JPH08255809A - Lead frame heating method and device thereof - Google Patents
Lead frame heating method and device thereofInfo
- Publication number
- JPH08255809A JPH08255809A JP5545396A JP5545396A JPH08255809A JP H08255809 A JPH08255809 A JP H08255809A JP 5545396 A JP5545396 A JP 5545396A JP 5545396 A JP5545396 A JP 5545396A JP H08255809 A JPH08255809 A JP H08255809A
- Authority
- JP
- Japan
- Prior art keywords
- temperature
- lead frame
- heater block
- heater
- control device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、リードフレームの
加熱方法および装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lead frame heating method and apparatus.
【０００２】[0002]
【従来の技術】例えばワイヤボンディング装置において
は、良好なボンディングを行なうために、ボンディング
位置に位置決めされたリードフレームを、ボンディング
動作の前にヒータブロックによって必要な温度に加熱す
るようにしている。2. Description of the Related Art In a wire bonding apparatus, for example, a lead block positioned at a bonding position is heated to a required temperature by a heater block before a bonding operation in order to perform good bonding.
【０００３】ところで従来のヒータブロックの温度制御
は、次のようにして行なっていた。すなわち、このヒー
タブロック内に棒状ヒータ並びに熱電対を挿入し、熱電
対にて検出される温度に基づいて棒状ヒータの発熱量調
整を行なうようにしていた。By the way, the conventional heater block temperature control is performed as follows. That is, a rod-shaped heater and a thermocouple are inserted in this heater block, and the heat generation amount of the rod-shaped heater is adjusted based on the temperature detected by the thermocouple.
【０００４】[0004]
【発明が解決しようとする課題】ところが、熱電対によ
って検出される温度は、ヒータブロックの内部温度であ
って、リードフレームと接触する上面温度とは異なるた
め、ヒータブロックの上面を所定温度に設定することが
困難であった。このようなことから、ヒータブロックに
より加熱されるリードフレームの温度制御も不完全とな
り、ヒータブロックの上面温度がリードフレームを加熱
するに必要な温度と相違すると、ボンディング不良やペ
レット破壊等の様々な問題を生じていた。However, since the temperature detected by the thermocouple is the internal temperature of the heater block and is different from the upper surface temperature in contact with the lead frame, the upper surface of the heater block is set to a predetermined temperature. It was difficult to do. For this reason, the temperature control of the lead frame heated by the heater block also becomes incomplete, and if the upper surface temperature of the heater block is different from the temperature required to heat the lead frame, various problems such as defective bonding and pellet destruction may occur. Was causing problems.
【０００５】本発明は、リードフレームの温度制御を確
実に行なえる加熱方法および装置を提供することを目的
とする。An object of the present invention is to provide a heating method and device which can surely control the temperature of the lead frame.
【０００６】[0006]
【課題を解決するための手段】請求項１に記載の本発明
は、温度制御されるヒータブロックによりリードフレー
ムを加熱するリードフレームの加熱方法において、前記
ヒータブロックにおけるリードフレーム加熱面の温度を
非接触状態で検出し、この検出信号に基づいて前記ヒー
タブロックを温度制御することを特徴とする。The present invention according to claim 1 provides a lead frame heating method for heating a lead frame by means of a temperature-controlled heater block, wherein the temperature of the lead frame heating surface of the heater block is not controlled. It is characterized in that the heater block is detected in a contact state and the temperature of the heater block is controlled based on the detection signal.
【０００７】請求項２に記載の本発明は、温度制御され
るヒータブロックによりリードフレームを加熱するリー
ドフレームの加熱装置において、前記ヒータブロックに
設けたヒータと、前記ヒータブロックにおけるリードフ
レーム加熱面の温度を非接触状態で検出する温度センサ
と、この温度センサの検出信号に基づいて前記ヒータの
発熱量を制御する温度制御装置とを設けたことを特徴と
する。According to a second aspect of the present invention, in a lead frame heating device for heating a lead frame by a temperature-controlled heater block, a heater provided in the heater block and a lead frame heating surface of the heater block are provided. A temperature sensor that detects the temperature in a non-contact state and a temperature control device that controls the heat generation amount of the heater based on a detection signal of the temperature sensor are provided.
【０００８】本発明によれば、ヒータブロックにおける
リードフレーム加熱面の温度が温度センサにより非接触
状態で検出され、この検出信号に基づいてヒータブロッ
クの温度制御が行なわれる。According to the present invention, the temperature of the heating surface of the lead frame in the heater block is detected by the temperature sensor in a non-contact state, and the temperature of the heater block is controlled based on this detection signal.
