JPH11330686A - Reflowing apparatus, method for measuring reflow temperature, and method for reflowing - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a reflowing apparatus for simplifying a temperature profile measuring operation, without impairing an internal unit without exposing a temperature calculator for calculating the measurement temperature of a material to be heated through high temperature by a heater with a high temperature, a method for measuring a reflow temperature and a method for reflowing. SOLUTION: This reflowing apparatus comprises a conveyor for conveying an article 8 to be heated such as a printed board, having an electronic component mounted thereon, heaters for heating the article 8, a transfer means 7 for moving an input terminal 8a for inputting temperature measuring information from an output terminal 8ab of a temperature sensor connected to the article 8, in synchronization with a conveying speed of the article 6 on the conveyor 9 for conveying the article 6 from an introducing unit to a discharging unit, and a terminal 10 of a temperature calculator connected to the terminal 8a and disposed at a place where is no effect of the heater.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a reflow apparatus, a reflow temperature measuring method, and a reflow apparatus for reflow heating solder of an object to be heated such as a printed circuit board on which electronic components are mounted.

[0002]

2. Description of the Related Art In recent years, in a reflow apparatus, in order to maintain the performance of components or to reduce defective soldering in the soldering process of electronic components in accordance with the miniaturization, diversification, high density, and the development of semiconductors such as CSPs. Temperature profile management at the time of soldering has become a major issue.

Next, a method of managing a temperature profile in a conventional reflow apparatus will be described.

FIG. 8 is a schematic perspective view of a conventional reflow device. In this conventional reflow device, a thermocouple 31 having a length exceeding the device length of a device main body 28 is attached to a printed circuit board 29 on which electronic components are mounted. And the temperature profile is measured by the thermocouple 31 while being sent into the apparatus main body 28,
After the measurement is completed, the printed circuit board 29 and the thermocouple 31 are pulled back. Then, the thermocouple 3 in the device main body 28
By inputting the signal from 1 to the temperature recorder 32, the time change of the temperature of the temperature measurement target portion in the apparatus main body 28 can be captured.

FIG. 9 is a partial perspective view showing a printed circuit board conveyed into the apparatus body, a thermocouple connected to the printed circuit board, and a storage device connected to the thermocouple in another conventional reflow apparatus. It is.

In this conventional reflow apparatus, a storage device 33 for storing a temperature profile measured by a thermocouple 31 attached to a printed circuit board 29 on which electronic components are mounted is transported simultaneously with the printed circuit board 29 and reflowed. After passing through the inside of the device main body 28 of the device, the temperature profile was read from the storage device 33.

[0007]

However, the former method of managing the temperature profile in the reflow apparatus has a problem that the soldering process of the printed circuit board is stopped while the temperature is being measured. In addition, there is a problem that the measuring operation itself is troublesome, and there is a problem that the temperature profile during the actual production operation is not actually measured. Therefore, an accurate temperature profile during the actual production operation cannot be grasped, and therefore, there is a problem that a decrease in soldering quality due to a change in the temperature profile during the actual production operation cannot be prevented.

In the latter reflow device, the storage device 33 is exposed to a high temperature together with the printed circuit board 29 and heated by the heating section of the reflow device.
However, there is a problem that the internal device of the device is disturbed. Furthermore,
Since the storage device 33 takes up space on the transport device, there is a problem that printed boards cannot be placed on the transport device at the same interval.

SUMMARY OF THE INVENTION The present invention solves the above-mentioned conventional problems, and a temperature calculation device for calculating a measured temperature of an object to be heated is not heated by being exposed to a high temperature in a heating section, which hinders internal devices. It is an object of the present invention to provide a reflow apparatus, a reflow temperature measurement method, and a reflow method that can simplify a temperature profile measurement operation, improve a soldering quality and improve an operation rate without any problem.

[0010]

In order to achieve the above object, a reflow apparatus according to a first aspect of the present invention comprises a transport section for transporting an object to be heated such as a printed circuit board on which electronic components are mounted, and In a reflow apparatus provided with a heating unit for heating, a temperature calculation device having an input terminal for inputting temperature measurement information of the object to be heated, and a transfer means for moving the input terminal in synchronization with a transport speed of the object to be heated And an output terminal of a temperature sensor connectable to the input terminal and connected to the object to be heated, wherein the temperature calculation device is arranged in a place where the heating section has no thermal influence. Features.

