JPS5432263A - Heating unit for wire bonding - Google Patents

Heating unit for wire bonding

Info

Publication number
JPS5432263A
JPS5432263A JP9837877A JP9837877A JPS5432263A JP S5432263 A JPS5432263 A JP S5432263A JP 9837877 A JP9837877 A JP 9837877A JP 9837877 A JP9837877 A JP 9837877A JP S5432263 A JPS5432263 A JP S5432263A
Authority
JP
Japan
Prior art keywords
heating unit
wire bonding
heater
providing
reduce
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9837877A
Other languages
Japanese (ja)
Other versions
JPS5949693B2 (en
Inventor
Tatsuhiko Nagafuchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP52098378A priority Critical patent/JPS5949693B2/en
Publication of JPS5432263A publication Critical patent/JPS5432263A/en
Publication of JPS5949693B2 publication Critical patent/JPS5949693B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/787—Means for aligning
    • H01L2224/78703—Mechanical holding means
    • H01L2224/78704—Mechanical holding means in the lower part of the bonding apparatus, e.g. in the apparatus chuck
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE: To reduce the temperature rise time of the bonded material, by providing a heater to the guide means in addition to the heater placed on the heating means.
COPYRIGHT: (C)1979,JPO&Japio
JP52098378A 1977-08-17 1977-08-17 Heating device for wire bonding Expired JPS5949693B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP52098378A JPS5949693B2 (en) 1977-08-17 1977-08-17 Heating device for wire bonding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP52098378A JPS5949693B2 (en) 1977-08-17 1977-08-17 Heating device for wire bonding

Publications (2)

Publication Number Publication Date
JPS5432263A true JPS5432263A (en) 1979-03-09
JPS5949693B2 JPS5949693B2 (en) 1984-12-04

Family

ID=14218204

Family Applications (1)

Application Number Title Priority Date Filing Date
JP52098378A Expired JPS5949693B2 (en) 1977-08-17 1977-08-17 Heating device for wire bonding

Country Status (1)

Country Link
JP (1) JPS5949693B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57139933A (en) * 1981-02-23 1982-08-30 Nec Corp Assembling apparatus for semiconductor device
JPH0237731A (en) * 1988-07-27 1990-02-07 Toshiba Corp Wire bonding device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57139933A (en) * 1981-02-23 1982-08-30 Nec Corp Assembling apparatus for semiconductor device
JPH0237731A (en) * 1988-07-27 1990-02-07 Toshiba Corp Wire bonding device

Also Published As

Publication number Publication date
JPS5949693B2 (en) 1984-12-04

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