JPS55105336A - Die-bonding apparatus for semiconductor - Google Patents

Die-bonding apparatus for semiconductor

Info

Publication number
JPS55105336A
JPS55105336A JP1295179A JP1295179A JPS55105336A JP S55105336 A JPS55105336 A JP S55105336A JP 1295179 A JP1295179 A JP 1295179A JP 1295179 A JP1295179 A JP 1295179A JP S55105336 A JPS55105336 A JP S55105336A
Authority
JP
Japan
Prior art keywords
container
unit
temperature
die
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1295179A
Other languages
Japanese (ja)
Inventor
Tatsuo Sato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP1295179A priority Critical patent/JPS55105336A/en
Publication of JPS55105336A publication Critical patent/JPS55105336A/en
Pending legal-status Critical Current

Links

Landscapes

  • Die Bonding (AREA)

Abstract

PURPOSE: To reduce the bonding time by providing pre-heating unit which produces heat higher than a die-bonding temperature, a container-carrying unit, and a container-temperature sensing unit in addition to a semiconductor die-bonding apparatus, and by quickening the heating of the container.
CONSTITUTION: In addition to a semiconductor die-bonding apparatus; a heating unit 1 whose temperature is controlled by a heater, a semiconductor container 3 which is placed on said heating unit 1, and a container-carrying unit 2 which feeds the container 3 on the heating unit 1 and carries out it when the temperature has risen are provided. Furthermore, a temperature-sensing unit 4 which is connected to a indicator 5 is arranged with a specified distance provided over the container 3. At first, the container 3 is placed on the unit 1, and quickly heated to the temperature higher than the die-bonding temperature. Then, the fall of the temperature of the container 3 down to the die-bonding temperature is acknowledged by the unit 4, and it is carried to the die-bonding station by using the unit 2. In this way, the amount of processing in a unit time becomes large.
COPYRIGHT: (C)1980,JPO&Japio
JP1295179A 1979-02-07 1979-02-07 Die-bonding apparatus for semiconductor Pending JPS55105336A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1295179A JPS55105336A (en) 1979-02-07 1979-02-07 Die-bonding apparatus for semiconductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1295179A JPS55105336A (en) 1979-02-07 1979-02-07 Die-bonding apparatus for semiconductor

Publications (1)

Publication Number Publication Date
JPS55105336A true JPS55105336A (en) 1980-08-12

Family

ID=11819577

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1295179A Pending JPS55105336A (en) 1979-02-07 1979-02-07 Die-bonding apparatus for semiconductor

Country Status (1)

Country Link
JP (1) JPS55105336A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5768041A (en) * 1980-10-15 1982-04-26 Fujitsu Ltd Die bonding method
US6107606A (en) * 1998-01-05 2000-08-22 Texas Instruments Incorporated Method and apparatus for measuring temperatures during electronic package assembly

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5768041A (en) * 1980-10-15 1982-04-26 Fujitsu Ltd Die bonding method
JPH0133938B2 (en) * 1980-10-15 1989-07-17 Fujitsu Ltd
US6107606A (en) * 1998-01-05 2000-08-22 Texas Instruments Incorporated Method and apparatus for measuring temperatures during electronic package assembly

Similar Documents

Publication Publication Date Title
JPS52137734A (en) High frequency induction heating device
JPS52103734A (en) High-frequency heater
JPS55105336A (en) Die-bonding apparatus for semiconductor
JPS5427250A (en) Hot air heater
JPS52146042A (en) Electric heater for heating air
JPS51127742A (en) Temperature control device
JPS51124845A (en) High-frequency wave heating apparatus
JPS5389444A (en) Heating device
JPS5427251A (en) Hot air heater
JPS5425672A (en) Cooling unit for semiconductor device
JPS5432263A (en) Heating unit for wire bonding
JPS5350545A (en) High-frequency heater
JPS5362592A (en) Ultrasonic probe device
JPS5382572A (en) Heating type permanent wave device
JPS52106139A (en) High frequency heating device
JPS5512730A (en) Semiconductor device
JPS5345746A (en) High frequency heater
JPS52106140A (en) High frequency heating device
JPS53137444A (en) Thermal detecting system in induction heating apparatus
JPS526091A (en) Production method of semiconductor device
JPS5431662A (en) Electric kettle heat/insulation device
JPS52156443A (en) High frequency heater
JPS52111046A (en) High-frequency heater
JPS5337936A (en) High-frequency heater
JPS51133680A (en) Temperature control process for heater device