[0011] Further, after the input terminal and the output terminal are connected to each other at the input portion of the apparatus main body and the object to be heated is set in the transfer apparatus, the movement of the two terminals is started in synchronization with the transfer apparatus. Preferably, control means for controlling the transfer means is provided.

[0012] Further, a separating means for separating the input terminal and the output terminal from a discharge portion of the apparatus main body for discharging the object to be heated from the apparatus main body; It is preferable to provide control means for controlling the transfer means so that the device automatically returns from the discharge section of the apparatus body to the input section.

[0013] Further, control means for controlling the input terminal and the object to which the output terminal is attached so that the object to be heated is supplied at an appropriate timing, and storage means for storing a temperature profile of the object to be heated are stored. Comparison means for comparing the temperature profile with a reference temperature profile, and comparing the temperature profile stored by the comparison means with the reference temperature profile, the difference between the stored temperature profile and the reference profile is determined in advance. It is preferable to provide a warning unit that issues a warning when the set value is exceeded.

Further, a control means for controlling the temperature profile of a newly-produced object to be heated so as to be automatically and repeatedly measured with respect to a reference temperature profile serving as a production condition; It is preferable to provide control means for controlling the heating unit and the transfer device so as to reduce a difference between the temperature profile and the reference temperature profile.

According to a second aspect of the present invention, there is provided a reflow apparatus comprising a transport section for transporting an object to be heated such as a printed circuit board on which electronic components are mounted, and a heating section for heating the object to be heated. A temperature calculation device having an input terminal for inputting temperature measurement information of an object, and a sample of a heated object or an article having characteristics similar to the heated object, to which an output terminal of a temperature sensor connectable to the input terminal is attached. Moving means for holding in the same state as the state and moving in synchronization with the transfer device together with the input terminal, wherein the temperature calculating device is arranged outside the heating section.

It is preferable to provide control means for controlling the moving means so that the input terminal automatically returns from the discharge section of the apparatus body to the input section.

Further, a control means for controlling a sample of the object to be heated to which the input terminal and the output terminal are attached or an article having the same characteristics as the object to be heated so as to be supplied at an appropriate timing; Storage means for storing the temperature profile, a comparison means for comparing the stored temperature profile with a reference temperature profile, and comparing the temperature profile stored by the comparison means with the reference temperature profile. It is preferable to provide a warning unit that issues a warning when the difference between the temperature profile and the reference profile exceeds a preset value.

A control means for controlling the temperature profile of a newly-produced object to be heated so as to be automatically and repeatedly measured with respect to a reference temperature profile serving as a production condition; It is preferable to provide control means for controlling the heating unit and the transfer device so as to reduce the difference between the temperature profile and the reference temperature profile.

According to the reflow temperature measuring method of the present invention, an input terminal of a temperature calculating device is transferred in synchronization with a transfer speed of transferring a heated object such as a printed board on which electronic components are mounted by a transfer device of a reflow device. Measuring the temperature of the object to be heated, which is connectable to the input terminal, at the output terminal of a temperature sensor connected to the object to be heated. It is characterized in that it is placed in a place where there is no thermal effect on the part.

According to a reflow method of the present invention, in a reflow method for reflow-heating solder of an object to be heated such as a printed circuit board on which electronic components are mounted, the reflow method is synchronized with a transfer speed at which the object to be heated is transferred by a transfer device of a reflow apparatus. Transfer the input terminal of the temperature calculation device, connectable to the input terminal, measure the temperature of the object to be heated at an output terminal of a temperature sensor connected to the object to be heated, and further connect the input terminal The temperature calculation device provided is placed in a place where there is no thermal influence of the heating unit of the device main body, and the temperature profile of the temperature measurement information by the input terminal is compared with a reference temperature profile,
The electronic component is reflowed on the object to be heated by controlling so as to reduce the difference between these temperature profiles.

