JPS5768041A - Die bonding method - Google Patents

Die bonding method

Info

Publication number
JPS5768041A
JPS5768041A JP14380680A JP14380680A JPS5768041A JP S5768041 A JPS5768041 A JP S5768041A JP 14380680 A JP14380680 A JP 14380680A JP 14380680 A JP14380680 A JP 14380680A JP S5768041 A JPS5768041 A JP S5768041A
Authority
JP
Japan
Prior art keywords
bonding
temperature
die
computer
stage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14380680A
Other languages
Japanese (ja)
Other versions
JPH0133938B2 (en
Inventor
Kunihiko Hayashi
Haruo Kojima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP14380680A priority Critical patent/JPS5768041A/en
Publication of JPS5768041A publication Critical patent/JPS5768041A/en
Publication of JPH0133938B2 publication Critical patent/JPH0133938B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE:To prevent the occurrence of a malfunction at a die bonding method by attaching a non-contact temperature detector to a bonding device to detect the temperature of a die stage, and controlling the program of bonding in response to the detected temperature, thereby optimizing the bonding conditions. CONSTITUTION:A package 1 ia placed on a bonding stage 2 containing a heater therein, and the temperature of a die stage 4 at the bonding position 3 is detected by an infrared temperature detector 11. The detection signal is fed to the comparator 13 of a controller 8, which compares it with the set temperature by a reference temperature setting unit 12 in advance and delivers a temperature difference signal DELTAT through an A/D converter 14 to a computer 15. The computer 15 has programs for the propriety of starting bonding, scribing range, scribing number and time, etc. corresponding to the temperature difference DELTAT therein and delivers a control signal to a drive unit 9. The drive unit 9 drives a head 6 in accordance with an instruction from the computer 15 and die bonds an element 5 mounted on a tool 7. In this manner, improper moisture can be eliminated, and stable bonding can be performed.
JP14380680A 1980-10-15 1980-10-15 Die bonding method Granted JPS5768041A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14380680A JPS5768041A (en) 1980-10-15 1980-10-15 Die bonding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14380680A JPS5768041A (en) 1980-10-15 1980-10-15 Die bonding method

Publications (2)

Publication Number Publication Date
JPS5768041A true JPS5768041A (en) 1982-04-26
JPH0133938B2 JPH0133938B2 (en) 1989-07-17

Family

ID=15347404

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14380680A Granted JPS5768041A (en) 1980-10-15 1980-10-15 Die bonding method

Country Status (1)

Country Link
JP (1) JPS5768041A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01121927U (en) * 1988-02-12 1989-08-18
JPH08255809A (en) * 1992-02-29 1996-10-01 Toshiba Seiki Kk Lead frame heating method and device thereof
US6107606A (en) * 1998-01-05 2000-08-22 Texas Instruments Incorporated Method and apparatus for measuring temperatures during electronic package assembly

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55105336A (en) * 1979-02-07 1980-08-12 Nec Corp Die-bonding apparatus for semiconductor

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55105336A (en) * 1979-02-07 1980-08-12 Nec Corp Die-bonding apparatus for semiconductor

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01121927U (en) * 1988-02-12 1989-08-18
JPH08255809A (en) * 1992-02-29 1996-10-01 Toshiba Seiki Kk Lead frame heating method and device thereof
US6107606A (en) * 1998-01-05 2000-08-22 Texas Instruments Incorporated Method and apparatus for measuring temperatures during electronic package assembly

Also Published As

Publication number Publication date
JPH0133938B2 (en) 1989-07-17

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