【０００９】[0009]
【発明の実施の形態】本発明の実施の形態について説明
する。図１は、本発明をワイヤボンディング装置に適用
した例で、加熱装置の正面断面図である。図に示すワイ
ヤボンディング装置１には、前工程にてペレット２が載
置されたリードフレーム３を搬送案内する搬送レール４
が設けられる。そして、搬送レール４の途上にはボンデ
ィング位置が設定され、公知のボンディングヘッドが配
置される。なお図には、そのボンディングツール５のみ
を示している。また搬送レール４の下方には、このボン
ディングツール５に対向するようにして、ヒータブロッ
ク６が設けられる。このヒータブロック６は、ヒータブ
ロック本体７と、このヒータブロック本体７上に交換自
在に載置された支持テーブル８から構成され、支持テー
ブル８の上面レベルは、搬送レール４の搬送面レベルと
略同一に設定される。なおヒータブロック本体７内に
は、棒状のヒータ９が挿入される。BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described. FIG. 1 is an example in which the present invention is applied to a wire bonding device, and is a front sectional view of a heating device. The wire bonding apparatus 1 shown in the figure includes a transport rail 4 for transporting and guiding the lead frame 3 on which the pellets 2 are mounted in the previous step.
Is provided. A bonding position is set on the way of the transport rail 4, and a known bonding head is arranged. In the figure, only the bonding tool 5 is shown. A heater block 6 is provided below the transport rail 4 so as to face the bonding tool 5. The heater block 6 is composed of a heater block main body 7 and a support table 8 placed on the heater block main body 7 in an exchangeable manner, and the upper surface level of the support table 8 is substantially the same as the transfer surface level of the transfer rail 4. It is set to the same. A rod-shaped heater 9 is inserted in the heater block body 7.
【００１０】ヒータブロック６の上方には、温度センサ
１０が設けられる。この温度センサ１０は、ヒータブロ
ック６を構成する支持テーブル８の上面、すなわちリー
ドフレーム加熱面の温度を、この支持テーブル８とは非
接触状態で検出するもので、例えば赤外線センサ等を用
いることができる。そしてこの温度センサ１０による検
出信号は、温度制御装置１１に入力される。温度制御装
置１１は、リードフレーム３を加熱するに必要とされる
支持テーブル８の上面の設定温度Ｔを入力するための入
力部１２を有し、この入力部１２から入力された設定温
度Ｔと、温度センサ１０によって検出された支持テーブ
ル８の上面温度ｔとに基づき、ヒータ９の電流制御を行
なうものである。A temperature sensor 10 is provided above the heater block 6. The temperature sensor 10 detects the temperature of the upper surface of the support table 8 constituting the heater block 6, that is, the temperature of the lead frame heating surface, in a state of not contacting the support table 8. For example, an infrared sensor or the like may be used. it can. The detection signal from the temperature sensor 10 is input to the temperature control device 11. The temperature control device 11 has an input unit 12 for inputting a set temperature T of the upper surface of the support table 8 required to heat the lead frame 3, and the set temperature T input from the input unit 12 The current control of the heater 9 is performed based on the upper surface temperature t of the support table 8 detected by the temperature sensor 10.
【００１１】次に作動について説明すると、まずボンデ
ィング作業の開始に先立ち、オペレータにより設定温度
Ｔが入力部１２より入力される。この後、ワイヤボンデ
ィング装置１が起動させられると、温度制御装置１１
は、ヒータ９に電流を供給する。そしてこのヒータ９の
発熱作用により、ヒータブロック６は加熱される。Next, the operation will be described. First, the operator inputs the set temperature T from the input unit 12 before starting the bonding work. After that, when the wire bonding apparatus 1 is activated, the temperature control device 11
Supplies a current to the heater 9. The heater block 6 is heated by the heat generation effect of the heater 9.