According to the reflow device of the first invention, the object to be heated, such as a printed circuit board on which electronic components are mounted, is conveyed from the input portion to the discharge portion of the object, in synchronization with the transfer speed of the object. An output terminal of the temperature sensor connected to the heating object, and an input terminal connected to the output terminal and inputting the temperature measurement information of the object to be heated from the output terminal are configured to be moved by the transfer means, Temperature measurement information from the output terminal of the temperature sensor connected to the object to be heated can be sequentially input to the temperature calculation device at this input terminal, so that the temperature profile inside the device body during the actual production operation can be accurately grasped. In addition, the temperature profile measurement operation can be simplified, and the soldering quality can be improved and the operating rate can be improved.

Further, since the temperature calculating device is arranged in a place where the heating section has no thermal influence, the temperature calculating device is not heated by being exposed to the high temperature of the heating portion. Does not interfere with

Furthermore, after the input terminal and the output terminal are connected and the object to be heated is set in the transfer device, the transfer means can be controlled by the control means so as to start the movement of the input terminal and the output terminal. The transfer of the object to be heated by the apparatus and the movement of the input terminal and the output terminal by the transfer means can be started at the same time.

Also, the input terminal and the output terminal can be separated by the discharge unit by the separating means provided at the discharge unit of the apparatus main body, and the separated input terminal can be separated by controlling the transfer means by the control means. It is possible to return from the discharge section of the main body to the input section and input the temperature measurement information of the next heated object transported by the transport device by the input terminal. Can be continued.

Further, the object to be heated, to which the output terminal is attached, is supplied at an appropriate timing under the control of the control means, and the temperature profile of the object to be heated is stored in the storage means, and the stored temperature profile is used as a reference. Since the temperature profile is compared with the comparing means, and as a result of the comparison by the comparing means, a warning is issued by the warning means when the difference between the stored temperature profile and the reference temperature profile exceeds a preset value. By stopping the transfer device or adjusting the heat generation temperature of the heat generating portion in accordance with the warning by the warning means, the temperature in the device main body can be adjusted to the most suitable heating temperature for the object to be heated.

Further, the temperature profile of a newly-produced object to be heated is automatically and repeatedly measured by a control means with respect to a reference temperature profile as a production condition.
The control section controls the heating section and the transfer device so as to reduce the difference between the temperature profile of the newly-produced object to be heated and the reference temperature profile. The heating temperature can be maintained, and the soldering quality can be improved.

According to the reflow apparatus of the second invention, the input terminal to which the output terminal of the temperature sensor is connected and the sample of the object to be heated to which the output terminal of the temperature sensor is attached, or an article having similar characteristics are moved by the moving means. Since the sample of the object to be heated or an article having similar characteristics can be moved in synchronization with the transporting device while being held in the same form as the transported state by the transporting device, the object to be heated moved by the moving means The temperature measurement information of the sample or the article having similar characteristics can be input to the temperature calculation device of the input terminal as the temperature measurement information of the object to be heated conveyed by the conveyance device.

Therefore, the temperature profile in the apparatus main body during the actual production operation can be accurately grasped, the temperature profile measuring operation can be simplified, and the soldering quality can be improved and the operation rate can be improved.

Further, since the temperature calculating device is arranged in a place where the heating section has no thermal influence, the temperature calculating device is not heated by being exposed to the high temperature of the heating portion. Does not interfere with

Furthermore, the control means can control the input terminal to automatically return from the discharge section to the input section of the apparatus main body, so that the object to be heated having the input terminal and the output terminal held by the moving means attached thereto. Sample or an article having similar properties can be immediately ready for the next temperature measurement.

Further, a sample of the object to be heated, to which the output terminal is attached, or an article having similar characteristics is input at an appropriate timing under the control of the control means, and the temperature profile of the object to be heated is stored in the storage means. The comparing means compares the stored temperature profile with the reference temperature profile, and when the difference between the stored temperature profile and the reference temperature profile exceeds a preset value, the warning means. Therefore, the temperature in the apparatus main body is set to the most suitable heating temperature for the object to be heated by stopping the transfer device or adjusting the heat generation temperature of the heat generating portion according to the warning by the warning means. Can respond.

Further, a temperature profile of a newly-produced object to be heated is automatically and repeatedly measured by a control means with respect to a reference temperature profile as a production condition.
The control section controls the heating section and the transfer device so as to reduce the difference between the temperature profile of the newly-produced object to be heated and the reference temperature profile. The heating temperature can be maintained, and the soldering quality can be improved.

