enExample) 1986-06-12

Family

ID=15484980

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55149896A Granted JPS5773954A (en) 1980-10-25 1980-10-25 Integrated circuit

Country Status (1)

Country Link
JP (1) JPS5773954A (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS647628A (en) * 1987-06-30 1989-01-11 Hitachi Ltd Semiconductor device and manufacture thereof
JPH0429346A (ja) * 1990-05-24 1992-01-31 Mitsubishi Electric Corp 半導体装置
US5130644A (en) * 1988-11-23 1992-07-14 Texas Instruments Incorporated Integrated circuit self-testing device and method
JPH05166895A (ja) * 1991-12-19 1993-07-02 Kawasaki Steel Corp 半導体集積回路

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS647628A (en) * 1987-06-30 1989-01-11 Hitachi Ltd Semiconductor device and manufacture thereof
US5130644A (en) * 1988-11-23 1992-07-14 Texas Instruments Incorporated Integrated circuit self-testing device and method
JPH0429346A (ja) * 1990-05-24 1992-01-31 Mitsubishi Electric Corp 半導体装置
JPH05166895A (ja) * 1991-12-19 1993-07-02 Kawasaki Steel Corp 半導体集積回路

Also Published As

Publication number Publication date
JPS6124823B2 (enExample) 1986-06-12

Similar Documents

Publication Publication Date Title
JPS5661136A (en) Semiconductor test equipment
GB1443361A (en) Lsi chip construction
DE2964965D1 (en) Semiconductor chip with improved ability for testing the large scale integrated circuits
DE3382311D1 (en) Online-monitor.
JPS641042A (en) Hardware simulator and its simulation method
DE68923086D1 (de) Verfahren zum Testen von hierarchisch organisierten integrierten Schaltungen und integrierte Schaltungen, geeignet für einen solchen Test.
JPS57189397A (en) Semiconductor storage device
JPS5773954A (en) Integrated circuit
JPS57179997A (en) Semiconductor memory
JPS57106062A (en) Package for integrated circuit
JPH03214638A (ja) 半導体ウェハ
JPS57190343A (en) Semiconductor integrated circuit
JPS5661151A (en) Package semiconductor integrated circuit
JPS5624946A (en) Master slice type integrated circuit
JPS5627667A (en) Method of estimating semiconductor device
JPS5771166A (en) Semiconductor device
JPS577136A (en) Inspection of semiconductor device
JPS6439559A (en) Probe card
JPS604233A (ja) 集積回路装置
JPS6433962A (en) Linear image sensor
JPS5935448A (ja) マスタスライス集積回路装置
JPS5291646A (en) Array probe card for testing ic wafer
JPS57112048A (en) Master slice type semiconductor integrated circuit device
JPS5666053A (en) Fixed probing card
JPS5636148A (en) Semiconductor device and its manufacture