JPS6472823A - Control method of injection molding device - Google Patents

Control method of injection molding device

Info

Publication number
JPS6472823A
JPS6472823A JP22841187A JP22841187A JPS6472823A JP S6472823 A JPS6472823 A JP S6472823A JP 22841187 A JP22841187 A JP 22841187A JP 22841187 A JP22841187 A JP 22841187A JP S6472823 A JPS6472823 A JP S6472823A
Authority
JP
Japan
Prior art keywords
temperature
resin
injection
process control
injection molding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP22841187A
Other languages
Japanese (ja)
Inventor
Katsuhiko Sakae
Makoto Koizumi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP22841187A priority Critical patent/JPS6472823A/en
Publication of JPS6472823A publication Critical patent/JPS6472823A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/76—Measuring, controlling or regulating

Abstract

PURPOSE:To prevent the occurrence of weld line due to the lowering of temperature of the tip of resin by controlling the temperature of the resin to be injection-molded in two stage processes. CONSTITUTION:An optimum injection process is preliminarily determined, and this is stored in a host computer 14, whereby its process control is carried out. Next, the temperature of resin is measured by the temperature season 8a-8c arranged on a mold, and the temperature signal to be used for control is switched in coincidence with the passing time of resin, and then the difference, between said measured temperature and the prescribed temperature preliminarily set, is caused to be small. Consequently, the injection speed is precisely regulated by a speed controller 16 through a process controller 10, thereby achieving the process control of the most suitable injection molding. By this two stage process control, the temperature of tip of resin is surely kept constant, and the forming of weld line is prevented.
JP22841187A 1987-09-14 1987-09-14 Control method of injection molding device Pending JPS6472823A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22841187A JPS6472823A (en) 1987-09-14 1987-09-14 Control method of injection molding device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22841187A JPS6472823A (en) 1987-09-14 1987-09-14 Control method of injection molding device

Publications (1)

Publication Number Publication Date
JPS6472823A true JPS6472823A (en) 1989-03-17

Family

ID=16876049

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22841187A Pending JPS6472823A (en) 1987-09-14 1987-09-14 Control method of injection molding device

Country Status (1)

Country Link
JP (1) JPS6472823A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000030832A1 (en) * 1998-11-24 2000-06-02 Daewoo Electronics Co., Ltd. Method for controlling temperature of mold for injection molding
WO2002081176A1 (en) * 2001-04-05 2002-10-17 Priamus System Technologies Ag Method for producing a moulded part in a mould
CN103042651A (en) * 2012-12-13 2013-04-17 江苏大学 Micro-injection moulding method based on laser plasticizing and impacting technology and apparatus

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000030832A1 (en) * 1998-11-24 2000-06-02 Daewoo Electronics Co., Ltd. Method for controlling temperature of mold for injection molding
WO2002081176A1 (en) * 2001-04-05 2002-10-17 Priamus System Technologies Ag Method for producing a moulded part in a mould
CN103042651A (en) * 2012-12-13 2013-04-17 江苏大学 Micro-injection moulding method based on laser plasticizing and impacting technology and apparatus

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