According to the reflow temperature measuring method of the present invention,
The input terminal is moved by the transfer means in synchronization with the transfer device, and the temperature of the object to be heated is measured at the output terminal of the temperature sensor connected to the input terminal and connected to the object to be heated. The temperature measurement information of the object to be heated measured in step 1 can be sequentially input to the temperature calculation device of the input terminal, so that the temperature profile in the device body during the actual production operation can be accurately grasped, and the temperature profile measurement work Can be simplified, and the soldering quality can be improved and the operation rate can be improved.

Further, since the temperature calculating device is disposed in a place where the heating section has no thermal influence, the temperature calculating device is not heated by being exposed to the high temperature of the heating section. Does not interfere with

According to the reflow method of the present invention, the input terminal connected to the output terminal of the temperature sensor connected to the object to be heated is moved in synchronism with the transfer device by the transfer means, and the temperature profile by this input terminal and the reference. Can be controlled so as to reduce the difference between these temperature profiles, so that the inside of the apparatus main body can be maintained at the heating temperature most suitable for the object to be heated. Since the electronic components can be mounted on the heated object, the temperature profile inside the main unit during the actual production operation can be accurately grasped, and the temperature profile measurement work can be simplified, improving the soldering quality and improving the operation rate. Can be planned.

Further, since the temperature calculating device is arranged in a place where the heating section has no thermal influence, the temperature calculating device is not exposed to the high temperature of the heating section and is not heated. Does not interfere with

[0037]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of a reflow apparatus, a reflow temperature measuring method and a reflow method according to the present invention will be described below with reference to the drawings.

FIG. 1 is a schematic cross-sectional view showing the entire configuration of the reflow apparatus of the present invention, FIG. 2 is a schematic perspective view showing details of a main part of the reflow apparatus of the first embodiment, and FIG. 3 is a reflow apparatus of the first embodiment. FIG. 4 is a schematic perspective view showing a temperature measuring device of the apparatus, and FIG. 4 is a schematic perspective view showing an internal structure of the reflow apparatus according to the first embodiment.

In FIG. 1, reference numeral 1 denotes an apparatus main body having residual heat sections 2, 3 and reflow sections 4, 5, and a printed circuit board 6 loaded into the apparatus main body 1 is provided with a conveyor 9 comprising a conveyor.
Conveyed by the residual heat parts 2, 3 and the reflow part 4,
5 and is discharged from the apparatus main body 1. In addition, a transfer unit including a drive unit 7 that moves the input terminal 8a formed of a thermocouple connector together with the transfer speed of the printed circuit board 6 by the transfer device 9 is provided.

In the reflow apparatus according to the first embodiment, as shown in FIG. 2, the drive unit 7 uses a drive source (not shown) of the transfer device 9 composed of a conveyor as an input source, and uses this input as an input composed of a thermocouple connector. This is converted to the movement of the terminal 8a. The drive unit 7 is configured such that the transfer speed of the printed circuit board 6 by the transfer device 9 is the same as the moving speed of the input terminal 8a composed of a thermocouple connector.

In FIG. 2, reference numeral 10 denotes an apparatus main body 1.
The terminal 10 is disposed in a place where there is no thermal influence on the heating units such as the reheat units 2 and 3 and the reflow units 4 and 5 of the apparatus main body 1 and is spirally wound. The cord 10a, which can be extended by the above, receives an input from an input terminal 8a composed of a thermocouple connector.

Further, as shown in FIG.
Is equipped with an aluminum electrolytic capacitor 11 whose temperature profile is to be managed and a large QFP 12 which has a large heat capacity and hardly rises in temperature. These are fitted with thermocouples. Reference numeral 13 denotes a point at which the temperature is most likely to rise.
The thermocouple is attached to the surface of.

These thermocouples are connected to an output terminal 8b of a temperature sensor composed of a thermocouple connector.
The output terminal 8b can be connected to the input terminal 8a, and outputs an electromotive force at a place where a thermocouple is attached.