【００１２】一方、温度センサ１０は、ヒータブロック
６を構成する支持テーブル８の上面温度ｔを検出し、そ
の検出信号が温度制御装置１１に送られる。そこで温度
制御装置１１においては、温度センサ１０によって求め
られた支持テーブル８の上面温度ｔと設定温度Ｔを比較
し、その比較結果に基づき、上面温度ｔが設定温度Ｔに
近づくようにヒータ９に供給する電流を制御することで
その発熱量を制御する。そして支持テーブル８の上面温
度ｔと設定温度Ｔとが一致した時点で、装置本体の制御
部（不図示）にボンディング準備完了信号を出力する。
制御部は、このボンディング準備完了信号が得られた
後、ボンディング装置全体の作動を開始させる。そこで
リードフレーム３は、不図示の搬送手段により搬送レー
ル４に案内されながらピッチ移動させられ、そしてボン
ディング位置に到達すると、或いはボンディング位置の
数ピッチ手前の位置に位置付けられた時より、ヒータブ
ロック６により加熱される。以後、加熱されたリードフ
レーム３に対し、ボンディングツール５によるボンディ
ング作業が施される。On the other hand, the temperature sensor 10 detects the upper surface temperature t of the support table 8 forming the heater block 6, and the detection signal is sent to the temperature control device 11. Therefore, in the temperature control device 11, the upper surface temperature t of the support table 8 obtained by the temperature sensor 10 is compared with the set temperature T, and the heater 9 is controlled so that the upper surface temperature t approaches the set temperature T based on the comparison result. The amount of heat generated is controlled by controlling the supplied current. Then, when the upper surface temperature t of the support table 8 and the set temperature T match, a bonding preparation completion signal is output to the control unit (not shown) of the apparatus body.
After the bonding preparation completion signal is obtained, the control unit starts the operation of the entire bonding apparatus. Therefore, the lead frame 3 is pitch-moved while being guided by the transport rail 4 by a transport means (not shown), and when the lead frame 3 reaches the bonding position or is positioned a few pitches before the bonding position, the heater block 6 is provided. Is heated by. After that, the bonding work by the bonding tool 5 is performed on the heated lead frame 3.
【００１３】なお、このボンディング作業中において
も、温度センサ１０からの検出信号が随時温度制御装置
１１に入力され、この入力信号に基づいてヒータ９の発
熱量の制御が行われる。Even during this bonding operation, the detection signal from the temperature sensor 10 is input to the temperature control device 11 as needed, and the heat generation amount of the heater 9 is controlled based on this input signal.
【００１４】上記した実施の形態によれば、非接触型の
温度センサ１０によってヒータブロック６を構成する支
持テーブル８の上面温度ｔを直接検出し、この検出信号
に基づいてヒータ９に対する電流制御を行なうようにし
ているため、ヒータブロック６の上面温度を正確に設定
温度Ｔに設定することができる。従って、リードフレー
ム３は必要とされる温度に確実に加熱され、ボンディン
グ不良、ペレット破損等の不具合の発生を防ぐことがで
きる。According to the above-described embodiment, the non-contact temperature sensor 10 directly detects the upper surface temperature t of the support table 8 constituting the heater block 6, and the current control for the heater 9 is performed based on this detection signal. Since this is performed, the upper surface temperature of the heater block 6 can be accurately set to the set temperature T. Therefore, the lead frame 3 is surely heated to the required temperature, and it is possible to prevent the occurrence of defects such as defective bonding and pellet breakage.
【００１５】なお上記実施の形態においては、本発明を
ワイヤボンディング装置に適用した例で説明したが、こ
れに限られず、例えばペレットボンディング装置におい
ても適用することができる。In the above embodiments, the present invention is applied to a wire bonding apparatus, but the present invention is not limited to this and can be applied to a pellet bonding apparatus, for example.
【００１６】[0016]
【発明の効果】本発明によれば、リードフレームの温度
制御を確実に行なえる。According to the present invention, the temperature control of the lead frame can be surely performed.
【図１】本発明の実施の形態である加熱装置の正面断面
図である。FIG. 1 is a front sectional view of a heating device according to an embodiment of the present invention.
１ ワイヤボンディング装置 ２ ペレット ３ リードフレーム ４ 搬送レール ５ ボンディングツール ６ ヒータブロック ７ ヒータブロック本体 ８ 支持テーブル ９ ヒータ １０ 温度センサ １１ 温度制御装置 １２ 入力部 1 Wire Bonding Device 2 Pellet 3 Lead Frame 4 Conveyor Rail 5 Bonding Tool 6 Heater Block 7 Heater Block Main Body 8 Support Table 9 Heater 10 Temperature Sensor 11 Temperature Control Device 12 Input Unit
Claims (2)
ードフレームを加熱するリードフレームの加熱方法にお
いて、前記ヒータブロックにおけるリードフレーム加熱
面の温度を非接触状態で検出し、この検出信号に基づい
て前記ヒータブロックを温度制御することを特徴とする
リードフレームの加熱装置。1. A lead frame heating method for heating a lead frame by a temperature-controlled heater block, wherein the temperature of a lead frame heating surface of the heater block is detected in a non-contact state, and the heater is detected based on the detection signal. A heating device for a lead frame, wherein the temperature of the block is controlled.