As shown in FIG. 4, a separating means 14 composed of a tapered plate is arranged at the discharge portion of the apparatus main body 1, and the connected input terminal 8a and output terminal 8b are output by the separating means 14. Pin 15 attached to terminal 8b
, So that it is completely separated when passing through the discharge section.

A controller 18 is provided as control means for supporting the start of the synchronous movement of the transporting device 9 and the drive unit 7. The controller 18 is connected to a data processing microcomputer 19, and is controlled by the microcomputer 19. The relationship between the position of the printed circuit board 6 in the main body 1 and the temperature is obtained as a temperature profile 20.

Note that, in FIG.
And a driving force transmitting device for transmitting driving force to the driving unit 7, and is constituted by a plurality of transmission gears (not shown) and the like.

The controller 18 is provided with an input terminal 8a
After the input terminal 8a is separated from the output terminal 8b, the drive unit 7 comprising the transfer means is controlled so that the input terminal 8a automatically returns from the discharge section of the apparatus main body 1 to the input section.

Next, the operation and operation of the reflow apparatus according to the first embodiment will be described with reference to FIG.

First, an input terminal 8 composed of a thermocouple connector
a and the output terminal 8b of the temperature sensor. next,
The printed circuit board 6 is set on the transfer device 9, and the controller 18 is instructed to start synchronous movement of the transfer device 9 and the drive unit 7.

After the start of the synchronous movement, while the printed circuit board 6 is passing through the inside of the apparatus main body 1, the signal from the output terminal 8 b of the temperature sensor and the signal from the transfer device 9 or the driving section 7 are used. The relationship between the position of the printed circuit board 6 and the temperature within the unit 1 is obtained as a temperature profile 20 by the data processing microcomputer 19.

In the final part of the transport device 9, the output terminal 8b on the printed circuit board side is connected to the input terminal on the device body side by the pin 15 of the output terminal 8b as the separating means 14 and the taper plate fixed to the device body 1. It is completely separated from the terminal 8a.

Next, the controller 1 is controlled by the sensor 16.
8 detects that the printed circuit board 6 has reached the discharge portion,
The driving force transmission device 17 is instructed to disconnect the driving unit 7.

Next, the controller 18 instructs the driving force transmission device 17 to reverse the driving unit 7, and returns the input terminal 8a composed of a thermocouple connector on the device main body side from the discharging unit to the input unit.

In the above description, the structure in which the sensor 16 detects that the printed circuit board 6 has reached the discharge section has been described. However, the controller 18 can grasp the position of the printed circuit board 6 to some extent from the transfer speed of the transfer device 9. It is also possible to use that information.

According to the reflow apparatus of the first embodiment, during the actual production, the production can be resumed immediately after setting the printed circuit board 6 and obtaining the temperature profile 20 described above.

FIG. 5 is a schematic perspective view showing the internal structure of the reflow device according to the second embodiment.

The reflow apparatus according to the second embodiment includes a board holding jig 21 as a moving means fixed to a thermocouple connector pedestal as means for holding the printed board 6. Is configured to hold the edge of the printed circuit board 6 in order to prevent the heat capacity and the flow of hot air from being hindered. Reference numeral 22 denotes a driving device of the transport device 9, and reference numeral 23 denotes a driving device that moves the driving unit 7, which is a transfer unit that transfers the input terminal 8 a and the output terminal 8 b formed of a thermocouple connector and the substrate holding jig 21.

Next, the operation and operation of the reflow apparatus according to the second embodiment will be described with reference to FIG.

First, an input terminal 8 composed of a thermocouple connector
is connected to the output terminal 8b of the temperature sensor, and the printed circuit board 6 is held on the board holding jig 21 under the same conditions as in the actual production. The above operations should be performed before the actual production. Next, during the actual production, the controller 18 makes the printed circuit board 6 to be produced according to the criterion shown in the flowchart of FIG.
Suspend the charging and start the temperature profile measurement. After the start, feeding of the printed circuit board 6 produced after a predetermined time has elapsed is restarted.

While the printed circuit board 6 held by the board holding jig 21 is passing through the inside of the apparatus main body 1, the signal from the output terminal 8 b of the temperature sensor and the signal from the transporting device 9 or the driving section 7 are used. The relationship between the position of the printed circuit board 6 and the temperature is obtained as a temperature profile 20 by the data processing microcomputer 19.

Next, the controller 18 detects from the sensor 16 that the printed circuit board 6 has reached the discharge section, and instructs the driving device 23 to stop.

After that, the controller 18 instructs the driving device 23 to rotate in the reverse direction, and the input terminal 8a composed of a thermocouple connector, the output terminal 8b of the temperature sensor, the substrate holding jig 2
1. Return the printed circuit board 6 from the discharge section to the input section.

Next, with respect to the temperature profile 20 acquired at the predetermined timing, the data processing microcomputer 1
9 verifies its validity.

As shown in FIG. 7, the normal temperature profile is managed by a lower limit profile 24 and an upper limit profile 25 as management criteria. If the measured temperature profile falls within the standard as indicated by 26, the main production is continued. However, when a temperature profile that is out of the reference, such as 27, is measured, a message indicating a profile abnormality is displayed on the monitor screen to notify the operator.

The operator receiving the instruction adjusts the heating temperature of the heating section so that the heating temperature becomes appropriate. still,
When an abnormality in the temperature profile occurs, a warning may be issued by warning means such as an alarm provided separately.

The description and warning means in FIGS. 6 and 7 described in the reflow apparatus of the second embodiment can be applied to the reflow apparatus of the first embodiment.

[0067]

As described above, according to the present invention,
The input terminal for inputting the temperature measurement information of the object to be heated, such as a printed circuit board on which electronic components are mounted, from the output terminal of the temperature sensor connected to the object to be heated is moved in synchronization with the transfer device by the transfer means. By comparing the temperature profile with the reference temperature profile and controlling to reduce the difference between these temperature profiles, it is possible to keep the inside of the apparatus main body at the heating temperature most suitable for the object to be heated. In this state, the object to be heated can be reflow-heated, so that the temperature profile in the main body of the device during the actual production operation can be accurately grasped, and the temperature profile measurement work can be simplified, improving the soldering quality. The operation rate can be improved.

Further, since the temperature calculating device is arranged in a place where the heating section has no thermal influence, the temperature calculating device is not heated by being exposed to the high temperature of the heating portion. There is no problem with the equipment.

[Brief description of the drawings]

FIG. 1 is a schematic sectional view showing the entire configuration of a reflow device of the present invention.

FIG. 2 is a schematic perspective view showing details of a main part of the reflow device of the first embodiment.

FIG. 3 is a schematic perspective view of a temperature measuring device of the reflow device of the first embodiment.

FIG. 4 is a schematic perspective view showing the internal structure of the reflow device of the first embodiment.

FIG. 5 is a schematic perspective view showing the internal structure of a reflow device according to a second embodiment.

FIG. 6 is a flowchart showing a temperature profile measurement timing.

FIG. 7 is a time chart showing a temperature profile management standard.

FIG. 8 is a schematic perspective view showing the appearance of a conventional reflow device.

FIG. 9 is a partial perspective view showing the internal structure of another conventional reflow apparatus.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Apparatus main body 2, 3 Preheating part (heating part) 4, 5 Reflow part (heating part) 6 Printed circuit board (heated object) 7 Drive part (transfer means) 8a Input terminal (thermocouple connector) 8b Output terminal (temperature sensor) 9) transfer device 10 terminal (temperature calculating device) 14 separating means 18 controller (control means) 20 temperature profile 21 substrate holding jig (moving means)

────────────────────────────────────────────────── ─── Continued on the front page (51) Int.Cl. ⁶ Identification code FI B23K 31/02 310 B23K 31/02 310F G01K 7/02 G01K 7/02 L (72) Inventor Koichi Nagai Kadoma, Kadoma, Osaka 1006 Matsushita Electric Industrial Co., Ltd.