ードフレームを加熱するリードフレームの加熱装置にお
いて、前記ヒータブロックに設けたヒータと、前記ヒー
タブロックにおけるリードフレーム加熱面の温度を非接
触状態で検出する温度センサと、この温度センサの検出
信号に基づいて前記ヒータの発熱量を制御する温度制御
装置とを設けたことを特徴とするリードフレームの加熱
装置。2. A lead frame heating device for heating a lead frame by a temperature-controlled heater block, wherein the temperature of a heater provided in the heater block and a lead frame heating surface of the heater block is detected in a non-contact state. A heating device for a lead frame, comprising: a temperature sensor; and a temperature control device that controls a heat generation amount of the heater based on a detection signal of the temperature sensor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5545396A JP3164283B2 (en) | 1992-02-29 | 1996-02-19 | Lead frame heating method and apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5545396A JP3164283B2 (en) | 1992-02-29 | 1996-02-19 | Lead frame heating method and apparatus |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10199198A Division JP3178518B2 (en) | 1998-03-30 | 1998-03-30 | Lead frame heating device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH08255809A true JPH08255809A (en) | 1996-10-01 |
| JP3164283B2 JP3164283B2 (en) | 2001-05-08 |
Family
ID=12999034
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5545396A Expired - Fee Related JP3164283B2 (en) | 1992-02-29 | 1996-02-19 | Lead frame heating method and apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3164283B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6107606A (en) * | 1998-01-05 | 2000-08-22 | Texas Instruments Incorporated | Method and apparatus for measuring temperatures during electronic package assembly |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5768041A (en) * | 1980-10-15 | 1982-04-26 | Fujitsu Ltd | Die bonding method |
| JPS61101041A (en) * | 1984-10-24 | 1986-05-19 | Hitachi Ltd | Semiconductor manufacturing device |
-
1996
- 1996-02-19 JP JP5545396A patent/JP3164283B2/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5768041A (en) * | 1980-10-15 | 1982-04-26 | Fujitsu Ltd | Die bonding method |
| JPS61101041A (en) * | 1984-10-24 | 1986-05-19 | Hitachi Ltd | Semiconductor manufacturing device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6107606A (en) * | 1998-01-05 | 2000-08-22 | Texas Instruments Incorporated | Method and apparatus for measuring temperatures during electronic package assembly |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3164283B2 (en) | 2001-05-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2004291067A (en) | Method and apparatus for incremental forming | |
| US9238286B2 (en) | Method of controlling laser beam preheating temperature of surface of workpiece | |
| US4678432A (en) | Heat treatment method | |
| JPH08255809A (en) | Lead frame heating method and device thereof | |
| JP3178518B2 (en) | Lead frame heating device | |
| JPH0572137U (en) | Lead frame heating equipment | |
| WO2018185835A1 (en) | Plasma generation system | |
| JPH08224679A (en) | Laser welding method and device therefor | |
| JP2712296B2 (en) | Heating furnace temperature controller | |
| JPS6252926A (en) | Heat treatment device | |
| JP2569921Y2 (en) | Soldering equipment using laser beam | |
| JPH11330686A (en) | Reflowing apparatus, method for measuring reflow temperature, and method for reflowing | |
| JP2001038809A (en) | Automatic welding apparatus | |
| JP2749669B2 (en) | Glass rod stretching method | |
| JP2939526B2 (en) | Heating control method for stacked different types of resin sheets | |
| JPS6313668A (en) | Welding conditions control method | |
| JPH07237200A (en) | Cutting plotter using hot pen | |
| US6008481A (en) | Method and apparatus for deciding heated state of metal billet | |
| JPH01282620A (en) | Temperature controller for semiconductor processing furnace | |
| JPH1136019A (en) | Method and device for judging heated condition of metallic billet | |
| JPH0586314B2 (en) | ||
| JPH0232070B2 (en) | ||
| JPH02241671A (en) | Soldering device | |
| JPH04354982A (en) | Electric iron | |
| JPS6484271A (en) | Method for controlling temperature of fixing device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080302 Year of fee payment: 7 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090302 Year of fee payment: 8 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090302 Year of fee payment: 8 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100302 Year of fee payment: 9 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100302 Year of fee payment: 9 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110302 Year of fee payment: 10 |
|
| LAPS | Cancellation because of no payment of annual fees |