Claims (11)

[Claims] In a reflow apparatus including a transport unit that transports an object to be heated such as a printed board on which electronic components are mounted, and a heating unit that heats the object to be heated, temperature measurement information of the object to be heated is transmitted. A temperature calculating device having an input terminal for inputting, a transfer means for moving the input terminal in synchronization with a transport speed of the object to be heated, and a transferable means connectable to the input terminal and connected to the object to be heated. A reflow device comprising: an output terminal of a temperature sensor; and wherein the temperature calculation device is arranged in a place where the heating section has no thermal influence. 2. After the input terminal and the output terminal are connected to each other at the input portion of the apparatus main body and the object to be heated is set on the transfer device, the movement of the two terminals is started in synchronization with the transfer device. 2. The reflow apparatus according to claim 1, further comprising control means for controlling said transfer means. 3. A discharge section of the apparatus main body for discharging an object to be heated from the apparatus main body, a separating means for separating the input terminal and the output terminal, and the input terminal after separating both terminals by the discharge section. The reflow apparatus according to claim 1 or 2, further comprising control means for controlling the transfer means so that the apparatus automatically returns from the discharge section of the apparatus body to the input section. 4. A control means for controlling the input of the object to be heated to which the input terminal and the output terminal are attached at an appropriate timing, and a storage means for storing a temperature profile of the object to be heated. Comparison means for comparing the temperature profile with a reference temperature profile, and comparing the temperature profile stored by the comparison means with the reference temperature profile, the difference between the stored temperature profile and the reference profile is determined in advance. 4. The reflow apparatus according to claim 3, further comprising a warning unit that issues a warning when the value exceeds a set value. 5. A control means for controlling a temperature profile of a newly-produced object to be heated so as to be automatically and repeatedly measured with respect to a reference temperature profile serving as a production condition. The reflow apparatus according to claim 4, further comprising control means for controlling the heating unit and the transport device so as to reduce a difference between the temperature profile and the reference temperature profile. 6. A reflow apparatus including a transport section for transporting an object to be heated such as a printed board on which electronic components are mounted, and a heating section for heating the object to be heated, wherein temperature measurement information of the object to be heated is transmitted. A temperature calculation device having an input terminal for inputting, and a sample of a heated object or an article having characteristics similar to the heated object to which an output terminal of a temperature sensor connectable to the input terminal is attached, in the same form as the transport state. A reflow device, comprising: moving means for holding and moving in synchronization with a transfer device together with the input terminal, wherein the temperature calculating device is disposed outside the heating section. 7. A reflow device according to claim 6, further comprising control means for controlling said moving means so that said input terminal automatically returns from said discharge portion of said apparatus main body to said input portion. apparatus. 8. A control means for controlling a sample of the object to be heated, to which the input terminal and the output terminal are attached, or an article having the same characteristics as the object to be heated so as to be supplied at an appropriate timing. Storage means for storing the temperature profile, a comparison means for comparing the stored temperature profile with a reference temperature profile, and comparing the temperature profile stored by the comparison means with the reference temperature profile. The reflow apparatus according to claim 7, further comprising a warning unit that issues a warning when a difference between the temperature profile and a reference profile exceeds a preset value. 9. A control means for controlling a temperature profile of a newly-produced object to be heated so as to be automatically and repeatedly measured with respect to a reference temperature profile as a production condition. 9. The reflow apparatus according to claim 8, further comprising control means for controlling the heating unit and the transfer device so as to reduce a difference between the temperature profile and the reference temperature profile. 10. An input terminal of a temperature calculation device can be transferred in synchronization with a transfer speed of transferring a heated object such as a printed board on which electronic components are mounted by a transfer device of a reflow device, and can be connected to the input terminal. Wherein the temperature of the object to be heated is measured at an output terminal of a temperature sensor connected to the object to be heated, and a temperature calculation device having the input terminal is placed in a place where the heating unit of the apparatus body is not affected by heat. A method for measuring a reflow temperature, comprising: 11. A reflow method for reflow heating solder of an object to be heated such as a printed circuit board on which an electronic component is mounted, wherein the temperature calculating device is synchronized with a transfer speed at which the object to be heated is transferred by a transfer device of a reflow device. Transfer the input terminal,
The temperature of the object to be heated can be measured at an output terminal of a temperature sensor that is connectable to the input terminal and is connected to the object to be heated. Placed in a place where there is no thermal influence, comparing the temperature profile of the temperature measurement information by the input terminal with a reference temperature profile, and controlling so as to reduce the difference between these temperature profiles, thereby controlling the object to be heated. Wherein the electronic component is reflowed.